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Home > Products > Discrete Semiconductor Products > Transistors > FETs, MOSFETs > FETs, MOSFETs

Vishay Siliconix IRL3502L

Name: IRL3502L
Brand: Vishay Siliconix
SKU: IRL3502L
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: IRL3502L

Manufacturer:: Vishay Siliconix

Category:: FETs, MOSFETs

Package:: TO-262-3 Long Leads, I2PAK, TO-262AA

Datasheet:: IRL3502L.pdf

Description:: MOSFET N-CH 20V 110A TO262-3

Quantity:: RFQ Add To RFQ list

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Product details

Overview

IRL3502L from International Rectifier is a 20V N-channel HEXFET® Power MOSFET in TO-220AB package, optimized for 4.5V–7.0V gate drive, with R_DS(on) = 0.007Ω at V_GS = 7.0V and I_D = 64A, rated for 110A continuous drain current at T_C = 25°C, and designed specifically for CPU core DC-DC converters.

For engineers reviewing the IRL3502L datasheet, IRL3502L pinout, IRL3502L application, or IRL3502L equivalent, key selection criteria include low R_DS(on) at logic-level gate drive, avalanche ruggedness (E_AS = 390 mJ), fast switching (t_r = 140 ns), thermal performance (R_θJC = 0.89°C/W), and TO-220AB mechanical compatibility for high-current power stages.

Technical Context

This MOSFET employs advanced process technology and optimized gate oxide design to deliver minimal conduction loss and robust switching behavior under high di/dt conditions typical of synchronous buck converters. Its 20V V_(BR)DSS, ultra-low on-resistance, and fast body diode recovery (t_rr = 87 ns) support high-efficiency operation in tightly regulated, high-frequency CPU VRMs.

The device features intrinsic source/drain inductance (L_S = 7.5 nH, L_D = 4.5 nH), defined gate charge profile (Q_g = 110 nC), and stable threshold voltage (V_GS(th) = 0.70 V), enabling predictable turn-on/turn-off timing and reduced gate driver stress in multiphase topologies.

Key Specifications

Parameter	Value and Actual Design Meaning
V_(BR)DSS	20 V - Maximum blocking voltage before avalanche onset; sets upper limit for input rail in 12V-input CPU VRMs.
R_DS(on)	0.007 Ω @ V_GS = 7.0V, I_D = 64A - Enables <1W conduction loss at 110A, critical for thermal management in compact VRMs.
Q_g	110 nC - Determines gate driver power requirement and switching speed trade-off in 300–1000 kHz applications.
E_AS	390 mJ - Single-pulse avalanche energy rating ensures reliability during transient overvoltage events without external clamping.
t_r/t_f	140 ns / 130 ns - Fast edge rates minimize switching losses and EMI generation in high-frequency synchronous rectification.
R_θJC	0.89 °C/W - Low junction-to-case thermal resistance allows direct heatsink mounting for sustained 110A operation at T_C ≤ 25°C.
V_GS(th)	0.70 V - Low threshold enables reliable turn-on with 3.3V or 5V logic-level controllers without level-shifting.

Pinout & Package

IRL3502L uses the industry-standard TO-220AB package with isolated tab, rated for 140 W power dissipation at T_C = 25°C and linear derating of 1.1 W/°C above that temperature.

Pin/Terminal	Circuit Role	Design Meaning
1 – GATE	Control electrode	Accepts 4.5–7.0V logic-level drive; low Q_gs (27 nC) and Q_gd (39 nC) enable fast, low-loss switching.
2 – DRAIN	Main current output path	Connected to high-side switch node in buck converter; electrically tied to metal tab for thermal conduction.
3 – SOURCE	Reference terminal & current return	Common connection point for gate driver ground and power ground; internal source inductance (7.5 nH) affects high-speed ringing.
4 – DRAIN	Secondary drain connection	Parallel drain terminal to reduce package inductance and improve current sharing in high-current PCB layouts.

Key Features

Feature	Design Value
Logic-level gate drive compatibility	Operates fully enhanced at V_GS ≥ 4.5V, eliminating need for gate boosters in 5V/3.3V control systems.
Ultra-low R_DS(on)	0.007Ω at 7V drive reduces I²R losses by >40% vs. standard 20V MOSFETs, directly improving VRM efficiency at 100+ A loads.
Fast body diode recovery	t_rr = 87 ns and Q_rr = 200 nC minimize reverse recovery loss and cross-conduction risk in synchronous buck topologies.
Avalanche-rated construction	Rated for 390 mJ single-pulse avalanche energy, providing inherent robustness against inductive switching transients without snubbers.
Optimized for CPU VRMs	Die size and thermal design target high-current, low-voltage regulation where junction temperature stability and package thermal resistance are critical.

Applications

CPU Core Voltage Regulator	High-Current Synchronous Buck Converter
Use Scenario: Regulating 1.0–1.5V output at up to 150A for modern x86 and ARM processors in servers and workstations. IC Role / Device Role / Timing Role: High-side power switch in multiphase buck converter, switching at 300–600 kHz with precise duty-cycle control. Use Value: Low R_DS(on) and fast switching minimize conduction + switching losses, enabling >90% efficiency at full load while maintaining TJ < 125°C.	Use Scenario: Point-of-load (POL) conversion in telecom baseband cards requiring 3.3V/5V at 60–100A with tight transient response. IC Role / Device Role / Timing Role: Primary switching element in dual-phase interleaved buck stage, leveraging low Q_g for clean gate drive waveform integrity. Use Value: 110 nC total gate charge and 0.89°C/W R_θJC allow scalable phase count without thermal derating or gate driver oversizing.
Server Memory VRM	GPU Core Power Delivery
Use Scenario: Delivering 1.2V at 80A to DDR4/DDR5 memory subsystems with strict ripple and transient specifications. IC Role / Device Role / Timing Role: Low-side synchronous rectifier in buck converter, utilizing low V_SD (1.3V) body diode for freewheeling. Use Value: 1.3V forward voltage and 87 ns t_rr reduce freewheeling loss and improve light-load efficiency vs. Schottky alternatives.	Use Scenario: High-density GPU power rails (0.8–1.2V, 120A+) in AI accelerators and gaming graphics cards. IC Role / Device Role / Timing Role: High-current switch in 8-phase or higher VRM, mounted directly to copper heatsink via TO-220AB tab. Use Value: 140W power dissipation rating and 0.89°C/W thermal resistance support sustained high-current operation without forced airflow.

CPU Core Voltage Regulator

High-Current Synchronous Buck Converter

Use Scenario: Regulating 1.0–1.5V output at up to 150A for modern x86 and ARM processors in servers and workstations.

IC Role / Device Role / Timing Role: High-side power switch in multiphase buck converter, switching at 300–600 kHz with precise duty-cycle control.

Use Value: Low R_DS(on) and fast switching minimize conduction + switching losses, enabling >90% efficiency at full load while maintaining TJ < 125°C.

Use Scenario: Point-of-load (POL) conversion in telecom baseband cards requiring 3.3V/5V at 60–100A with tight transient response.

IC Role / Device Role / Timing Role: Primary switching element in dual-phase interleaved buck stage, leveraging low Q_g for clean gate drive waveform integrity.

Use Value: 110 nC total gate charge and 0.89°C/W R_θJC allow scalable phase count without thermal derating or gate driver oversizing.

Server Memory VRM

GPU Core Power Delivery

Use Scenario: Delivering 1.2V at 80A to DDR4/DDR5 memory subsystems with strict ripple and transient specifications.

IC Role / Device Role / Timing Role: Low-side synchronous rectifier in buck converter, utilizing low V_SD (1.3V) body diode for freewheeling.

Use Value: 1.3V forward voltage and 87 ns t_rr reduce freewheeling loss and improve light-load efficiency vs. Schottky alternatives.

Use Scenario: High-density GPU power rails (0.8–1.2V, 120A+) in AI accelerators and gaming graphics cards.

IC Role / Device Role / Timing Role: High-current switch in 8-phase or higher VRM, mounted directly to copper heatsink via TO-220AB tab.

Use Value: 140W power dissipation rating and 0.89°C/W thermal resistance support sustained high-current operation without forced airflow.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel logic-level power MOSFET applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
IRL3713PBF	R_DS(on) = 0.0045Ω @ 7V, lower Q_g (72 nC), but V_(BR)DSS = 30V and TO-220AB pinout differs (G-D-S vs. G-D-D-S).	Better efficiency at very high currents (>130A), but requires layout revision due to different pin assignment and higher voltage rating.	Select when lower R_DS(on) justifies redesign; not drop-in compatible with IRL3502L footprint.
SiR872DP-T1-GE3	R_DS(on) = 0.0052Ω @ 4.5V, PQFN 5x6 package, no isolated tab, R_θJA = 30°C/W (board-mounted).	Enables higher power density and better thermal performance on PCB, but requires requalification for solder thermal cycling and lacks TO-220 mechanical mounting.	Prefer for space-constrained designs where board-level thermal management replaces heatsinks; not mechanically interchangeable.

Compared with IRL3502L, IRL3713PBF offers lower conduction loss but demands PCB layout changes due to altered pinout and higher voltage rating, while SiR872DP-T1-GE3 delivers superior R_DS(on) and thermal metrics in surface-mount form but eliminates screw-mount heatsinking capability.

Availability

IRL3502L is available at Aetrix Electronics and suitable for CPU core VRMs, high-current POL converters, and GPU power delivery systems requiring stable component supply, long-term lifecycle support, and traceable sourcing for industrial and enterprise applications.

Supply support for IRL3502L includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

International Rectifier (now part of Infineon Technologies) is a pioneer in power semiconductor design, specializing in high-efficiency MOSFETs, IGBTs, and driver ICs for power conversion systems.

The IRL3502L belongs to the HEXFET® logic-level MOSFET product line, engineered specifically for CPU core DC-DC converters where low gate drive voltage, ultra-low R_DS(on), and avalanche ruggedness are mandatory.

FAQ

What is the maximum continuous drain current for IRL3502L at 100°C case temperature?

The IRL3502L supports 67A continuous drain current at T_C = 100°C, as specified in its Absolute Maximum Ratings table. This derating reflects thermal limits of the TO-220AB package and silicon die; operation above this current requires active cooling or reduced ambient temperature to maintain junction temperature below 150°C. The IRL3502L datasheet confirms this value under V_GS = 5.0V conditions.

Does IRL3502L support 3.3V gate drive in practical applications?

While the IRL3502L has a low V_GS(th) of 0.70V, its R_DS(on) is only guaranteed at V_GS ≥ 4.5V per datasheet test conditions. At 3.3V, R_DS(on) increases significantly (typically >0.012Ω), raising conduction loss and thermal stress. For reliable operation, the IRL3502L should be driven with ≥4.5V; use with 3.3V logic requires verification of worst-case R_DS(on) and thermal margin in the final design.

What is the avalanche energy rating of IRL3502L and how is it tested?

The IRL3502L is rated for 390 mJ single-pulse avalanche energy (E_AS) with starting junction temperature at 25°C, tested using L = 190 µH, R_G = 25 Ω, and I_AS = 64A per datasheet Note . This rating validates the device's ability to absorb inductive switching energy without failure, making the IRL3502L suitable for unclamped inductive loads in high-reliability CPU VRMs.

How does the TO-220AB package of IRL3502L differ from standard TO-220 in thermal performance?

The IRL3502L uses the TO-220AB variant, which features an isolated metal tab and standardized lead assignments (G-D-D-S). Its R_θJC is 0.89°C/W - identical to standard TO-220 - but the AB suffix denotes compliance with JEDEC outline standards for mechanical interchangeability and thermal interface consistency. Mounting torque is specified at 1.1 N·m, and the IRL3502L's thermal resistance remains valid only when mounted to a flat, greased heatsink per datasheet guidelines.

Can IRL3502L be used as a synchronous rectifier in a buck converter?

Yes, the IRL3502L is commonly deployed as a low-side synchronous rectifier due to its low R_DS(on), fast body diode (V_SD = 1.3V, t_rr = 87 ns), and logic-level gate drive. When used in this role, the IRL3502L replaces the freewheeling diode to reduce conduction loss and improve light-load efficiency. Gate timing must avoid shoot-through, and the IRL3502L's Q_rr (200 nC) must be accounted for in driver design.

IRL3502L Specifications

Product attributes: Attribute value

Manufacturer:: Vishay Siliconix

Series:: -

Package/Case:: TO-262-3 Long Leads, I2PAK, TO-262AA

Packaging:: Tube

Product Status:: Discontinued at Digi-Key

FET Type:: N-Channel

Technology:: MOSFET (Metal Oxide)

Drain to Source Voltage (Vdss):: 20 V

Current - Continuous Drain (Id) @ 25°C:: 110A (Tc)

Drive Voltage (Max Rds On, Min Rds On):: 4.5V, 7V

Rds On (Max) @ Id, Vgs:: 7mOhm @ 64A, 7V

Vgs(th) (Max) @ Id:: 700mV @ 250µA (Min)

Gate Charge (Qg) (Max) @ Vgs:: 110 nC @ 4.5 V

Vgs (Max):: ±10V

Input Capacitance (Ciss) (Max) @ Vds:: 4700 pF @ 15 V

FET Feature:: -

Power Dissipation (Max):: 140W (Tc)

Operating Temperature:: -55°C ~ 150°C (TJ)

Grade:: -

Qualification:: -

Mounting Type:: Through Hole

Supplier Device Package:: TO-262-3

IRL3502L FAQ

1.How can I place an order for IRL3502L through Aetrix?

Please submit a Request for Quotation (RFQ) for IRL3502L on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for IRL3502L reliable?

The price and inventory of IRL3502L are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRL3502L is usually 5 days.

3.What payment methods are accepted for IRL3502L?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IRL3502L transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for IRL3502L?

IRL3502L orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your IRL3502L order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for IRL3502L?

For technical support, including IRL3502L datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRL3502L requirements.

6.How does Aetrix verify that IRL3502L is sourced from the original manufacturer or authorized distributors?

All IRL3502L products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRL3502L meets industry standards.

7.What is the process for return or replacement of IRL3502L?

All IRL3502L units undergo pre-shipment inspection (PSI). If there is an issue with IRL3502L, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The IRL3502L part is unused and in its original packaging.

Return procedure for IRL3502L:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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