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STMicroelectronics LIS3DSHTR

Part No.:
LIS3DSHTR
Manufacturer:
STMicroelectronics
Category:
Accelerometers
Package:
16-VFLGA
Datasheet:
AetrixLIS3DSHTR.pdf
Description:
ACCEL 2-16G I2C/SPI 16LGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,125

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Product details

Overview

LIS3DSHTR from STMicroelectronics is a MEMS digital-output three-axis accelerometer with programmable embedded state machines, ±2g to ±16g dynamically selectable full-scale range, 16-bit output resolution, I²C/SPI interface, and ultra-low-power operation (down to 3 μA in power-down mode). It serves as a motion-sensing engine in handheld user interfaces requiring autonomous pattern recognition and low-voltage battery operation.

For engineers reviewing the LIS3DSHTR datasheet, LIS3DSHTR pinout, LIS3DSHTR application, or LIS3DSHTR equivalent, this page delivers verified technical context on its embedded finite-state machine architecture, FIFO buffer management, self-test functionality, temperature-compensated offset calibration, and shock survivability up to 10,000 g - critical for pedometer, click/double-click, and impact logging designs.

Technical Context

The LIS3DSHTR implements a dual-state-machine architecture (SM1/SM2) enabling autonomous execution of motion-triggered algorithms without host processor intervention. Each state machine supports configurable timers, thresholds, and logical operators to detect complex sequences like double-tap or free-fall.

Its integrated 32-level FIFO reduces host polling overhead and supports four operating modes: bypass, FIFO, stream, and stream-to-FIFO. The device uses capacitive MEMS sensing elements with factory-trimmed sensitivity and zero-g offset, and includes an embedded temperature sensor for thermal drift compensation.

Key Specifications

Parameter Value and Actual Design Meaning
Supply Voltage 1.71 V to 3.6 V - supports direct connection to Li-ion battery rails and wide-input PMIC outputs.
IO Supply 1.8 V independent - enables seamless interfacing with 1.8 V logic domains while core operates at 3.3 V.
Full-Scale Range ±2g/±4g/±6g/±8g/±16g - software-selectable per axis to optimize dynamic range vs. resolution for specific motion profiles.
Output Data Rate 3.125 Hz to 1.6 kHz - allows trade-off between power consumption and temporal resolution in real-time motion analysis.
Interface I²C (up to 400 kHz) and SPI (up to 10 MHz) - dual-protocol support simplifies integration across microcontroller families.
FIFO Depth 32 samples - stores X/Y/Z triplets to reduce interrupt frequency and enable burst-read efficiency.
Shock Survivability 10,000 g - ensures functional integrity during drop events in portable consumer electronics.

Pinout & Package

LGA-16 package (3 mm × 3 mm × 1 mm), land grid array with exposed pad for thermal dissipation and mechanical stability.

Pin/Terminal Circuit Role Design Meaning
VDD Core supply input Connects to 1.71–3.6 V main power rail; decoupling capacitor required near pin.
VDD_IO IO supply input Supplies 1.8 V to digital interface pins; must be stable and isolated from noisy VDD domains.
GND Ground reference Common return path for analog and digital sections; connects to exposed thermal pad.
SCL/SPC I²C clock / SPI clock Multiplexed pin: SCL in I²C mode; SPC in SPI mode - requires pull-up only in I²C configuration.
SDA/SDI I²C data / SPI data in Multiplexed bidirectional pin: open-drain I²C data line; SPI serial data input in 4-wire mode.
SDO/SA0 SPI data out / I²C address LSB Configurable: SDO for SPI readback; SA0 sets I²C slave address (0x18 or 0x19) when pulled high/low.
CS SPI chip select Active-low enable for SPI communication; must be asserted before clock/data transitions.
INT1/DRDY Interrupt 1 / Data ready Programmable interrupt output or data-ready flag; driven active-low upon FIFO threshold or motion event.
INT2 Interrupt 2 Dedicated second interrupt output for independent event signaling (e.g., click + orientation change).

Key Features

Feature Design Value
Programmable State Machines Two independent finite-state machines (SM1/SM2) with 16 configurable states each, enabling autonomous detection of multi-event sequences (e.g., double-tap → orientation lock).
Embedded Temperature Sensor On-die sensor with ±5 °C accuracy over –40 °C to +85 °C - used for real-time offset/sensitivity compensation in thermal-varying environments.
Self-Test Functionality Electrostatic actuation test mode verifies MEMS element and signal chain integrity without mechanical stimulus - essential for field-reliability validation.
Configurable FIFO Modes Four operational modes (bypass, FIFO, stream, stream-to-FIFO) allow optimization of host bandwidth usage and latency requirements in continuous or event-driven sampling.
High Shock Survivability Rated for 10,000 g mechanical shock - maintains calibration and structural integrity after drop impacts typical in smartphones and wearables.

Applications

Smartphone Motion UI Gaming Controller

Use Scenario: Detecting tilt, shake, and gesture-based navigation in Android/iOS applications.

IC Role / Device Role / Timing Role: Primary motion-sensing node feeding real-time acceleration vectors to application processor via I²C at 200 Hz.

Use Value: Enables low-latency screen rotation and gesture response with <10 ms end-to-end delay due to embedded FIFO buffering and interrupt-driven wake-up.

Use Scenario: Translating physical controller movement into in-game character motion or camera control.

IC Role / Device Role / Timing Role: High-bandwidth motion capture engine delivering synchronized X/Y/Z samples at 1.6 kHz for sub-frame motion prediction.

Use Value: Reduces motion-to-render latency by offloading gesture decoding to on-chip state machines, freeing MCU cycles for game logic.

Wearable Pedometer Industrial Vibration Monitor

Use Scenario: Step counting and activity classification in fitness bands using algorithmic motion pattern analysis.

IC Role / Device Role / Timing Role: Autonomous step detector running firmware-defined state machine (SM1) to identify gait cycles without host polling.

Use Value: Achieves <2 μA average current in motion-triggered mode - extends battery life to >7 days on coin-cell power.

Use Scenario: Continuous monitoring of motor housing vibration signatures for predictive maintenance alerts.

IC Role / Device Role / Timing Role: Low-noise acceleration logger capturing 3-axis waveforms at 1 kHz with FIFO-triggered DMA transfers to MCU memory.

Use Value: Maintains ±0.01 g RMS noise floor across –40 °C to +85 °C via on-chip temperature compensation and factory-calibrated offset.

Equivalent & Alternatives

The following parts are listed as comparable options for similar three-axis MEMS accelerometer applications.

Alternative Part Technical Difference Application Difference Selection Advice
LSM6DSOXTR Integrated 6-axis IMU (3-axis accel + 3-axis gyro); higher power (150 μA @ 100 Hz); supports machine learning core (MLC). Required for angular motion fusion (e.g., VR headset tracking); not suitable for pure low-power accel-only use cases. Select when gyro data and AI-based motion classification are needed; avoid if cost, power, or footprint constraints favor single-function devices.
ADXL345BCCZ-RL7 Legacy 13-bit output; no embedded state machines; max ODR 3.2 kHz; lacks FIFO auto-mode switching and temperature sensor. Used in legacy industrial sensors where firmware handles all motion logic; insufficient for autonomous click/double-click detection. Choose only for drop-in replacement in existing ADXL345 designs; not recommended for new ultra-low-power or intelligent-sensing applications.

Compared with LSM6DSOXTR and ADXL345BCCZ-RL7, the LIS3DSHTR uniquely balances ultra-low-power operation (3 μA standby), autonomous state-machine processing, and robust shock tolerance - making it optimal for battery-constrained consumer motion interfaces where host MCU offload and reliability under mechanical stress are primary design drivers.

Availability

LIS3DSHTR is available at Aetrix Electronics and suitable for smartphone motion UI, wearable pedometers, gaming controllers, and industrial vibration monitors requiring stable component supply across extended temperature ranges (–40 °C to +85 °C) and long-lifecycle production.

Supply support for LIS3DSHTR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, specializing in MEMS sensors, microcontrollers, power management, and automotive ICs.

The LIS3DSHTR belongs to ST's "nano" family of ultra-low-power accelerometers, designed specifically for intelligent motion sensing in space- and energy-constrained portable electronics where autonomous pattern recognition and extended battery life are critical.

FAQ

What is the function of the two interrupt pins (INT1 and INT2) on the LIS3DSHTR?

INT1 and INT2 are independently configurable event-driven outputs. INT1 typically signals data-ready status or FIFO threshold breaches, while INT2 can be assigned to distinct motion patterns (e.g., click detection or orientation change) via register programming. Both support push-pull or open-drain drive modes and can wake a host MCU from sleep, enabling precise, low-power system-level event handling without continuous polling.

How does the embedded temperature sensor improve measurement accuracy?

The on-die temperature sensor provides real-time die temperature readings (±5 °C accuracy) used by host firmware to apply calibrated offset and sensitivity corrections stored in lookup tables. This compensates for thermal drift in zero-g bias and scale factor across –40 °C to +85 °C, maintaining ±0.02 g zero-g stability and <1% full-scale error variation over temperature - critical for precision pedometer and impact logging applications.

Can the LIS3DSHTR operate autonomously without a host microcontroller?

No - the LIS3DSHTR requires initial configuration via I²C or SPI to set full-scale range, output data rate, FIFO mode, and state-machine parameters. However, once configured, its dual embedded state machines execute pre-programmed motion algorithms (e.g., double-tap, free-fall) entirely autonomously, generating interrupts without further host involvement until results are read from registers or FIFO.

What is the significance of the "ECOPACK® RoHS and 'Green' compliant" designation?

This certification confirms the LIS3DSHTR meets EU RoHS Directive 2011/65/EU (lead-free, mercury-free, cadmium-free, etc.) and ST's ECOPACK® environmental standard, which exceeds RoHS by restricting additional substances (e.g., antimony, brominated flame retardants) and mandating halogen-free molding compounds. It ensures compliance for global consumer electronics markets and supports sustainable manufacturing and end-of-life recycling requirements.

LIS3DSHTR Specifications

Product attributes
Attribute value
Manufacturer:
STMicroelectronics
Series:
-
Package/Case:
16-VFLGA
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Type:
Digital
Axis:
X, Y, Z
Acceleration Range:
±2g, 4g, 6g, 8g, 16g
Sensitivity (LSB/g):
16666 (±2g) ~ 1369 (±16g)
Sensitivity (mV/g):
-
Bandwidth:
1.56Hz ~ 800Hz
Output Type:
I2C, SPI
Voltage - Supply:
1.71V ~ 3.6V
Features:
Adjustable Bandwidth, Selectable Scale, Temperature Sensor
Operating Temperature:
-40°C ~ 85°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
16-LGA (3x3)

LIS3DSHTR FAQ

1.How can I place an order for LIS3DSHTR through Aetrix?

Please submit a Request for Quotation (RFQ) for LIS3DSHTR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for LIS3DSHTR reliable?

The price and inventory of LIS3DSHTR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LIS3DSHTR is usually 5 days.

3.What payment methods are accepted for LIS3DSHTR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LIS3DSHTR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for LIS3DSHTR?

LIS3DSHTR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your LIS3DSHTR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for LIS3DSHTR?

For technical support, including LIS3DSHTR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LIS3DSHTR requirements.

6.How does Aetrix verify that LIS3DSHTR is sourced from the original manufacturer or authorized distributors?

All LIS3DSHTR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LIS3DSHTR meets industry standards.

7.What is the process for return or replacement of LIS3DSHTR?

All LIS3DSHTR units undergo pre-shipment inspection (PSI). If there is an issue with LIS3DSHTR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The LIS3DSHTR part is unused and in its original packaging.

Return procedure for LIS3DSHTR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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