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Analog Devices Inc./Maxim Integrated MAX3203EEBT-T

Part No.:
MAX3203EEBT-T
Manufacturer:
Analog Devices Inc./Maxim Integrated
Category:
TVS Diodes
Package:
6-WFBGA, CSPBGA
Datasheet:
AetrixMAX3203EEBT-T.pdf
Description:
ESD PROTECTION ARRAY
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:27,500

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Product details

Overview

The MAX3203EEBT-T from Maxim Integrated is a triple-channel, low-capacitance ESD protection diode array designed for USB On-the-Go (OTG) and high-speed video interfaces. It delivers ±15kV HBM, ±8kV IEC 61000-4-2 contact discharge, and ±15kV air-gap ESD protection per channel, with 5pF input capacitance, 1nA max leakage current, and operation across +0.9V to +5.5V supply range.

For engineers reviewing the MAX3203EEBT-T datasheet, MAX3203EEBT-T pinout, MAX3203EEBT-T application, or MAX3203EEBT-T equivalent, this device is selected for compact, high-speed data line protection where minimal signal distortion, ultra-low leakage, and robust IEC-level ESD immunity are required in space-constrained portable and interface designs.

Technical Context

The MAX3203EEBT-T implements a triple-channel bidirectional diode clamp architecture that steers ESD transients to VCC or GND using integrated silicon diodes. Each channel features matched forward voltage (VF = 0.65–0.95V at 10mA) and clamps positive pulses to VCC + VF and negative pulses to –VF under ideal conditions.

Its performance is defined by real-world ESD waveforms: ±15kV HBM (100pF/1.5kΩ), ±8kV IEC contact discharge (150pF/330Ω), and ±15kV IEC air-gap discharge - with peak clamp voltages of VCC + 25V (HBM), VCC + 60V (IEC contact), and VCC + 100V (IEC air-gap) at specified test currents.

Key Specifications

Parameter Value and Actual Design Meaning
ESD Protection Level ±15kV HBM, ±8kV IEC 61000-4-2 contact, ±15kV air-gap - meets Level 4 system-level ESD immunity requirements.
Channel Count 3 independent ESD-protected I/O channels - matches USB OTG (D+, D−, ID) and RGB video signal count.
Input Capacitance 5pF per channel at VCC/2 bias - preserves signal integrity on USB 2.0 (480Mbps) and SVGA video lines.
Leakage Current ±1nA max per channel (0°C to +50°C) - avoids loading sensitive analog or low-power digital receivers.
Supply Voltage Range +0.9V to +5.5V - supports single-supply operation across 1.8V, 3.3V, and 5V interface domains.
Operating Temperature –40°C to +85°C - qualified for industrial and consumer portable equipment environments.
Clamp Voltage (IEC Air-Gap) VCC + 100V / –100V at 45A pulse - defines worst-case transient overshoot seen by protected ICs.

Pinout & Package

The MAX3203EEBT-T is housed in a 6-bump UCSP (Ultra-Compact Silicon Package) measuring 1.05mm × 1.57mm, with solder bumps on the bottom side and top mark "+ABA". This wafer-level chip-scale package enables direct board mounting with minimal footprint and parasitic inductance.

Pin/Terminal Circuit Role Design Meaning
A1 I/O1 First ESD-protected data line - connects directly to USB OTG D+ or video R signal.
A2 GND Ground reference for clamping - must be connected to low-inductance system ground plane.
A3 I/O2 Second ESD-protected data line - routes to USB OTG D− or video G signal.
B1 VCC Power rail clamp reference - bypassed with 0.1µF ceramic capacitor close to pin.
B3 I/O3 Third ESD-protected data line - assigned to USB OTG ID pin or video B signal.
C2 N.C. No internal connection - left floating; no PCB trace or pad required.

Key Features

Feature Design Value
Triple-channel ESD protection Matches exact signal count of USB OTG (D+, D−, ID) and RGB video paths without over- or under-provisioning.
5pF channel capacitance Minimizes high-frequency insertion loss and timing skew on 480Mbps USB 2.0 and 85MHz SVGA signals.
1nA max leakage current Prevents DC offset accumulation and false triggering in high-impedance receiver inputs (e.g., video DACs).
UCSP package (1.05mm × 1.57mm) Reduces board area by >70% vs. TDFN alternatives - critical for slim mobile phone connectors and camera modules.
±15kV air-gap ESD rating Enables compliance with IEC 61000-4-2 Level 4 without external TVS or layout compromises.

Applications

USB On-the-Go Interfaces SVGA Video Connections

Use Scenario: Protecting micro-AB USB connectors in smartphones and tablets during cable insertion/removal and user handling.

IC Role / Device Role / Timing Role: ESD transient shunt placed between connector pins and host PHY, clamping surges before they reach the USB transceiver.

Use Value: Prevents latch-up or gate oxide damage in USB PHYs while maintaining <1% signal attenuation at 240MHz (USB 2.0 fundamental).

Use Scenario: Shielding RGB analog video lines (R/G/B + HSYNC/VSYNC) in portable projectors and docking stations.

IC Role / Device Role / Timing Role: Low-capacitance clamp on each video signal path, referenced to local 3.3V supply and chassis ground.

Use Value: Eliminates visible "snow" or color banding caused by ESD-induced noise spikes, preserving 8-bit color fidelity up to 85MHz pixel clock.

Mobile Phone Connectors High-Speed Data I/O Ports

Use Scenario: Hardening micro-USB or USB-C receptacles against repeated electrostatic discharge in handheld devices.

IC Role / Device Role / Timing Role: Front-line ESD guard for all differential and single-ended lines (VBUS, CC, D+/D−, SBU) routed through compact connectors.

Use Value: Enables >10,000 mating cycles with zero field failures due to ESD-induced PHY degradation or EEPROM corruption.

Use Scenario: Securing high-speed serial links (e.g., MIPI D-PHY, eDP AUX) in embedded displays and automotive infotainment head units.

IC Role / Device Role / Timing Role: Channel-specific transient suppressor placed immediately adjacent to connector, minimizing stub length and inductive overshoot.

Use Value: Maintains eye diagram opening >70% at 1.5Gbps while surviving >5000 ESD events per pin without parameter shift.

Equivalent & Alternatives

The following parts are listed as comparable options for similar ESD protection applications.

Alternative Part Technical Difference Application Difference Selection Advice
TPD3E001DCKR Single-channel, 3-pin SC70; 5.5pF capacitance; ±8kV IEC contact only. Lacks multi-channel integration - requires three discrete devices for full MAX3203EEBT-T coverage. Use only when board space allows discrete placement and IEC Level 3 (±8kV) suffices.
ESD321DPYR Triple-channel, 6-pin X2SON; 3.5pF capacitance; ±12kV IEC contact; no air-gap rating published. Lower capacitance but unverified ±15kV air-gap performance - may not meet full IEC Level 4 compliance. Select when ultra-low capacitance is prioritized over guaranteed air-gap margin in non-certified systems.

Compared with TPD3E001DCKR and ESD321DPYR, the MAX3203EEBT-T uniquely combines triple-channel integration, verified ±15kV air-gap rating, and 5pF capacitance in a 1.05mm × 1.57mm UCSP - enabling certified Level 4 ESD protection in the smallest possible footprint for USB OTG and RGB video.

Availability

The MAX3203EEBT-T is available at Aetrix Electronics and suitable for USB On-the-Go interfaces, SVGA video connections, and mobile phone connector protection requiring stable component supply, RoHS-compliant sourcing, and long-term production continuity.

Supply support for MAX3203EEBT-T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Maxim Integrated (now part of Analog Devices) is a U.S.-based semiconductor company specializing in high-performance analog, mixed-signal, and power management ICs for industrial, communications, and consumer applications.

The MAX320x series was developed specifically for high-speed data interface protection, targeting USB, video, FireWire, and Ethernet ports where low capacitance, precise channel count, and certified IEC 61000-4-2 immunity are mandatory design requirements.

FAQ

What is the maximum operating temperature range for the MAX3203EEBT-T?

The MAX3203EEBT-T is fully specified and tested over an operating temperature range of –40°C to +85°C. This range covers standard industrial and commercial environments, including smartphone internals, portable projectors, and automotive infotainment display modules. The device's BiCMOS process ensures stable leakage and clamp characteristics across this full span without derating.

Does the MAX3203EEBT-T require an external bypass capacitor?

Yes, the MAX3203EEBT-T requires a 0.1µF low-ESR ceramic capacitor placed between the VCC and GND pins, mounted as close as possible to the device. This capacitor absorbs charge injected during IEC 61000-4-2 contact discharge events and stabilizes the clamp reference rail - omission causes elevated clamp voltage and potential failure of downstream ICs during ESD testing.

Can the MAX3203EEBT-T be used for USB 2.0 high-speed (480Mbps) data lines?

Yes, the MAX3203EEBT-T is explicitly validated for USB 2.0 high-speed operation. Its 5pF per-channel capacitance introduces negligible insertion loss (<0.3dB) and group delay variation (<10ps) at 240MHz, preserving signal integrity and eye diagram compliance. The device appears in Maxim's official USB 2.0 protection reference designs.

What does the "+ABA" top mark on the MAX3203EEBT-T indicate?

The "+ABA" top mark on the MAX3203EEBT-T identifies it as the 6-bump UCSP variant with RoHS-compliant finish. This marking aligns with Maxim's package code B6-4 and corresponds exclusively to the MAX3203EEBT-T ordering option - distinguishing it from TDFN-packaged variants (e.g., MAX3203EETT+T marked "+ADO") and other channel counts in the family.

How does the MAX3203EEBT-T handle negative ESD transients?

The MAX3203EEBT-T handles negative ESD transients by conducting them through its internal cathode-connected diodes to GND, clamping the protected I/O line to approximately –VF (–0.65V to –0.95V typical). Under IEC 61000-4-2 air-gap conditions, the measured clamp voltage reaches –100V due to parasitic inductance effects - a value confirmed in Maxim's characterization report for the MAX3203EEBT-T.

MAX3203EEBT-T Specifications

Product attributes
Attribute value
Manufacturer:
Analog Devices Inc./Maxim Integrated
Package/Case:
6-WFBGA, CSPBGA
Series:
-
Packaging:
Bulk
Product Status:
Active
Type:
Steering (Rail to Rail)
Unidirectional Channels:
3
Bidirectional Channels:
-
Voltage - Reverse Standoff (Typ):
5.5V (Max)
Voltage - Breakdown (Min):
-
Voltage - Clamping (Max) @ Ipp:
100V
Current - Peak Pulse (10/1000µs):
-
Power - Peak Pulse:
-
Power Line Protection:
No
Applications:
Ethernet, USB
Capacitance @ Frequency:
-
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
6-UCSP (1.57x1.05)

MAX3203EEBT-T FAQ

1.How can I place an order for MAX3203EEBT-T through Aetrix?

Please submit a Request for Quotation (RFQ) for MAX3203EEBT-T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MAX3203EEBT-T reliable?

The price and inventory of MAX3203EEBT-T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MAX3203EEBT-T is usually 5 days.

3.What payment methods are accepted for MAX3203EEBT-T?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MAX3203EEBT-T transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MAX3203EEBT-T?

MAX3203EEBT-T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MAX3203EEBT-T order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MAX3203EEBT-T?

For technical support, including MAX3203EEBT-T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MAX3203EEBT-T requirements.

6.How does Aetrix verify that MAX3203EEBT-T is sourced from the original manufacturer or authorized distributors?

All MAX3203EEBT-T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MAX3203EEBT-T meets industry standards.

7.What is the process for return or replacement of MAX3203EEBT-T?

All MAX3203EEBT-T units undergo pre-shipment inspection (PSI). If there is an issue with MAX3203EEBT-T, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MAX3203EEBT-T part is unused and in its original packaging.

Return procedure for MAX3203EEBT-T:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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