Microchip Technology MAPLAD18KP180CAE3

Overview

MAPLAD18KP180CAE3 from Microsemi is a bidirectional surface-mount transient voltage suppressor (TVS) designed for high-energy surge protection in aerospace and automotive systems. It delivers 18,000 W peak pulse power at 10/1000 μs, features a 180 V reverse standoff voltage (VWM), clamps to ≤291 V at 100 A peak impulse current (IPP), and meets RTCA DO-160 Section 22 multi-stroke lightning requirements.

For engineers reviewing the MAPLAD18KP180CAE3 datasheet, MAPLAD18KP180CAE3 pinout, MAPLAD18KP180CAE3 application, or MAPLAD18KP180CAE3 equivalent, key selection criteria include its bidirectional polarity, 0.7 °C/W junction-to-case thermal resistance, IEC 61000-4-5 Class 4/5 secondary lightning compliance, and RoHS-compliant matte-tin plating per EIA-481-B tape-and-reel packaging.

Technical Context

This TVS diode uses an avalanche breakdown structure optimized for fast response (<5 ns clamping time) and low dynamic impedance under high-current transients. Its metal-base package enables direct thermal coupling to heatsinks, supporting sustained operation with junction temperatures up to +150 °C and thermal resistance of only 0.7 °C/W from junction to case.

The device is rated for bidirectional suppression across ±180 V standoff, with breakdown voltage V(BR) specified at 200–221 V and maximum clamping voltage VC of 291 V at IPP = 100 A (10/1000 μs). It complies with RTCA DO-160F Waveform 4 (Level 4) and Waveform 5A (Level 4) pin injection tests, and passes surge testing per AEC-Q101.

Key Specifications

Pinout & Package

MAPLAD18KP180CAE3 uses a surface-mount plastic package with metal base (cathode side) for thermal conduction. The device has two terminals: anode and cathode, with polarity marked by the metal base (cathode) on the bottom surface per Microsemi documentation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar transient voltage suppression applications.

Compared with SMBJ180CA and SMCJ180CA, MAPLAD18KP180CAE3 provides 30× higher peak pulse power, 2.3× lower thermal resistance, and formal DO-160F Waveform 4/5A certification-making it the only option for certified aerospace and high-reliability automotive load dump systems requiring multi-event survivability.

Availability

MAPLAD18KP180CAE3 is available at Aetrix Electronics and suitable for aerospace avionics, automotive ECU design, and industrial motor drive development requiring stable component supply, long-term lifecycle support, and full traceability.

Supply support for MAPLAD18KP180CAE3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Microsemi Corporation (now part of Microchip Technology) is a U.S.-based semiconductor company specializing in high-reliability analog, mixed-signal, and radiation-hardened ICs for aerospace, defense, and industrial markets.

The PLAD series was developed specifically for high-energy transient suppression in safety-critical platforms, emphasizing thermal robustness, multi-stroke endurance, and compliance with RTCA DO-160 and AEC-Q101 standards.

FAQ

What is the clamping voltage of MAPLAD18KP180CAE3 at its rated peak pulse current?

The MAPLAD18KP180CAE3 has a maximum clamping voltage (VC) of 291 V at 100 A peak impulse current (IPP) under 10/1000 μs waveform conditions. This value is guaranteed across temperature and ensures protected circuits remain below critical voltage thresholds during surge events. The clamping performance is validated per Figure 3 in RF01215 Rev B and applies directly to the MAPLAD18KP180CAE3 variant.

Does MAPLAD18KP180CAE3 meet AEC-Q101 qualification requirements?

Yes, MAPLAD18KP180CAE3 is tested in accordance with AEC-Q101 requirements for discrete semiconductors, including high-temperature operating life, temperature cycling, and surge testing. The device's qualification status is documented in RF01215 Rev B, which explicitly states "Tested in accordance with the requirements of AEC-Q101" for the MPLAD18KPxxCA family, including MAPLAD18KP180CAE3.

How does the metal base of MAPLAD18KP180CAE3 function electrically and thermally?

The metal base of MAPLAD18KP180CAE3 serves as the cathode terminal and primary thermal conduction path. Electrically, it forms the low-inductance return path for bidirectional surge current. Thermally, it provides a 0.7 °C/W junction-to-case resistance, enabling direct mounting to copper pour or heatsinks. Per Microsemi documentation, "The cathode is the metal base under the body of this device," confirming its dual electrical/thermal role in MAPLAD18KP180CAE3 implementation.

Is MAPLAD18KP180CAE3 compatible with lead-free reflow soldering processes?

Yes, MAPLAD18KP180CAE3 features RoHS-compliant annealed matte-tin plating (e3 suffix) and is rated for solder temperature up to 260 °C for 10 seconds, fully compliant with IPC/JEDEC J-STD-020B Level 1 moisture sensitivity. Its terminations meet MIL-STD-750 Method 2026 for solderability, ensuring reliable wetting and joint integrity in lead-free reflow profiles used in modern SMT assembly of MAPLAD18KP180CAE3.

What RTCA DO-160F test levels does MAPLAD18KP180CAE3 support?

MAPLAD18KP180CAE3 supports RTCA DO-160F Waveform 4 (6.4/69 μs) at Level 4 and Waveform 5A (40/120 μs) at Level 4, as confirmed in RF01215 Rev B. These ratings apply specifically to the 180 V standoff variants (MPLAD18KP180CA), and the "E3" suffix denotes RoHS-compliant finish without affecting DO-160F compliance. The device is also validated for multi-stroke lightning per Section 22.