Microchip Technology MAPLAD18KP170AE3

Overview

MAPLAD18KP170AE3 from Microsemi is a unidirectional surface-mount transient voltage suppressor (TVS) designed for high-energy surge protection in aerospace and automotive systems. It delivers 18,000 W peak pulse power at 10/1000 μs, features a 170 V reverse standoff voltage (VWM), clamps to ≤275 V at 66 A peak impulse current (IPP), and exhibits <100 ps response time. It is qualified to AEC-Q101 and meets RTCA DO-160 Section 22 multi-stroke lightning requirements.

For engineers reviewing the MAPLAD18KP170AE3 datasheet, MAPLAD18KP170AE3 pinout, MAPLAD18KP170AE3 application, or MAPLAD18KP170AE3 equivalent, key selection criteria include its 170 V VWM rating, 275 V max clamping voltage at 66 A, 0.7 °C/W junction-to-case thermal resistance, RoHS-compliant e3 plating, and qualification for aircraft secondary lightning protection per IEC 61000-4-5 with 42 Ω source impedance up to Class 5.

Technical Context

This TVS diode operates as a clamping device in parallel with sensitive circuitry, triggering into avalanche conduction when transient voltage exceeds its breakdown threshold (V(BR) = 189–209 V). Its low RθJC (0.7 °C/W) enables efficient heat transfer to the PCB copper pad or heatsink, supporting repeated surge events under ≤0.05% duty factor.

It is rated for bidirectional variants (suffix CA) but MAPLAD18KP170AE3 is unidirectional, with cathode on the metal base (package bottom). The device complies with ESD (IEC 61000-4-2), EFT (IEC 61000-4-4), and pin injection waveforms 4 and 5A per RTCA/DO-160F, with temperature derating guidance provided in MicroNote 132 and 134.

Key Specifications

Pinout & Package

MAPLAD18KP170AE3 uses a surface-mount PLAD package with a metal baseplate acting as the cathode terminal. The thermally optimized void-free epoxy case (UL94V-0) and tin-plated terminals support reflow soldering per MIL-STD-750 Method 2026. Recommended pad layout per RF01215 Rev B ensures optimal thermal dissipation and mechanical reliability.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar transient voltage suppression applications.

Compared with SP1003-0170 and SMAJ170A, MAPLAD18KP170AE3 uniquely combines 18 kW surge capacity, DO-160F/IEC 61000-4-5 compliance, and 0.7 °C/W thermal resistance - making it the sole option for aerospace-grade multi-stroke protection in compact SMT form.

Availability

MAPLAD18KP170AE3 is available at Aetrix Electronics and suitable for avionics power distribution, automotive load dump protection, and industrial motor drive DC bus applications requiring stable component supply across extended production lifecycles.

Supply support for MAPLAD18KP170AE3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Microsemi (now part of Microchip Technology) is a U.S.-based semiconductor company specializing in high-reliability analog, mixed-signal, and radiation-hardened ICs for aerospace, defense, and industrial markets.

The MAPLAD family was engineered specifically for high-power, surface-mount transient suppression in safety-critical platforms - emphasizing thermal efficiency, multi-stroke endurance, and regulatory compliance over cost-optimized consumer alternatives.

FAQ

What is the maximum clamping voltage of MAPLAD18KP170AE3 under standard 10/1000 μs surge conditions?

The maximum clamping voltage (VC) of MAPLAD18KP170AE3 is 275 V when subjected to its rated peak impulse current of 66 A under 10/1000 μs waveform conditions. This value is guaranteed across the full operating temperature range and forms the basis for downstream circuit voltage tolerance design. MAPLAD18KP170AE3 maintains this clamping performance even after repeated surges, provided thermal limits are observed per Figure 3 derating curve.

Does MAPLAD18KP170AE3 meet automotive qualification standards?

Yes, MAPLAD18KP170AE3 is tested and qualified to AEC-Q101 for discrete semiconductors, covering stress tests including HTGB, HTRB, and temperature cycling. While not explicitly certified to ISO 7637-2, its 18 kW surge rating, 170 V VWM, and 275 V clamping voltage enable robust compliance with Pulse 5a load dump requirements in 24 V systems when properly mounted on adequate copper area.

How is thermal management implemented for MAPLAD18KP170AE3 in high-repetition surge environments?

MAPLAD18KP170AE3 relies on its 0.7 °C/W junction-to-case thermal resistance and metal baseplate cathode to transfer heat directly to the PCB copper pour or external heatsink. For repetitive surges (≤0.05% duty factor), Microsemi specifies mounting on FR4 with the recommended pad layout in RF01215 Rev B. Steady-state power dissipation is limited to 2.5 W at 25°C ambient, and derating curves in Figure 3 must be applied above 100°C case temperature.

Is MAPLAD18KP170AE3 compatible with lead-free reflow soldering processes?

Yes, MAPLAD18KP170AE3 features RoHS-compliant e3 matte-tin plating and is rated for solder temperatures up to 260°C for 10 seconds, fully compatible with standard lead-free reflow profiles (e.g., JEDEC J-STD-020D). The void-free UL94V-0 epoxy body remains stable under these conditions, and no dry pack is required - moisture sensitivity level is IPC/JEDEC J-STD-020B Level 1.

What does the "E3" suffix signify in MAPLAD18KP170AE3?

Within the MPLAD nomenclature, the "E3" suffix in MAPLAD18KP170AE3 indicates RoHS-compliant matte-tin plating per JEDEC standard, distinguishing it from non-RoHS versions (blank suffix). It does not denote packaging format or screening level - those are indicated separately by "TR" (tape-and-reel) or reliability codes (M, MA, MX, MXL) per Microsemi's Hirel Non-Hermetic Product Portfolio.