Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

STMicroelectronics LIS2DU12TR

Part No.:
LIS2DU12TR
Manufacturer:
STMicroelectronics
Category:
Accelerometers
Package:
12-WFLGA
Datasheet:
AetrixLIS2DU12TR.pdf
Description:
ULTRALOW-POWER ACCELEROMETER WIT
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:5,734

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

LIS2DU12TR from STMicroelectronics is an ultralow-power 3-axis MEMS accelerometer with integrated motion detection engine, factory-calibrated sensitivity and zero-g offset, ±2g/±4g/±8g/±16g user-selectable full scale, 1.6 Hz–800 Hz output data rate, and embedded 128-level FIFO. It serves as the primary inertial sensing element in compact wearable and hearable devices requiring continuous motion awareness with sub-1 µA active power.

For engineers reviewing the LIS2DU12TR datasheet, LIS2DU12TR pinout, LIS2DU12TR application, or LIS2DU12TR equivalent, key selection criteria include its dual-supply architecture (Vdd/Vdd_IO), I²C/SPI/MIPI I3C® interface flexibility, interrupt-driven wake-up capability, and 0.47 µA ultralow-power mode at 1.6 Hz - critical for battery-constrained edge nodes.

Technical Context

The LIS2DU12TR integrates a capacitive MEMS sensing element with a low-noise charge amplifier and 12-bit ADC, coupled to a dedicated motion-detection hardware engine that independently executes free-fall, wake-up, tap/double-tap, activity/inactivity, and 6D/4D orientation without host CPU intervention. Its antialiasing filter operates in all modes with fixed 287 µg/√Hz noise density at ±8g/800 Hz.

It supports three operating modes: normal (6.1 µA, antialiasing enabled), ultralow-power (0.47 µA, reduced bandwidth), and one-shot (0.2 µA), with programmable thresholds and durations via registers WAKE_UP_THS (1Ch), INT_DUR (1Bh), and TAP_THS_X/Y/Z (18h–1Ah). The temperature sensor provides 12-bit output with 0.045 °C/LSB resolution and ±15 °C offset.

Key Specifications

ParameterValue and Actual Design Meaning
Supply Voltage1.62 V to 3.6 V core (Vdd); independent 1.62 V to Vdd+0.1 V I/O supply (Vdd_IO) enables mixed-voltage system interfacing
Power Consumption6.1 µA normal mode (800 Hz, antialiasing on); 0.47 µA ultralow-power mode (1.6 Hz); 20 nA power-down
Full Scale RangeUser-selectable ±2g/±4g/±8g/±16g - determines dynamic range and resolution (e.g., 0.976 mg/digit at ±2g)
Noise Density287 µg/√Hz at ±8g/800 Hz - defines minimum detectable acceleration change in high-bandwidth applications
Output Data Rate1.6 Hz to 800 Hz - sets temporal resolution for motion event capture and system responsiveness
FIFO Depth512 samples (acceleration + temperature, high-res) or 768 samples (acceleration only, low-res) - reduces host polling and extends sleep intervals
Interface SupportI²C (up to 1 MHz), SPI (up to 10 MHz), MIPI I3C® - ensures compatibility with modern microcontrollers and low-pin-count designs

Pinout & Package

Package: LGA-12, 2.0 mm × 2.0 mm × 0.74 mm (max), RoHS-compliant, 10000 g shock survivability.

Pin/TerminalCircuit RoleDesign Meaning
1 (SCL/SPC)I²C clock / SPI clockConfigurable serial timing input; no internal pull-up - requires external pull-up for I²C
2 (CS)Interface mode selectHigh = I²C/I3C enabled; Low = SPI enabled; internal pull-up defaults to I²C mode
3 (SDO/SA0)SPI output / I²C address LSBSA0 bit sets I²C slave address (0x18 or 0x19); internal pull-up allows default addressing
4 (SDA/SDI/SDO)I²C data / SPI input / 3-wire outputTri-state bidirectional I²C data line; SPI input in 4-wire mode; SDO in 3-wire mode
5 (NC)No connectionInternally unconnected; may be tied to Vdd, Vdd_IO, or GND per layout needs
6 & 8 (GND)Ground referenceDual ground pins reduce impedance and improve noise immunity in compact layouts
7 (RES)Reset controlMust be tied to GND for normal operation; not used as active reset input
9 (Vdd)Core supplyPowers MEMS sensor, analog front-end, and digital logic - decoupling required (100 nF + 10 µF)
10 (Vdd_IO)I/O supplyIndependent supply for digital interfaces - allows level-shifting and partial power-down of measurement chain
11 (INT2)Programmable interrupt 2Configurable for wake-up, free-fall, or single-data-conversion trigger; internal pull-down
12 (INT1)Programmable interrupt 1Primary interrupt output for tap, orientation, activity/inactivity; internal pull-down

Key Features

FeatureDesign Value
Dual independent supply railsVdd (core) and Vdd_IO (I/O) enable selective power gating - measurement chain can be disabled while preserving bus communication
Hardware motion engineDedicated logic for free-fall, wake-up, tap/double-tap, activity/inactivity, and 6D/4D orientation - offloads host MCU and eliminates software latency
Factory-trimmed calibrationSensitivity (So) and zero-g offset stored in nonvolatile memory and auto-loaded at power-on - eliminates field calibration overhead
Configurable interrupt latchingLIR and INT_SHORT_EN bits in INTERRUPT_CFG (17h) support level-mode or latched-mode interrupts - simplifies host interrupt handling and status clearing
Temperature-compensated sensingIntegrated 12-bit temperature sensor (0.045 °C/LSB) with ±15 °C offset - enables on-device thermal drift correction for precision applications

Applications

Wearable Motion TrackingTrue Wireless Stereo (TWS) Earbuds

Use Scenario: Continuous wrist motion monitoring in smartwatches for step counting, gesture recognition, and sleep stage analysis.

IC Role / Device Role / Timing Role: Primary 3-axis inertial sensor providing real-time acceleration data at 25–100 Hz with automatic activity/inactivity state transitions.

Use Value: 0.47 µA ultralow-power mode extends battery life beyond 7 days on coin-cell power while maintaining reliable wake-up response to arm movement.

Use Scenario: Tap and double-tap detection for play/pause, call answer, and earbud removal sensing in Bluetooth earbuds.

IC Role / Device Role / Timing Role: Embedded motion classifier executing tap recognition in hardware, driving INT1 to wake host SoC only on valid events.

Use Value: Eliminates constant host polling; reduces average system current by >80% compared to software-based tap detection.

Hearing Aid Orientation SensingAsset Tracker Tilt & Impact Detection

Use Scenario: Automatic earpiece orientation detection to switch between hearing aid modes (e.g., "in-ear" vs. "on-table") and suppress feedback.

IC Role / Device Role / Timing Role: 6D/4D orientation detector using thresholded axis alignment, with configurable debounce via WAKE_UP_DUR (1Dh).

Use Value: Sub-100 ms orientation transition time with <1 µA background current ensures seamless mode switching without perceptible delay.

Use Scenario: Tamper and drop detection in logistics trackers during shipment, triggering GPS wake-up and alert transmission.

IC Role / Device Role / Timing Role: Free-fall and high-g impact detector (10000 g survivability) with programmable duration and threshold in WAKE_UP_THS (1Ch).

Use Value: Confirmed 10000 g shock tolerance enables reliable operation after mechanical stress; 0.2 µA one-shot mode minimizes false triggers during transit vibration.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 3-axis ultralow-power accelerometer applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
BMI270Higher power (1.5 µA LP mode), integrated gyroscope, 20-bit FIFO, supports sensor fusion firmwareTargets higher-end wearables requiring orientation tracking with angular velocitySelect when fused IMU output or on-chip sensor fusion is required; avoid if cost or power budget is constrained
IIS2DLPCLower max ODR (400 Hz), no MIPI I3C®, 0.5 µA ULP mode, identical LGA-12 footprintDrop-in replacement for legacy designs where I3C is unused and 800 Hz bandwidth is unnecessaryChoose for pin-compatible upgrade with minimal firmware changes; retains same PCB layout and power profile

Compared with BMI270 and IIS2DLPC, the LIS2DU12TR delivers the lowest active current (0.47 µA) at full 800 Hz bandwidth and unique MIPI I3C® support - making it optimal for next-gen ultra-low-power, multi-interface edge nodes where power and protocol flexibility are decisive.

Availability

LIS2DU12TR is available at Aetrix Electronics and suitable for wearable devices, true wireless stereo earbuds, and asset tracking systems requiring stable component supply, guaranteed -40°C to +85°C operation, and RoHS-compliant packaging.

Supply support for LIS2DU12TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, sensors, power ICs, and analog components for industrial, automotive, and consumer markets.

The LIS2DU12TR belongs to ST's high-efficiency MEMS accelerometer product line, engineered specifically for battery-powered portable electronics demanding sub-microwatt motion sensing with embedded intelligence and multi-protocol digital interfaces.

FAQ

What is the function of the RES pin on the LIS2DU12TR?

The RES pin (Pin 7) must be externally tied to GND for normal device operation. It is not an active reset input - the LIS2DU12TR lacks a functional reset pin. Leaving RES floating or pulling it high may cause undefined behavior or failure to initialize. This design choice simplifies board layout by eliminating reset circuitry while ensuring deterministic startup.

Can Vdd and Vdd_IO be powered independently, and what happens if only Vdd_IO is supplied?

Yes - Vdd (core) and Vdd_IO (I/O) can be powered independently. If only Vdd_IO is applied (with Vdd = 0 V), the I²C/SPI/I3C interface remains functional for register access and configuration, but the MEMS sensor, ADC, and motion engine are powered down. This enables low-power bus monitoring and partial device control without consuming measurement current.

How does the LIS2DU12TR handle self-test, and is it usable in final assembly?

The LIS2DU12TR implements a capacitive self-test that applies an electrostatic force to the MEMS proof mass, generating a known acceleration signal (50–1200 mg depending on axis). It is fully functional post-soldering and validated in final application environments, requiring only a register write (CTRL_REG2[0] = 1) and reading OUT_X_L/H registers. No mechanical stimulus is needed, enabling automated production test and field diagnostics.

What are the absolute maximum ratings for supply voltage, and why do they matter for PCB design?

The absolute maximum supply voltage is -0.3 V to +4.3 V for both Vdd and Vdd_IO. Exceeding +4.3 V risks permanent damage due to gate oxide breakdown in the CMOS interface circuitry. This rating mandates strict adherence to decoupling (100 nF ceramic + 10 µF bulk capacitor near Pin 9) and prohibits direct connection to unregulated Li-ion batteries (>4.2 V). Layout must ensure no transient overshoot exceeds this limit during hot-plug or ESD events.

LIS2DU12TR Specifications

Product attributes
Attribute value
Manufacturer:
STMicroelectronics
Series:
-
Package/Case:
12-WFLGA
Packaging:
Tape & Reel (TR)
Product Status:
Active
Type:
Digital
Axis:
X, Y, Z
Acceleration Range:
±2g, 4g, 8g, 16g
Sensitivity (LSB/g):
1024 (±2g) ~ 128 (±16g)
Sensitivity (mV/g):
-
Bandwidth:
0.8Hz ~ 400Hz
Output Type:
-
Voltage - Supply:
-
Features:
-
Operating Temperature:
-40°C ~ 85°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
12-LGA (2x2)

LIS2DU12TR FAQ

1.How can I place an order for LIS2DU12TR through Aetrix?

Please submit a Request for Quotation (RFQ) for LIS2DU12TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for LIS2DU12TR reliable?

The price and inventory of LIS2DU12TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LIS2DU12TR is usually 5 days.

3.What payment methods are accepted for LIS2DU12TR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LIS2DU12TR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for LIS2DU12TR?

LIS2DU12TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your LIS2DU12TR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for LIS2DU12TR?

For technical support, including LIS2DU12TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LIS2DU12TR requirements.

6.How does Aetrix verify that LIS2DU12TR is sourced from the original manufacturer or authorized distributors?

All LIS2DU12TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LIS2DU12TR meets industry standards.

7.What is the process for return or replacement of LIS2DU12TR?

All LIS2DU12TR units undergo pre-shipment inspection (PSI). If there is an issue with LIS2DU12TR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The LIS2DU12TR part is unused and in its original packaging.

Return procedure for LIS2DU12TR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

LIS2DU12TR Tags

  • LIS2DU12TR
  • LIS2DU12TR PDF
  • LIS2DU12TR Datasheet
  • LIS2DU12TR Specifications
  • LIS2DU12TR Images
  • STMicroelectronics
  • STMicroelectronics LIS2DU12TR
  • Buy LIS2DU12TR
  • LIS2DU12TR Price
  • LIS2DU12TR Distributor
  • LIS2DU12TR Supplier
  • LIS2DU12TR Wholesale
Related Products
MXC4005XC
MXC4005XC

Memsic Inc.

MC3419
MC3419

Memsic Inc.

MC3479
MC3479

Memsic Inc.

MXC6655XA
MXC6655XA

Memsic Inc.

MC3630
MC3630

Memsic Inc.

LIS2HH12TR
LIS2HH12TR

STMicroelectronics

KX122-1037
KX122-1037

Kionix Inc.

LIS2DE12TR
LIS2DE12TR

STMicroelectronics

LIS2DH12TR
LIS2DH12TR

STMicroelectronics

MC3635
MC3635

Memsic Inc.

LIS2DS12TR
LIS2DS12TR

STMicroelectronics

LIS3DHTR
LIS3DHTR

STMicroelectronics

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER