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Analog Devices Inc./Maxim Integrated MAX3202EETT+T
- Part No.:
- MAX3202EETT+T
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Category:
- TVS Diodes
- Package:
- 6-WDFN Exposed Pad
- Datasheet:
-
MAX3202EETT+T.pdf
- Description:
- TVS DIODE 6TDFN
- Quantity:
- Payment:
- Shipping:
Inventory:4,957
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Product details
Overview
MAX3202EETT+T from Maxim Integrated is a two-channel, low-capacitance ESD protection diode array designed for USB and USB 2.0 data lines. It delivers ±15kV HBM, ±8kV IEC 61000-4-2 contact, and ±15kV air-gap ESD protection with 5pF per channel capacitance, 1nA max leakage, and operation from +0.9V to +5.5V - enabling robust high-speed interface protection without signal integrity degradation.
For engineers reviewing the MAX3202EETT+T datasheet, MAX3202EETT+T pinout, MAX3202EETT+T application, or MAX3202EETT+T equivalent, key selection criteria include channel count (2), ultra-low input capacitance (5pF), IEC/ESD compliance level, supply voltage range (+0.9V to +5.5V), and TDFN-EP package thermal performance (θJA = 42°C/W).
Technical Context
The MAX3202EETT+T implements dual-channel bidirectional ESD clamping using integrated steering diodes that route transient current to VCC or GND. Its BiCMOS process enables low forward voltage (0.65V typ at 10mA) and tight leakage control (±1nA over 0°C–50°C), critical for battery-powered USB endpoints.
Clamp voltage is defined by diode forward drop plus supply rail offset: VC ≈ VCC + VF for positive transients and VC ≈ –VF for negative transients. Under ±15kV IEC air-gap discharge (45A pulse), peak clamp reaches VCC + 100V, requiring careful layout to minimize parasitic inductance on I/O, VCC, and GND paths.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| ESD Protection Level | ±15kV HBM, ±8kV IEC 61000-4-2 contact, ±15kV IEC air-gap - meets Level 4 immunity for industrial/commercial USB interfaces. |
| Channel Count | 2 independent ESD-protected I/O channels - matches standard USB D+/D– differential pair routing. |
| Input Capacitance | 5pF per channel at VCC/2 bias - preserves signal integrity up to 480Mbps (USB 2.0 full-speed). |
| Supply Voltage Range | +0.9V to +5.5V - supports single-supply operation across 1.8V, 3.3V, and 5V logic domains. |
| Leakage Current | ±1nA max per channel (0°C to +50°C) - prevents DC loading of sensitive receiver inputs. |
| Clamp Voltage (IEC Air-Gap) | VCC + 100V / –100V at 45A - defines worst-case transient overshoot at protected node under standardized test conditions. |
| Package Thermal Resistance | θJA = 42°C/W (TDFN-EP) - enables reliable operation at +85°C ambient with minimal derating. |
Pinout & Package
MAX3202EETT+T is housed in a 6-pin TDFN-EP package (3mm × 3mm, exposed pad), optimized for thermal dissipation and board space efficiency in portable USB designs.
| Pin | Circuit Role | Design Meaning |
|---|---|---|
| 1 | I/O1 | ESD-protected data line input/output - connects directly to USB D+ or D– trace. |
| 2 | I/O2 | ESD-protected data line input/output - pairs with Pin 1 for full USB differential interface protection. |
| 3 | GND | Ground reference for ESD current return path - must be low-inductance connection to system ground plane. |
| 4 | VCC | Power-supply input - requires local 0.1µF ceramic bypass capacitor to absorb ESD charge injection. |
| 5 | N.C. | No internal connection - left unconnected; no electrical function. |
| 6 | N.C. | No internal connection - left unconnected; no electrical function. |
| EP | Exposed Pad | Thermal and electrical ground - must be soldered to PCB ground plane for θJC = 9°C/W and ESD current shunting. |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low channel capacitance | 5pF enables USB 2.0 (480Mbps) signal integrity without rise-time degradation or jitter increase. |
| Bi-directional ESD clamping | Steering diode architecture protects against both positive and negative transients without polarity constraints. |
| Low leakage current | ±1nA max ensures minimal DC loading on high-impedance USB receiver inputs, preserving noise margin. |
| TDFN-EP thermal performance | θJA = 42°C/W and θJC = 9°C/W support sustained operation in thermally constrained handheld enclosures. |
| Wide supply voltage range | +0.9V to +5.5V allows direct integration into 1.8V microcontroller USB PHYs or legacy 5V host controllers. |
Applications
| USB 2.0 Peripheral Ports | Mobile Phone USB Connectors |
|---|---|
|
Use Scenario: Protecting D+/D– lines of USB 2.0 devices (keyboards, mice, flash drives) from user-hand ESD events during plug/unplug cycles. IC Role / Device Role / Timing Role: Two-channel bidirectional ESD clamp placed between connector and USB PHY, shunting transients to VCC/GND before reaching silicon. Use Value: Prevents latch-up or gate oxide damage in USB transceivers while maintaining <1ns response time and 480Mbps data rate compliance. |
Use Scenario: Shielding micro-USB or USB-C receptacles on smartphones and tablets from repeated ±15kV human-body ESD strikes. IC Role / Device Role / Timing Role: Primary front-end ESD protection device mounted adjacent to connector, handling >99% of transient energy before it reaches SoC USB controller. Use Value: Enables field-reliable hot-plug operation without sacrificing board area - 3mm × 3mm TDFN footprint fits tight mobile layouts. |
| Industrial USB Host Interfaces | Embedded USB OTG Controllers |
|
Use Scenario: Securing USB ports on programmable logic controllers (PLCs), HMIs, and medical equipment exposed to harsh ESD environments. IC Role / Device Role / Timing Role: Secondary protection stage downstream of connector-level TVS, providing precise low-capacitance clamping aligned with USB 2.0 eye diagram requirements. Use Value: Delivers certified ±15kV IEC 61000-4-2 Level 4 immunity without compromising signal fidelity or requiring complex layout tuning. |
Use Scenario: Enabling USB On-The-Go functionality in portable diagnostic tools and handheld scanners where host/peripheral role switching occurs. IC Role / Device Role / Timing Role: Dual-channel protector supporting bidirectional D+/D– signaling regardless of USB role (host or peripheral), with symmetric clamping behavior. Use Value: Eliminates need for separate protection schemes per role - single MAX3202EETT+T suffices for full OTG compliance. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPD2EUSB30DRTR | 2-channel, 0.8pF typical capacitance, ±12kV HBM, ±8kV IEC, 3.3V fixed VCC range. | Optimized for USB 3.0 SuperSpeed (5Gbps); lower capacitance but narrower supply range limits 5V system compatibility. | Select when designing for USB 3.0 backward-compatible ports and 3.3V-only power rails. |
| SP1001-02UTG | 2-channel, 0.6pF typical capacitance, ±15kV HBM, ±8kV IEC, no VCC pin (capacitor-coupled). | Passive architecture eliminates supply dependency but lacks VCC-clamping capability for high-energy transients. | Select for ultra-high-speed (>1Gbps) interfaces where sub-1pF capacitance is mandatory and VCC rail is unavailable or noisy. |
Compared with TPD2EUSB30DRTR and SP1001-02UTG, the MAX3202EETT+T uniquely balances wide supply range (+0.9V to +5.5V), certified ±15kV IEC air-gap performance, and 5pF capacitance - making it the preferred choice for cost-sensitive, multi-voltage USB 2.0 implementations requiring proven field reliability.
Availability
MAX3202EETT+T is available at Aetrix Electronics and suitable for USB 2.0 peripheral ports, mobile phone connectors, and industrial USB host interfaces requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant packaging.
Supply support for MAX3202EETT+T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Maxim Integrated (now part of Analog Devices) is a semiconductor company specializing in high-performance analog, mixed-signal, and power management ICs for industrial, communications, and consumer applications.
The MAX3202E series belongs to Maxim's ESD protection portfolio, engineered specifically for high-speed serial interfaces like USB 2.0, where low capacitance and repeatable ±15kV IEC immunity are non-negotiable design requirements.
FAQ
What is the maximum operating temperature for MAX3202EETT+T?
The MAX3202EETT+T is specified for continuous operation from –40°C to +85°C ambient temperature. Its TDFN-EP package achieves θJA = 42°C/W, allowing full-rated performance at +85°C with proper PCB copper pour on the exposed pad. Junction temperature must not exceed +150°C under any condition.
Does MAX3202EETT+T require an external bypass capacitor?
Yes - a 0.1µF low-ESR ceramic capacitor must be placed between the VCC and GND pins of MAX3202EETT+T, mounted as close as possible to the device. This capacitor absorbs ESD charge injected during contact discharge events and stabilizes the clamp reference during transient conduction.
Can MAX3202EETT+T be used for USB 3.0 applications?
No - MAX3202EETT+T is rated for USB 2.0 (480Mbps) due to its 5pF per-channel capacitance. USB 3.0 SuperSpeed (5Gbps) requires sub-1pF capacitance to avoid signal integrity loss; alternatives like TPD2EUSB30DRTR are recommended for those applications.
What is the meaning of "+T" in MAX3202EETT+T?
The "+T" suffix in MAX3202EETT+T indicates tape-and-reel packaging for automated SMT assembly. The "TT" denotes the 6-pin TDFN-EP package with exposed pad, and the "+" confirms RoHS-compliance and lead-free finish per JEDEC J-STD-609.
How does MAX3202EETT+T handle negative ESD transients?
During negative ESD events, MAX3202EETT+T clamps the I/O line to approximately –VF (forward voltage of the grounded diode), typically –0.65V to –0.95V. This prevents the protected node from dropping below –1V, safeguarding CMOS input stages from reverse-bias damage or latch-up.
MAX3202EETT+T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Package/Case:
- 6-WDFN Exposed Pad
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Steering (Rail to Rail)
- Unidirectional Channels:
- 2
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- -
- Voltage - Breakdown (Min):
- -
- Voltage - Clamping (Max) @ Ipp:
- -
- Current - Peak Pulse (10/1000µs):
- -
- Power - Peak Pulse:
- -
- Power Line Protection:
- No
- Applications:
- General Purpose
- Capacitance @ Frequency:
- -
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 6-TDFN (3x3)
MAX3202EETT+T FAQ
1.How can I place an order for MAX3202EETT+T through Aetrix?
Please submit a Request for Quotation (RFQ) for MAX3202EETT+T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MAX3202EETT+T reliable?
The price and inventory of MAX3202EETT+T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MAX3202EETT+T is usually 5 days.
3.What payment methods are accepted for MAX3202EETT+T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MAX3202EETT+T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MAX3202EETT+T?
MAX3202EETT+T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MAX3202EETT+T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MAX3202EETT+T?
For technical support, including MAX3202EETT+T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MAX3202EETT+T requirements.
6.How does Aetrix verify that MAX3202EETT+T is sourced from the original manufacturer or authorized distributors?
All MAX3202EETT+T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MAX3202EETT+T meets industry standards.
7.What is the process for return or replacement of MAX3202EETT+T?
All MAX3202EETT+T units undergo pre-shipment inspection (PSI). If there is an issue with MAX3202EETT+T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MAX3202EETT+T part is unused and in its original packaging.
Return procedure for MAX3202EETT+T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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