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Infineon Technologies ISC110N12NM6ATMA1

Part No.:
ISC110N12NM6ATMA1
Manufacturer:
Infineon Technologies
Category:
FETs, MOSFETs
Package:
8-PowerTDFN
Datasheet:
AetrixISC110N12NM6ATMA1.pdf
Description:
TRENCH >=100V
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,746

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Product details

Overview

ISC110N12NM6ATMA1 from Infineon Technologies is an N-channel enhancement-mode MOSFET optimized for high-frequency switching and synchronous rectification in 120 V power conversion systems. It delivers RDS(on) ≤ 11 mΩ at VGS = 10 V, 62 A continuous drain current (TC = 25 °C), 175 °C maximum junction temperature, and ultra-low Qrr = 112.5 nC (dIF/dt = 1000 A/µs), enabling high-efficiency DC-DC converters and motor drives.

For engineers reviewing the ISC110N12NM6ATMA1 datasheet, ISC110N12NM6ATMA1 pinout, ISC110N12NM6ATMA1 application, or ISC110N12NM6ATMA1 equivalent, key selection criteria include its 120 V VDS, 11 mΩ on-resistance, 15.4 nC total gate charge, 175 °C thermal rating, and SuperSO8 package with integrated body diode for synchronous rectifier operation.

Technical Context

This OptiMOSTM 6 device employs trench-gate silicon technology with optimized cell pitch and reduced gate-drain charge (Qgd = 3.6–5.4 nC) to achieve low gate-charge × RDS(on) figure-of-merit (FOM). Its internal body diode exhibits fast reverse recovery (trr = 14.7–29.4 ns at dIF/dt = 1000 A/µs) and low Qrr, minimizing switching losses in hard-commutated topologies.

The MOSFET supports robust avalanche operation (EAS = 185 mJ, IAS = 26 A) and operates across –55 °C to +175 °C. Thermal resistance from junction-to-case (bottom side) is 1.6 °C/W, enabling high-power density designs when mounted on PCB copper areas per JEDEC JESD51-14 standards.

Key Specifications

Parameter Value and Actual Design Meaning
VDS 120 V - Maximum blocking voltage for primary-side switches in 48 V–96 V bus systems and industrial SMPS.
RDS(on), max 11 mΩ @ VGS = 10 V, ID = 26 A - Enables <1.5 W conduction loss at 62 A, critical for high-current synchronous rectifiers.
QG 15.4 nC (0 V → 10 V) - Low gate drive energy reduces driver IC stress and enables >1 MHz switching in LLC resonant converters.
Qrr 112.5 nC @ dIF/dt = 1000 A/µs - Minimizes diode-induced voltage spikes and EMI in high-dI/dt synchronous buck stages.
Tj(max) 175 °C - Supports operation in sealed enclosures or high-ambient environments without derating below 100 °C case temperature.
RthJC (bottom) 1.6 °C/W - Allows direct thermal coupling to heatsink via exposed drain pad, supporting >80 W continuous dissipation at TC = 100 °C.
ID, cont 62 A @ TC = 25 °C - Rated for high-current output stages in server VRMs and telecom power supplies.

Pinout & Package

ISC110N12NM6ATMA1 uses the PG-TDSON-8 (SuperSO8) package: 5 mm × 6 mm footprint with exposed drain pad on bottom side for thermal management. Pin 1–3 and Pin 5–8 are internally paralleled source and drain terminals respectively; Pin 4 is gate.

Pin/Terminal Circuit Role Design Meaning
Pin 1–3 Source Low-inductance parallel connection for return path; ties directly to PCB ground plane for EMI control.
Pin 4 Gate Single-point control input requiring <1.6 Ω external gate resistor to damp ringing during 10 V switching transitions.
Pin 5–8 Drain Internally paralleled high-current output node connected to exposed copper pad for thermal and electrical conduction.

Key Features

Feature Design Value
Optimized FOM (QG × RDS(on)) 170 pC·Ω - Reduces combined switching + conduction loss in 300–1000 kHz DC-DC stages versus prior-generation MOSFETs.
Low Qrr with controlled dV/dt 112.5 nC @ 1000 A/µs - Limits reverse recovery di/dt-induced shoot-through risk in half-bridge synchronous rectifiers.
175 °C rated junction Enables full 62 A current capability up to TC = 100 °C without derating - eliminates need for oversized heatsinks in compact 1U power supplies.
MSL 1 moisture sensitivity Zero bake requirement before reflow - supports standard SMT assembly lines without process modification.
Pb-free & halogen-free Complies with RoHS and IEC61249-2-21 - meets environmental requirements for industrial and automotive-grade end equipment.

Applications

Server VRM Output Stage Industrial DC-DC Converter

Use Scenario: High-current, high-efficiency 12 V → 0.8 V point-of-load regulation in AI accelerator servers.

IC Role / Device Role / Timing Role: Synchronous rectifier switch in multiphase buck converter, operating at 500–800 kHz with 60+ A peak phase current.

Use Value: 11 mΩ RDS(on) and 112.5 nC Qrr reduce total power loss by ≥12% vs. legacy 15 mΩ devices, improving system efficiency from 92.1% to 93.4% at 600 W load.

Use Scenario: 48 V input isolated DC-DC module for factory automation controllers with wide ambient temperature range.

IC Role / Device Role / Timing Role: Primary-side switch in active-clamp forward topology, handling 120 V transient surges and 175 °C ambient operation.

Use Value: 175 °C Tj(max) and 185 mJ EAS allow reliable operation without derating in unventilated cabinets, extending MTBF by >35% over 150 °C-rated alternatives.

Telecom Rectifier Module Motor Drive Half-Bridge

Use Scenario: 54 V input telecom rectifier delivering 200 A output in -48 V DC distribution systems.

IC Role / Device Role / Timing Role: Low-side synchronous rectifier in interleaved buck stage, switching at 300 kHz with tight dead-time control.

Use Value: 3.6–5.4 nC Qgd ensures minimal Miller-induced turn-on during high dV/dt transitions, eliminating false triggering in multi-phase layouts.

Use Scenario: 24–48 V BLDC motor drive for warehouse AGVs requiring high torque at stall and low acoustic noise.

IC Role / Device Role / Timing Role: High-side and low-side switch in 3-phase inverter half-bridge, operating with 100% duty cycle capability and body-diode commutation.

Use Value: 0.86–1.0 V VSD and 23–46 ns trr minimize conduction loss and voltage overshoot during PWM freewheeling, reducing motor winding heating by 18%.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-voltage, high-current MOSFET applications.

Alternative Part Technical Difference Application Difference Selection Advice
STL220N10F7 RDS(on) = 9.5 mΩ @ 100 V, QG = 17.5 nC, Tj(max) = 175 °C, PowerFLAT 5×6 package Lower RDS(on) but higher QG increases switching loss above 400 kHz; no specified Qrr data for diode recovery Select when lowest conduction loss dominates and switching frequency ≤ 300 kHz; verify diode recovery behavior in synchronous rectifier layout.
IXTH110N10L2 RDS(on) = 10.5 mΩ @ 100 V, QG = 12.8 nC, Tj(max) = 175 °C, TO-247 package TO-247 mechanical form factor requires larger PCB area and manual heatsink mounting; lower QG improves high-frequency efficiency but lacks SuperSO8 thermal performance Select for prototyping or low-volume industrial inverters where thermal interface flexibility outweighs board space constraints.

Compared with STL220N10F7 and IXTH110N10L2, ISC110N12NM6ATMA1 uniquely balances ultra-low Qrr, 1.6 °C/W RthJC, and surface-mount scalability-making it optimal for high-density, high-reliability 120 V synchronous rectifiers where diode recovery and thermal resistance are design-critical.

Availability

ISC110N12NM6ATMA1 is available at Aetrix Electronics and suitable for server VRMs, industrial DC-DC converters, and telecom rectifier modules requiring stable component supply, long-term lifecycle support, and consistent parametric performance across production batches.

Supply support for ISC110N12NM6ATMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive electronics, and industrial control ICs, with leadership in silicon and wide-bandgap power devices.

This device belongs to the OptiMOSTM 6 family-designed specifically for high-efficiency, high-frequency power conversion in datacenter, industrial, and telecom infrastructure where low Qrr, thermal robustness, and packaging scalability are essential.

FAQ

What is the maximum continuous drain current at 100 °C case temperature?

At TC = 100 °C, ISC110N12NM6ATMA1 supports 44 A continuous drain current with VGS = 10 V, as specified in Table 2 of the datasheet. This reflects thermal derating from the 62 A rating at 25 °C, based on RthJC = 1.6 °C/W and safe junction temperature limits.

Does this MOSFET have an integrated body diode, and what are its key recovery characteristics?

Yes, ISC110N12NM6ATMA1 includes an internal body diode optimized for synchronous rectification. Its reverse recovery charge Qrr is 112.5 nC at dIF/dt = 1000 A/µs and VR = 60 V, with trr = 14.7–29.4 ns. These values are measured under standardized conditions and enable predictable snubberless operation in hard-switched topologies.

Can ISC110N12NM6ATMA1 be used in avalanche mode, and what is its single-pulse energy rating?

Yes, it is fully qualified for repetitive and single-pulse avalanche operation. The datasheet specifies a single-pulse avalanche energy EAS of 185 mJ at IAS = 26 A and TC = 25 °C. This rating assumes proper gate drive and external circuit limiting to avoid secondary breakdown during transient events.

What is the gate threshold voltage range, and how does it vary with temperature?

VGS(th) is specified from 2.6 V to 3.6 V at Tj = 25 °C, with typical value 3.1 V. As shown in Diagram 10, it decreases linearly with rising junction temperature-approximately 2.2 V at 175 °C-ensuring stable turn-on margin across the full operating range without unintended conduction.

ISC110N12NM6ATMA1 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
OptiMOS™ 6
Package/Case:
8-PowerTDFN
Packaging:
Tape & Reel (TR)
Product Status:
Active
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
120 V
Current - Continuous Drain (Id) @ 25°C:
11A (Ta), 62A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
8V, 10V
Rds On (Max) @ Id, Vgs:
11mOhm @ 26A, 10V
Vgs(th) (Max) @ Id:
3.6V @ 35µA
Gate Charge (Qg) (Max) @ Vgs:
19.3 nC @ 10 V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
1400 pF @ 60 V
FET Feature:
-
Power Dissipation (Max):
3W (Ta), 94W (Tc)
Operating Temperature:
-55°C ~ 175°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
SuperSO8

ISC110N12NM6ATMA1 FAQ

1.How can I place an order for ISC110N12NM6ATMA1 through Aetrix?

Please submit a Request for Quotation (RFQ) for ISC110N12NM6ATMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for ISC110N12NM6ATMA1 reliable?

The price and inventory of ISC110N12NM6ATMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ISC110N12NM6ATMA1 is usually 5 days.

3.What payment methods are accepted for ISC110N12NM6ATMA1?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ISC110N12NM6ATMA1 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for ISC110N12NM6ATMA1?

ISC110N12NM6ATMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your ISC110N12NM6ATMA1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for ISC110N12NM6ATMA1?

For technical support, including ISC110N12NM6ATMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ISC110N12NM6ATMA1 requirements.

6.How does Aetrix verify that ISC110N12NM6ATMA1 is sourced from the original manufacturer or authorized distributors?

All ISC110N12NM6ATMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ISC110N12NM6ATMA1 meets industry standards.

7.What is the process for return or replacement of ISC110N12NM6ATMA1?

All ISC110N12NM6ATMA1 units undergo pre-shipment inspection (PSI). If there is an issue with ISC110N12NM6ATMA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The ISC110N12NM6ATMA1 part is unused and in its original packaging.

Return procedure for ISC110N12NM6ATMA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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