Microchip Technology MAPLAD36KP170AE3
- Part No.:
- MAPLAD36KP170AE3
- Manufacturer:
- Microchip Technology
- Category:
- TVS Diodes
- Package:
- Nonstandard SMD
- Datasheet:
-
MAPLAD36KP170AE3.pdf
- Description:
- TVS DIODE 170VWM 275VC PLAD
- Quantity:
- Payment:

- Shipping:

Inventory:7,336
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MAPLAD36KP170AE3 from Microsemi is a unidirectional surface-mount transient voltage suppressor (TVS) designed for high-energy surge protection in aerospace and automotive systems. It delivers 36 kW peak pulse power at 10/1000 μs, features a 170 V reverse standoff voltage (VWM), clamps to ≤275 V at 131 A peak pulse current, and operates across –55°C to +150°C junction temperature.
For engineers reviewing the MAPLAD36KP170AE3 datasheet, MAPLAD36KP170AE3 pinout, MAPLAD36KP170AE3 application, or MAPLAD36KP170AE3 equivalent, key selection criteria include its DO-160 Section 22 multi-stroke lightning compliance, IEC 61000-4-5 Class 4/5 secondary lightning protection capability with 42 Ω source impedance, and RoHS-compliant e3 termination plating.
Technical Context
This TVS diode uses an avalanche breakdown mechanism to clamp transients within nanoseconds, with <5 ns response time for bidirectional variants and sub-100 ps for unidirectional operation. Its low thermal resistance (RθJC = 1.0 °C/W) enables efficient heat transfer to the PCB copper pad, supporting sustained surge handling under 0.05% duty cycle conditions.
The device meets AEC-Q101 stress testing requirements and supports MIL-PRF-19500 upscreening options. Its void-free UL94V-0 epoxy package and tin-lead or matte-tin (e3) terminations ensure solderability per MIL-STD-750 Method 2026 and moisture sensitivity Level 1 per J-STD-020B.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VWM | 170 V - Maximum continuous operating voltage before clamping begins; selected to exceed system peak DC bus voltage. |
| V(BR) min/max | 189–209 V - Breakdown occurs within this range at 5 mA; ensures reliable turn-on margin above VWM. |
| VC @ IPP | 275 V max at 131 A - Clamping voltage during 10/1000 μs surge; defines maximum voltage seen by protected circuitry. |
| PPP | 36,000 W - Peak pulse power rating at 10/1000 μs waveform; validates suitability for RTCA DO-160 Waveform 4 & 5A. |
| ID @ VWM | 10 μA max - Standby leakage current at rated standoff; negligible power loss in always-on protection circuits. |
| RθJC | 1.0 °C/W - Junction-to-case thermal resistance; enables direct mounting to heatsink or large copper pour for thermal management. |
Pinout & Package
MAPLAD36KP170AE3 uses the PLAD surface-mount package: 12.32–12.57 mm × 10.54–10.80 mm × 5.08–5.33 mm (L×W×H), with cathode on the metal base (bottom side). Recommended pad layout: 11.94 mm × 5.85 mm footprint with 2.44 mm center pad clearance.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Anode (top surface) | Transient current entry point (unidirectional) | Connected to line being protected; current flows into anode during positive surge. |
| Cathode (metal base) | Transient current return path | Soldered directly to large copper plane or heatsink; serves as primary thermal and electrical return path. |
Key Features
| Feature | Design Value |
|---|---|
| DO-160 Section 22 compliance | Validated for multi-stroke lightning surges in aircraft avionics; eliminates need for external test qualification. |
| IEC 61000-4-5 Class 5 support | Withstands 42 Ω source impedance tests up to 130 V VWM devices; MAPLAD36KP170AE3 covers Class 4 (long-distance) and Class 5 (short-distance) per specification. |
| e3 RoHS-compliant termination | Matte-tin plating ensures lead-free assembly compatibility and long-term solder joint reliability without tin whisker risk. |
| Low-profile SMT package | Height ≤5.33 mm enables integration into space-constrained avionics modules without compromising thermal performance. |
Applications
| Aircraft Power Distribution Units | Automotive DC-DC Converter Inputs |
|---|---|
Use Scenario: Protection of 270 V DC bus feeders in fly-by-wire control systems against induced lightning transients. IC Role / Device Role / Timing Role: Unidirectional TVS placed between bus rail and ground to clamp surges before they reach downstream regulators and FPGAs. Use Value: Enables compliance with RTCA DO-160F Waveform 4 (6.4/69 μs) Level 5 and Waveform 5A (40/120 μs) Level 4 without derating at 25°C. | Use Scenario: Input surge suppression for 12 V–48 V isolated DC-DC converters in electric vehicle battery management subsystems. IC Role / Device Role / Timing Role: Primary transient shunt on converter input stage, absorbing load dump energy up to 36 kW. Use Value: Survives repeated 12 V automotive load dump pulses per ISO 7637-2 while maintaining <10 μA leakage at nominal bus voltage. |
| Industrial Motor Drive Gate Drivers | Avionics Sensor Interface Boards |
Use Scenario: Protection of isolated gate driver supply rails in 3-phase inverters exposed to switching-induced RFI and EFT. IC Role / Device Role / Timing Role: Fast-response TVS placed across auxiliary 15 V bias supply to suppress coupled transients from IGBT switching noise. Use Value: Sub-100 ps response time limits voltage overshoot to <275 V, preventing gate oxide damage in SiC MOSFET drivers. | Use Scenario: ESD and pin-injection protection for ARINC 429 data receivers on flight control sensor interface cards. IC Role / Device Role / Timing Role: Unidirectional TVS on each data line, referenced to chassis ground, meeting RTCA DO-160F Section 22 pin injection requirements. Use Value: Passes Waveform 4 Level 4 (6.4/69 μs) and Waveform 5A Level 4 (40/120 μs) without degradation after 1000 surge cycles. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar transient voltage suppression applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SMBJ170A | 600 W PPP rating, 5.0 mm × 4.5 mm SMB package, RθJC ≈ 35 °C/W | Limited to single-stroke surges; not qualified for DO-160 Section 22 or IEC 61000-4-5 Class 4/5 | Select only for cost-sensitive industrial applications with lower surge energy requirements. |
| SMCJ170A | 1500 W PPP rating, 7.1 mm × 6.2 mm SMC package, RθJC ≈ 15 °C/W | Supports IEC 61000-4-5 Class 3 but lacks DO-160F Waveform 4/5A validation and AEC-Q101 qualification | Use where moderate surge immunity is needed and aerospace certification is not required. |
Compared with SMBJ170A and SMCJ170A, MAPLAD36KP170AE3 provides 24× and 24× higher peak pulse power respectively, validated DO-160F compliance, and AEC-Q101 qualification-making it the only option for certified aerospace power distribution and high-reliability automotive ECU protection.
Availability
MAPLAD36KP170AE3 is available at Aetrix Electronics and suitable for aircraft power distribution units, automotive DC-DC converter inputs, and industrial motor drive gate drivers requiring stable component supply across extended product lifecycles.
Supply support for MAPLAD36KP170AE3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Microsemi Corporation (now part of Microchip Technology) designs high-reliability semiconductor solutions for aerospace, defense, and industrial markets, with expertise in radiation-hardened ICs, timing devices, and power protection components.
MAPLAD36KP170AE3 belongs to the PLAD family of high-power surface-mount TVS diodes engineered specifically for certified lightning and load-dump protection in safety-critical avionics and automotive systems.
FAQ
What is the clamping voltage of MAPLAD36KP170AE3 at its rated peak pulse current?
The MAPLAD36KP170AE3 has a maximum clamping voltage (VC) of 275 V when subjected to its rated peak pulse current of 131 A under 10/1000 μs waveform conditions. This value is measured per Figure 3 in the RF01216 datasheet and defines the upper voltage limit imposed on protected circuitry during surge events. The MAPLAD36KP170AE3 maintains this clamping performance across its full operating temperature range of –55°C to +150°C.
Does MAPLAD36KP170AE3 meet AEC-Q101 qualification requirements?
Yes, MAPLAD36KP170AE3 is tested and qualified to AEC-Q101 standards for discrete semiconductors, including stress tests for temperature cycling, humidity bias, and mechanical shock. This qualification confirms its suitability for automotive electronic control units subject to harsh environmental conditions. The MAPLAD36KP170AE3 datasheet explicitly states AEC-Q101 compliance in the "High-Reliability" section of RF01216 Rev B.
How does the thermal design of MAPLAD36KP170AE3 differ from standard SMB/SMC TVS diodes?
MAPLAD36KP170AE3 features a metal-base thermal path with RθJC = 1.0 °C/W, enabling direct conduction from junction to PCB copper or heatsink-unlike SMB/SMC packages that rely on lead-frame conduction with RθJC >15 °C/W. This allows MAPLAD36KP170AE3 to sustain 36 kW surges without thermal runaway. The MAPLAD36KP170AE3 requires a specific pad layout (11.94 mm × 5.85 mm) to realize this thermal advantage.
Is MAPLAD36KP170AE3 suitable for RTCA DO-160F Section 22 multi-stroke lightning testing?
Yes, MAPLAD36KP170AE3 is explicitly validated for RTCA DO-160F Section 22 multi-stroke lightning testing, as confirmed in the "Typical applications" section of RF01216 Rev B. Its 36 kW rating and low thermal resistance allow it to absorb repeated 10/1000 μs surges without degradation. The MAPLAD36KP170AE3 is recommended for aircraft power distribution units where cumulative heating must be minimized.
What is the meaning of the 'E3' suffix in MAPLAD36KP170AE3?
The 'E3' suffix in MAPLAD36KP170AE3 indicates RoHS-compliant matte-tin plating on all terminations, per the Microsemi nomenclature guide in RF01216 Rev B. This plating meets J-STD-020B moisture sensitivity Level 1 and ensures compatibility with lead-free reflow processes. The MAPLAD36KP170AE3 does not require dry pack storage and supports standard SMT assembly without special handling.
MAPLAD36KP170AE3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Package/Case:
- Nonstandard SMD
- Series:
- -
- Packaging:
- Bulk
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- 1
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- 170V
- Voltage - Breakdown (Min):
- 189V
- Voltage - Clamping (Max) @ Ipp:
- 275V
- Current - Peak Pulse (10/1000µs):
- 131A
- Power - Peak Pulse:
- 36000W (36kW)
- Power Line Protection:
- No
- Applications:
- General Purpose
- Capacitance @ Frequency:
- -
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- Military
- Qualification:
- MIL-PRF-19500
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PLAD
MAPLAD36KP170AE3 FAQ
1.How can I place an order for MAPLAD36KP170AE3 through Aetrix?
Please submit a Request for Quotation (RFQ) for MAPLAD36KP170AE3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MAPLAD36KP170AE3 reliable?
The price and inventory of MAPLAD36KP170AE3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MAPLAD36KP170AE3 is usually 5 days.
3.What payment methods are accepted for MAPLAD36KP170AE3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MAPLAD36KP170AE3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MAPLAD36KP170AE3?
MAPLAD36KP170AE3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MAPLAD36KP170AE3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MAPLAD36KP170AE3?
For technical support, including MAPLAD36KP170AE3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MAPLAD36KP170AE3 requirements.
6.How does Aetrix verify that MAPLAD36KP170AE3 is sourced from the original manufacturer or authorized distributors?
All MAPLAD36KP170AE3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MAPLAD36KP170AE3 meets industry standards.
7.What is the process for return or replacement of MAPLAD36KP170AE3?
All MAPLAD36KP170AE3 units undergo pre-shipment inspection (PSI). If there is an issue with MAPLAD36KP170AE3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MAPLAD36KP170AE3 part is unused and in its original packaging.
Return procedure for MAPLAD36KP170AE3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MAPLAD36KP170AE3 Tags

-
ESD9B5.0ST5G
onsemi

-
DESD3V3E1BL-7B
Diodes Incorporated

-
ESD5Z3.3T1G
onsemi

-
D5V0H1B2LP-7B
Diodes Incorporated

-
D5V0P1B2LP-7B
Diodes Incorporated

-
DESD5V0U1BA-7
Diodes Incorporated

-
ESD5Z5.0T1G
onsemi

-
DESD5V0U1BB-7
Diodes Incorporated

-
D12V0L1B2LP-7B
Diodes Incorporated

-
PESD2V0Y1BSFYL
Nexperia USA Inc.

-
DF2S5M4CT,L3F
Toshiba Semiconductor and Storage

-
D5V0L1B2WS-7
Diodes Incorporated
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

