Microchip Technology MAPLAD18KP26AE3

Overview

MAPLAD18KP26AE3 from Microsemi is a unidirectional surface-mount transient voltage suppressor (TVS) designed for high-energy surge protection in aerospace, automotive, and industrial power systems. It delivers 18,000 W peak pulse power at 10/1000 μs, clamps at ≤42.1 V under 500 A surge, and features a 26 V reverse standoff voltage (VWM), 28.9–31.9 V breakdown voltage (V(BR)), and 0.7 °C/W junction-to-case thermal resistance.

For engineers reviewing the MAPLAD18KP26AE3 datasheet, MAPLAD18KP26AE3 pinout, MAPLAD18KP26AE3 application, or MAPLAD18KP26AE3 equivalent, key selection criteria include its DO-160F Waveform 4 Level 4 compliance, IEC 61000-4-5 Class 1–5 secondary lightning protection capability, and RoHS-compliant e3 matte-tin plating suitable for high-reliability soldering per MIL-STD-750 Method 2026.

Technical Context

This TVS diode employs an avalanche breakdown mechanism to divert high-current transients away from sensitive circuitry. Its low RθJC (0.7 °C/W) enables effective heat transfer to a heatsink or PCB copper plane, supporting sustained multi-stroke operation under RTCA DO-160 Section 22 lightning stress.

It meets IEC 61000-4-2 ESD (±30 kV contact), IEC 61000-4-4 EFT (40 A), and IEC 61000-4-5 surge immunity (42 Ω, 12 Ω, and 2 Ω source impedances) - with verified clamping performance up to 42.1 V at IPP = 428 A and VWM = 26 V.

Key Specifications

Pinout & Package

MAPLAD18KP26AE3 uses a low-profile surface-mount package with metal base cathode termination. The device has two terminals: anode (top surface marking side) and cathode (exposed metal base). Mounting requires the recommended FR4 pad layout per RF01215 Rev B for optimal thermal and mechanical reliability.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar transient voltage suppression applications.

Compared with SMBJ26A and SMCJ26A, MAPLAD18KP26AE3 provides 30× higher peak pulse power, certified DO-160F Waveform 4 Level 4 immunity, and 0.7 °C/W thermal resistance - making it the sole option for aerospace-grade, multi-stroke lightning protection where thermal management and regulatory compliance are mandatory.

Availability

MAPLAD18KP26AE3 is available at Aetrix Electronics and suitable for aerospace avionics, automotive ECU power conditioning, and industrial motor drive DC link protection requiring stable component supply across extended production lifecycles.

Supply support for MAPLAD18KP26AE3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Microsemi Corporation (now part of Microchip Technology) designs high-reliability analog, mixed-signal, and power semiconductors for aerospace, defense, and industrial markets.

The MAPLAD18KP26AE3 belongs to Microsemi's PLAD family of high-power surface-mount TVS diodes, engineered specifically for DO-160F and IEC 61000-4-5 compliant surge protection in safety-critical platforms.

FAQ

What is the clamping voltage of MAPLAD18KP26AE3 at its rated peak pulse current?

The MAPLAD18KP26AE3 has a maximum clamping voltage (VC) of 42.1 V at its peak pulse current (IPP) of 428 A under 10/1000 μs waveform conditions. This value is measured per Figure 3 in RF01215 Rev B and defines the upper voltage limit imposed on protected circuitry during worst-case surge events. The low clamping ratio (VC/VWM ≈ 1.62) ensures robust protection margin for 24–28 V systems.

Is MAPLAD18KP26AE3 qualified for aerospace applications per DO-160?

Yes, MAPLAD18KP26AE3 is explicitly validated for RTCA DO-160F Section 22 lightning testing, including Waveform 4 (6.4/69 μs) Level 4 and Waveform 5A (40/120 μs) Level 4 up to 130 V variants. Its qualification is documented in RF01215 Rev B and supported by full lot traceability, surge testing, and thermal design optimized for aircraft power bus environments.

What is the thermal resistance and how should MAPLAD18KP26AE3 be mounted for optimal heat dissipation?

MAPLAD18KP26AE3 has a junction-to-case thermal resistance (RθJC) of 0.7 °C/W. For optimal heat dissipation, the metal cathode base must be soldered directly to a minimum 1 in² (6.45 cm²) 2 oz copper area with ≥6 thermal vias (0.3 mm diameter) to an internal ground plane. Mounting follows the pad layout in RF01215 Rev B to maintain both thermal performance and mechanical reliability under thermal cycling.

Does MAPLAD18KP26AE3 meet IEC 61000-4-5 surge immunity standards?

Yes, MAPLAD18KP26AE3 provides secondary lightning protection per IEC 61000-4-5 across multiple source impedances: Class 1–5 with 42 Ω, Class 1–4 with 12 Ω, and Class 2–3 with 2 Ω source impedance. These ratings are confirmed in RF01215 Rev B Table "Secondary lightning protection" and apply directly to the MAPLAD18KP26AE3 variant per its VWM = 26 V designation.

What does the 'E3' suffix indicate in MAPLAD18KP26AE3?

The 'E3' suffix in MAPLAD18KP26AE3 denotes RoHS-compliant matte-tin plating on the terminations, per IPC/JEDEC J-STD-020B Level 1 moisture sensitivity. This plating ensures solderability per MIL-STD-750 Method 2026 and eliminates lead content while maintaining thermal and mechanical performance equivalent to legacy tin-lead finishes.