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Analog Devices Inc./Maxim Integrated MAX3202EETT-T
- Part No.:
- MAX3202EETT-T
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Category:
- TVS Diodes
- Package:
- 6-WDFN Exposed Pad
- Datasheet:
-
MAX3202EETT-T.pdf
- Description:
- TVS DIODE 100VC 6TDFN
- Quantity:
- Payment:
- Shipping:
Inventory:6,018
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Product details
Overview
The MAX3202EETT-T from Maxim Integrated is a 2-channel, low-capacitance ESD protection diode array designed for USB and USB 2.0 data lines. It delivers ±15kV HBM, ±8kV IEC 61000-4-2 contact discharge, and ±15kV air-gap discharge protection with 5pF per channel input capacitance, 1nA max leakage current, and operation across +0.9V to +5.5V supply range - enabling robust high-speed interface protection in space-constrained portable designs.
For engineers reviewing the MAX3202EETT-T datasheet, MAX3202EETT-T pinout, MAX3202EETT-T application, or MAX3202EETT-T equivalent, this device is selected for USB 2.0 port hardening where sub-5pF loading, ultra-low leakage, and compact 6-pin TDFN-EP packaging are critical to signal integrity and board real estate constraints.
Technical Context
The MAX3202EETT-T implements dual-channel bidirectional ESD clamping using integrated steering diodes that route transient current to VCC or GND depending on polarity. Its clamp voltage is defined by forward diode drop (VF ≈ 0.65–0.95V) plus supply rail voltage for positive transients (VC = VCC + VF), and –VF for negative transients - resulting in ±25V clamping under HBM and up to ±100V under IEC 61000-4-2 air-gap discharge at 45A peak.
It operates within -40°C to +85°C and requires a 0.1µF ceramic bypass capacitor between VCC and GND to absorb ESD charge and stabilize clamping behavior. The exposed pad (EP) must be connected to GND to ensure thermal performance (θJA = 42°C/W) and optimal ESD current shunting path integrity.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| ESD Protection Level | ±15kV HBM, ±8kV IEC contact, ±15kV IEC air-gap - meets Level 4 IEC 61000-4-2 for end-equipment compliance. |
| Channel Count | 2 independent ESD-protected I/O channels - matches standard USB 2.0 D+/D− differential pair count. |
| Input Capacitance | 5pF per channel at VCC/2 bias - preserves signal integrity on 480Mbps USB 2.0 data lines without measurable rise-time degradation. |
| Leakage Current | ≤1nA per channel at 0°C to +50°C - prevents DC loading of sensitive PHY inputs and minimizes standby power impact. |
| Supply Voltage Range | +0.9V to +5.5V - supports direct integration with 1.8V, 3.3V, and 5V USB PHYs without level-shifting. |
| Clamp Voltage (HBM) | ±25V peak (VCC + 25V / –25V) - limits stress on downstream transceivers during ±15kV human-body discharges. |
| Package Thermal Resistance | θJA = 42°C/W (6-pin TDFN-EP) - enables reliable operation at full rated ESD pulse energy without thermal derating in typical PCB layouts. |
Pinout & Package
MAX3202EETT-T uses a 6-pin TDFN-EP package (3mm × 3mm, 0.75mm height) with exposed thermal pad. Pin 1 is I/O1, Pin 2 is I/O2, Pin 3 is GND, Pin 4 is VCC, Pin 5 is NC, Pin 6 is NC. The EP must be soldered to a GND plane for thermal and ESD return-path integrity.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | I/O1 | ESD-protected data line input/output - connects directly to USB 2.0 D+ or D− trace before connector. |
| 2 | I/O2 | ESD-protected data line input/output - pairs with Pin 1 for full differential USB 2.0 interface protection. |
| 3 | GND | Primary ESD current return path - must be low-inductance connection to system ground plane. |
| 4 | VCC | Power-supply rail for positive-transient clamping - bypassed with 0.1µF ceramic capacitor placed <1mm from pin. |
| 5, 6 | N.C. | No internal connection - left floating or tied to GND per layout best practice; no electrical function. |
| EP | Exposed Pad | Thermal and ESD ground reference - must be soldered to solid GND copper area for θJC = 9°C/W performance. |
Key Features
| Feature | Design Value |
|---|---|
| ±15kV ESD rating (HBM & IEC air-gap) | Enables single-device compliance with IEC 61000-4-2 Level 4 for consumer and industrial USB ports. |
| 5pF channel capacitance | Maintains USB 2.0 eye diagram margin by limiting high-frequency insertion loss and group delay variation. |
| 1nA max leakage current | Prevents false signaling or bias shift in low-power USB suspend/resume states and PHY receiver thresholds. |
| +0.9V to +5.5V supply range | Supports direct integration with legacy 5V, mainstream 3.3V, and emerging 1.8V USB PHY ICs without external regulators. |
| TDFN-EP thermal design | 42°C/W θJA and 9°C/W θJC enable sustained ESD pulse handling without thermal shutdown in compact handheld PCBs. |
Applications
| USB 2.0 Host Port Protection | USB 2.0 Device Port Protection |
|---|---|
|
Use Scenario: Protecting upstream-facing USB 2.0 ports on laptops, docking stations, or industrial controllers from user-handling ESD events. IC Role / Device Role / Timing Role: Dual-channel bidirectional ESD clamp placed between USB connector and PHY IC, routing transients to local VCC/GND rails. Use Value: Prevents latch-up or permanent damage to USB transceivers during ±15kV HBM contact, preserving data link reliability over product lifetime. |
Use Scenario: Hardening downstream-facing USB 2.0 ports on peripherals such as printers, scanners, or medical sensors. IC Role / Device Role / Timing Role: Front-end ESD guard for D+/D− lines, operating transparently during 480Mbps data transmission with no timing skew or signal distortion. Use Value: Enables certified IEC 61000-4-2 Level 4 compliance without adding series impedance or degrading eye opening at 2.4GHz fundamental frequency. |
| Mobile Phone USB Interface | Embedded USB OTG Controller |
|
Use Scenario: Securing micro-AB or USB-C receptacles on smartphones and tablets against repeated plug/unplug ESD stress. IC Role / Device Role / Timing Role: Low-capacitance ESD buffer placed immediately adjacent to connector, minimizing trace inductance in tight RF-sensitive layouts. Use Value: Achieves 5pF loading and 1nA leakage - critical for maintaining USB 2.0 signal fidelity while meeting stringent mobile thermal and size constraints. |
Use Scenario: Protecting dual-role USB On-The-Go (OTG) ports in portable diagnostic tools or field instruments requiring host/peripheral mode switching. IC Role / Device Role / Timing Role: Symmetric 2-channel protection supporting both D+ and D− polarity reversals during ID pin detection and role negotiation. Use Value: Eliminates need for separate ESD devices per mode, reducing BOM count and PCB area while maintaining full ±15kV HBM immunity in either configuration. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPD2E001DRYR | 2-channel, 5.5V max VCC, 1.5pF capacitance, ±8kV IEC contact, no VCC-bias clamp - relies solely on GND clamping. | Lower capacitance suits >1Gbps interfaces but lacks VCC-assisted clamping for higher-energy transients. | Select when ultra-low capacitance is prioritized over highest IEC air-gap margin; verify PHY tolerance to asymmetric clamping. |
| SP1001-02UTG | 2-channel, 5V max VCC, 0.6pF capacitance, ±12kV HBM, ±8kV IEC contact - silicon-avalanche architecture, no VCC dependency. | Superior HF response for USB 3.x Gen1, but lower HBM rating and no air-gap certification data published. | Choose for mixed-protocol boards needing backward-compatible USB 2.0 protection with headroom for future USB 3.0 upgrades. |
Compared with TPD2E001DRYR and SP1001-02UTG, the MAX3202EETT-T provides balanced HBM/IEC air-gap immunity and VCC-assisted clamping - making it optimal for cost-sensitive, thermally constrained USB 2.0 designs requiring full Level 4 compliance without sacrificing signal integrity.
Availability
MAX3202EETT-T is available at Aetrix Electronics and suitable for USB 2.0 interface protection, mobile device connector hardening, and industrial embedded controller port safeguarding requiring stable component supply and long-term lifecycle assurance.
Supply support for MAX3202EETT-T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Maxim Integrated (now part of Analog Devices) is a U.S.-based semiconductor company specializing in high-performance analog, mixed-signal, and power management ICs for industrial, communications, and consumer applications.
The MAX3202EETT-T belongs to Maxim's ESD protection array product line, engineered specifically for high-speed digital interfaces where low capacitance, precise clamping, and compact packaging are essential to maintain signal fidelity and meet international EMC standards.
FAQ
What is the maximum operating temperature range for the MAX3202EETT-T?
The MAX3202EETT-T is specified to operate reliably from -40°C to +85°C ambient temperature. This range covers industrial and extended commercial environments, including inside sealed enclosures or near heat-generating components. The device's BiCMOS process and TDFN-EP thermal design ensure stable ESD clamping performance across this full range without parameter drift or derating.
Does the MAX3202EETT-T require an external bypass capacitor?
Yes, the MAX3202EETT-T requires a 0.1µF low-ESR ceramic capacitor placed between Pin 4 (VCC) and Pin 3 (GND), mounted within 1mm of the package. This capacitor absorbs ESD charge during positive transients and stabilizes the clamp voltage - omission results in elevated VC beyond ±25V under HBM and failure to meet IEC 61000-4-2 specifications.
Can the MAX3202EETT-T be used for USB 3.0 or higher-speed interfaces?
No, the MAX3202EETT-T is not recommended for USB 3.0 (5Gbps) or higher-speed interfaces. While its 5pF capacitance is suitable for USB 2.0 (480Mbps), USB 3.0 SuperSpeed lanes demand ≤0.5pF loading to avoid significant insertion loss above 2.5GHz. For USB 3.x, consider dedicated low-capacitance arrays like SP1001-02UTG or TPD2EUSB30.
What is the purpose of the exposed pad (EP) on the MAX3202EETT-T package?
The exposed pad (EP) on the MAX3202EETT-T serves two critical functions: thermal dissipation (reducing θJA to 42°C/W) and providing a low-inductance ESD current return path to GND. It must be soldered to a solid GND copper area - floating or unconnected EP degrades both thermal performance and ESD immunity, especially under IEC 61000-4-2 air-gap discharge conditions.
How does the MAX3202EETT-T differ from the MAX3202EEWS+T variant?
The MAX3202EETT-T uses a 6-pin TDFN-EP package (3mm × 3mm), while the MAX3202EEWS+T uses a 4-bump WLP (1.05mm × 1.05mm). Both share identical electrical specs, but the TDFN offers superior thermal performance (θJA = 42°C/W vs. 87°C/W) and easier reworkability, whereas the WLP enables ultra-compact placement near connectors in space-limited mobile designs.
MAX3202EETT-T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Package/Case:
- 6-WDFN Exposed Pad
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Type:
- Steering (Rail to Rail)
- Unidirectional Channels:
- 2
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- -
- Voltage - Breakdown (Min):
- -
- Voltage - Clamping (Max) @ Ipp:
- -
- Current - Peak Pulse (10/1000µs):
- -
- Power - Peak Pulse:
- -
- Power Line Protection:
- No
- Applications:
- General Purpose
- Capacitance @ Frequency:
- -
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 6-TDFN (3x3)
MAX3202EETT-T FAQ
1.How can I place an order for MAX3202EETT-T through Aetrix?
Please submit a Request for Quotation (RFQ) for MAX3202EETT-T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MAX3202EETT-T reliable?
The price and inventory of MAX3202EETT-T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MAX3202EETT-T is usually 5 days.
3.What payment methods are accepted for MAX3202EETT-T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MAX3202EETT-T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MAX3202EETT-T?
MAX3202EETT-T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MAX3202EETT-T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MAX3202EETT-T?
For technical support, including MAX3202EETT-T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MAX3202EETT-T requirements.
6.How does Aetrix verify that MAX3202EETT-T is sourced from the original manufacturer or authorized distributors?
All MAX3202EETT-T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MAX3202EETT-T meets industry standards.
7.What is the process for return or replacement of MAX3202EETT-T?
All MAX3202EETT-T units undergo pre-shipment inspection (PSI). If there is an issue with MAX3202EETT-T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MAX3202EETT-T part is unused and in its original packaging.
Return procedure for MAX3202EETT-T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MAX3202EETT-T Tags
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