Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Home > Products > Discrete Semiconductor Products > Transistors > FETs, MOSFETs > FETs, MOSFETs

Vishay Siliconix IRFU310PBF

Name: IRFU310PBF
Brand: Vishay Siliconix
SKU: IRFU310PBF
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: IRFU310PBF

Manufacturer:: Vishay Siliconix

Category:: FETs, MOSFETs

Package:: TO-251-3 Short Leads, IPAK, TO-251AA

Datasheet:: IRFU310PBF.pdf

Description:: MOSFET N-CH 400V 1.7A TO251AA

Quantity:: RFQ Add To RFQ list

Payment:

Shipping:

Inventory:5,537

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Product details

Overview

IRFU310PBF from Vishay Siliconix is a 400 V, 1.7 A N-channel power MOSFET in IPAK (TO-251) through-hole package, featuring 3.6 Ω R_DS(on) at V_GS = 10 V, 12 nC total gate charge, and full repetitive avalanche rating. It serves as a ruggedized high-voltage switching device in offline AC-DC power supplies, LED drivers, and industrial motor controls.

For engineers reviewing the IRFU310PBF datasheet, IRFU310PBF pinout, IRFU310PBF application, or IRFU310PBF equivalent, key selection criteria include its 400 V V_DS, 1.7 A continuous drain current at T_C = 25 °C, 86 mJ single-pulse avalanche energy, TO-251 thermal performance (R_thJC = 5.0 °C/W), and dV/dt ruggedness of 4.0 V/ns.

Technical Context

This third-generation power MOSFET employs planar VDMOS technology optimized for high-voltage switching with fast turn-on/turn-off times (td(on) = 7.9 ns, tf = 11 ns) and low gate charge (Q_g = 12 nC, Q_gd = 6.5 nC). Its body diode supports unclamped inductive switching with t_rr = 240–540 ns and Q_rr = 0.85–1.6 μC.

The device is rated for repetitive avalanche operation (I_AR = 1.7 A, E_AR = 2.5 mJ) and features dynamic dV/dt immunity up to 4.0 V/ns-critical for noise-immune operation in flyback and forward converters where voltage transients occur across the drain-source terminals.

Key Specifications

Parameter	Value and Actual Design Meaning
V_DS	400 V - Withstands peak line voltages up to 340 V DC in universal-input offline SMPS without derating.
R_DS(on)	3.6 Ω @ V_GS = 10 V - Enables low conduction loss in 1–2 W primary-side switch applications.
I_D (continuous)	1.7 A @ T_C = 25 °C - Supports typical output power levels up to ~10 W in compact through-hole designs.
Q_g	12 nC - Reduces gate drive power and enables efficient operation with standard bipolar or CMOS drivers.
E_AS	86 mJ - Absorbs unclamped inductive energy during MOSFET turn-off in transformer-coupled topologies.
dV/dt rating	4.0 V/ns - Prevents spurious turn-on during high-slew-rate voltage transients in high-noise environments.
R_thJC	5.0 °C/W - Allows direct heatsinking via PCB copper pour or external clip for thermal management in space-constrained layouts.

Pinout & Package

IRFU310PBF uses the IPAK (TO-251) through-hole package with three leads: Gate (G), Drain (D), and Source (S). The drain tab is internally connected to lead 2 (Drain) and serves as the primary heat path; mounting requires mechanical fixation and thermal interface to PCB copper or heatsink.

Pin/Terminal	Circuit Role	Design Meaning
Lead 1 (G)	Gate terminal	Controls channel conduction; requires ≤ ±20 V drive; 100 nA leakage ensures low standby current.
Lead 2 (D)	Drain terminal / thermal pad	High-voltage switching node; electrically and thermally connected to exposed drain tab for heatsinking.
Lead 3 (S)	Source terminal	Power return path; referenced to gate drive ground; body diode anode connects here.

Key Features

Feature	Design Value
Repetitive avalanche rated	Withstands 1.7 A repetitive avalanche current and 2.5 mJ energy-enables robust operation in inductive load switching without external snubbers.
Dynamic dV/dt immunity	Rated for 4.0 V/ns - eliminates false triggering in high dv/dt environments like flyback transformer reset.
Fast switching	7.9 ns turn-on delay and 11 ns fall time - reduces switching losses in 50–100 kHz SMPS designs.
Through-hole IPAK (TO-251)	Enables high-reliability mechanical anchoring and superior thermal transfer vs. SMD alternatives in high-vibration or high-power-density applications.
Low Q_gd/Q_g ratio	6.5 nC / 12 nC = 0.54 - improves Miller immunity and hard-switching stability under varying load conditions.

Applications

Offline AC-DC Adapters	Industrial Motor Drives
Use Scenario: 5–12 W universal-input (85–265 V_AC) flyback converter powering IoT sensors or industrial controllers. IC Role / Device Role / Timing Role: Primary-side high-voltage switch controlling energy transfer via transformer; operates at 65–100 kHz with zero-voltage switching assistance. Use Value: 400 V V_DS and 86 mJ E_AS ensure reliable operation across full input range without overvoltage stress or avalanche failure.	Use Scenario: Low-power BLDC gate driver stage or solenoid control in factory automation equipment. IC Role / Device Role / Timing Role: High-side or half-bridge switch driving inductive loads up to 1.7 A; handles back-EMF during commutation. Use Value: Repetitive avalanche rating (I_AR = 1.7 A) and 4.0 V/ns dV/dt immunity prevent failure during inductive kickback events.
LED Constant-Current Drivers	UPS & Battery Backup Systems
Use Scenario: Isolated buck-boost LED driver for street lighting or emergency signage operating from 120/230 V_AC. IC Role / Device Role / Timing Role: Primary-side PWM switch regulating constant current to high-brightness LED strings via optocoupler feedback. Use Value: 3.6 Ω R_DS(on) minimizes conduction loss at 1.7 A, while 12 nC Q_g enables clean gate drive with minimal driver dissipation.	Use Scenario: Transfer switch or battery charging FET in 12 V/24 V line-interactive UPS handling surge currents during grid transition. IC Role / Device Role / Timing Role: Bidirectional power path switch managing AC-to-DC and battery-to-DC conversion; must survive repeated inrush and fault events. Use Value: Full avalanche rating and 150 °C max junction temperature support sustained operation under overload and thermal cycling.

Offline AC-DC Adapters

Industrial Motor Drives

Use Scenario: 5–12 W universal-input (85–265 V_AC) flyback converter powering IoT sensors or industrial controllers.

IC Role / Device Role / Timing Role: Primary-side high-voltage switch controlling energy transfer via transformer; operates at 65–100 kHz with zero-voltage switching assistance.

Use Value: 400 V V_DS and 86 mJ E_AS ensure reliable operation across full input range without overvoltage stress or avalanche failure.

Use Scenario: Low-power BLDC gate driver stage or solenoid control in factory automation equipment.

IC Role / Device Role / Timing Role: High-side or half-bridge switch driving inductive loads up to 1.7 A; handles back-EMF during commutation.

Use Value: Repetitive avalanche rating (I_AR = 1.7 A) and 4.0 V/ns dV/dt immunity prevent failure during inductive kickback events.

LED Constant-Current Drivers

UPS & Battery Backup Systems

Use Scenario: Isolated buck-boost LED driver for street lighting or emergency signage operating from 120/230 V_AC.

IC Role / Device Role / Timing Role: Primary-side PWM switch regulating constant current to high-brightness LED strings via optocoupler feedback.

Use Value: 3.6 Ω R_DS(on) minimizes conduction loss at 1.7 A, while 12 nC Q_g enables clean gate drive with minimal driver dissipation.

Use Scenario: Transfer switch or battery charging FET in 12 V/24 V line-interactive UPS handling surge currents during grid transition.

IC Role / Device Role / Timing Role: Bidirectional power path switch managing AC-to-DC and battery-to-DC conversion; must survive repeated inrush and fault events.

Use Value: Full avalanche rating and 150 °C max junction temperature support sustained operation under overload and thermal cycling.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-voltage N-channel MOSFET applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
IRFR310PbF	DPAK (TO-252) surface-mount package; identical electrical specs (400 V, 1.7 A, 3.6 Ω); R_thJC = 5.0 °C/W same, but R_thJA lower at 50 °C/W (PCB mount).	Suitable for automated SMT assembly; less mechanical robustness than through-hole in high-vibration environments.	Select IRFR310PbF when board space is constrained and reflow soldering is preferred; IRFU310PBF remains optimal for manual assembly or mechanical reliability-critical use.
STP3NK60ZFP	600 V V_DS, 2.6 A I_D, 3.3 Ω R_DS(on); SuperMESH™ technology; higher voltage margin but 16 nC Q_g increases gate drive demand.	Better suited for 400 V+ bus applications (e.g., PFC stages); not drop-in due to different pinout (TO-220FP) and higher capacitance.	Choose STP3NK60ZFP only when 600 V rating is required; IRFU310PBF offers better dV/dt immunity (4.0 vs. 2.5 V/ns) and lower Q_g for faster switching in 400 V systems.

Compared with IRFR310PbF, IRFU310PBF trades SMT compatibility for superior mechanical retention and thermal interface flexibility; versus STP3NK60ZFP, it delivers lower gate charge and higher dV/dt ruggedness at the cost of voltage headroom-making it the preferred choice for cost-sensitive, vibration-prone 400 V switching applications.

Availability

IRFU310PBF is available at Aetrix Electronics and suitable for offline AC-DC adapters, industrial motor drives, and LED constant-current drivers requiring stable component supply across long-lifecycle industrial programs.

Supply support for IRFU310PBF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Vishay Siliconix is a global leader in discrete semiconductors, specializing in power MOSFETs, diodes, and optoelectronics with emphasis on ruggedness, reliability, and high-voltage performance.

The IRFU/IRFR series targets cost-effective, high-reliability power switching in consumer, industrial, and lighting applications-designed specifically for robust operation in unregulated or noisy line-powered systems.

FAQ

What is the maximum continuous drain current for IRFU310PBF at 100 °C case temperature?

The IRFU310PBF supports 1.1 A continuous drain current at T_C = 100 °C, per its Absolute Maximum Ratings table. This derating reflects thermal limitations of the IPAK package under sustained high-temperature operation; design margins should account for PCB copper area, ambient airflow, and duty cycle to maintain safe junction temperatures below 150 °C. The IRFU310PBF's 5.0 °C/W junction-to-case thermal resistance enables effective heatsinking when mounted to adequate copper pour or external clips.

Does IRFU310PBF have avalanche capability, and how is it specified?

Yes, IRFU310PBF is fully repetitive avalanche rated: it supports 1.7 A repetitive avalanche current (I_AR) and 2.5 mJ repetitive avalanche energy (E_AR), with 86 mJ single-pulse avalanche energy (E_AS). These ratings are validated per JEDEC standards using unclamped inductive test conditions (V_DD = 50 V, L = 52 mH, R_g = 25 Ω). The IRFU310PBF's avalanche ruggedness eliminates need for external snubbers in flyback and forward converter topologies where inductive energy must be safely dissipated during MOSFET turn-off.

What is the gate threshold voltage range for IRFU310PBF, and how does it affect drive requirements?

The IRFU310PBF has a gate-source threshold voltage (V_GS(th)) range of 2.0 V to 4.0 V at T_J = 25 °C and I_D = 250 μA. This logic-level compatible range allows reliable turn-on with 5 V microcontroller outputs, though full enhancement (to achieve rated R_DS(on) = 3.6 Ω) requires V_GS ≥ 10 V. The IRFU310PBF's ±100 nA gate leakage ensures minimal static power draw, and its 12 nC total gate charge enables efficient switching with standard gate drivers without excessive power loss.

Can IRFU310PBF be used in place of IRFR310PbF, and what are the key mechanical differences?

IRFU310PBF and IRFR310PbF share identical electrical specifications (400 V V_DS, 1.7 A I_D, 3.6 Ω R_DS(on), 12 nC Q_g) but differ mechanically: IRFU310PBF uses IPAK (TO-251) through-hole packaging, while IRFR310PbF uses DPAK (TO-252) surface-mount packaging. The IRFU310PBF's straight leads provide superior mechanical retention and thermal interface flexibility in high-vibration or high-reliability applications, whereas IRFR310PbF suits automated SMT assembly. No PCB redesign is needed if replacing one with the other only in prototyping-but layout and thermal management must be re-evaluated.

What is the body diode reverse recovery performance of IRFU310PBF, and why does it matter?

The IRFU310PBF body diode exhibits t_rr = 240–540 ns and Q_rr = 0.85–1.6 μC at T_J = 25 °C, I_F = 2.0 A, and dI/dt = 100 A/μs. These parameters directly impact switching losses and EMI in hard-switched topologies: lower Q_rr reduces turn-on loss in synchronous rectification or freewheeling paths, while controlled t_rr minimizes voltage overshoot. The IRFU310PBF's body diode performance is optimized for use in flyback snubberless designs and inductive load switching where reverse recovery behavior affects system efficiency and reliability.

IRFU310PBF Specifications

Product attributes: Attribute value

Manufacturer:: Vishay Siliconix

Series:: -

Package/Case:: TO-251-3 Short Leads, IPAK, TO-251AA

Packaging:: Tube

Product Status:: Active

FET Type:: N-Channel

Technology:: MOSFET (Metal Oxide)

Drain to Source Voltage (Vdss):: 400 V

Current - Continuous Drain (Id) @ 25°C:: 1.7A (Tc)

Drive Voltage (Max Rds On, Min Rds On):: 10V

Rds On (Max) @ Id, Vgs:: 3.6Ohm @ 1A, 10V

Vgs(th) (Max) @ Id:: 4V @ 250µA

Gate Charge (Qg) (Max) @ Vgs:: 12 nC @ 10 V

Vgs (Max):: ±20V

Input Capacitance (Ciss) (Max) @ Vds:: 170 pF @ 25 V

FET Feature:: -

Power Dissipation (Max):: 2.5W (Ta), 25W (Tc)

Operating Temperature:: -55°C ~ 150°C (TJ)

Grade:: -

Qualification:: -

Mounting Type:: Through Hole

Supplier Device Package:: TO-251AA

IRFU310PBF FAQ

1.How can I place an order for IRFU310PBF through Aetrix?

Please submit a Request for Quotation (RFQ) for IRFU310PBF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for IRFU310PBF reliable?

The price and inventory of IRFU310PBF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRFU310PBF is usually 5 days.

3.What payment methods are accepted for IRFU310PBF?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IRFU310PBF transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for IRFU310PBF?

IRFU310PBF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your IRFU310PBF order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for IRFU310PBF?

For technical support, including IRFU310PBF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRFU310PBF requirements.

6.How does Aetrix verify that IRFU310PBF is sourced from the original manufacturer or authorized distributors?

All IRFU310PBF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRFU310PBF meets industry standards.

7.What is the process for return or replacement of IRFU310PBF?

All IRFU310PBF units undergo pre-shipment inspection (PSI). If there is an issue with IRFU310PBF, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The IRFU310PBF part is unused and in its original packaging.

Return procedure for IRFU310PBF:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

Tech Hub

2026-09-11 Comparator Circuit: Voltage Thresholds, Op-Amp Differences, LM393 and Practical Design

Comparator circuit design covering voltage thresholds, input limits, open-collector outputs, LM393 wiring, op-amp differences, hysteresis, timing, window detection and practical fault diagnosis.

2026-09-10 Schmitt Trigger Explained: Hysteresis, Circuits, Inverters and Applications

Schmitt triggers use separate rising and falling thresholds to stabilize slow or noisy signals. This guide covers hysteresis, 74HC14 and 74HCT14 selection, comparator calculations, RC oscillators and p…

2026-09-09 Counterfeit Electronic Components: How to Detect, Authenticate, and Test Suspect Parts

Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …

2026-09-08 Obsolete Electronic Components: How to Source and Evaluate Replacements

A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.

2026-09-07 TTL vs CMOS Logic Levels: 74HC and 74HCT Compatibility Explained

TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.

2026-09-04 Logic Level Shifter: How to Connect 3.3V and 5V Logic Safely

A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.

2026-09-03 74HC595 vs TPIC6B595: Output Drive, Pinout, Current, and Load Selection

The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…

2026-09-02 74HC595 Pinout, Timing, Output Current, and Applications

The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…

2026-09-01 Latch vs Flip-Flop: Timing, Differences and Design Choices

A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…

2026-08-30 D Latch Circuit: Truth Table, Timing, ICs and Applications

A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …