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Analog Devices Inc./Maxim Integrated MAX3203EEBT+T
- Part No.:
- MAX3203EEBT+T
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Category:
- TVS Diodes
- Package:
- 5-WFBGA, CSPBGA
- Datasheet:
-
MAX3203EEBT+T.pdf
- Description:
- TVS DIODE 5UCSP
- Quantity:
- Payment:
- Shipping:
Inventory:9,692
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Product details
Overview
MAX3203EEBT+T from Maxim Integrated is a triple-channel ESD protection diode array designed for USB On-the-Go (OTG) and video interfaces, featuring ±15kV HBM / ±8kV IEC 61000-4-2 contact / ±15kV air-gap ESD protection, 5pF channel capacitance, 1nA max leakage current, and operation from +0.9V to +5.5V supply.
For engineers reviewing the MAX3203EEBT+T datasheet, MAX3203EEBT+T pinout, MAX3203EEBT+T application, or MAX3203EEBT+T equivalent, this device supports high-speed data line protection in space-constrained portable designs where low capacitance, precise clamping voltage, and multi-channel integration are critical selection criteria.
Technical Context
The MAX3203EEBT+T implements a triple-channel diode-steering architecture that routes ESD transients to VCC or GND via bidirectional clamping diodes per I/O line. Each channel operates independently with no internal coupling between protected lines.
Clamp voltage is defined by forward diode drop plus supply rail offset: VC = VCC + VF for positive pulses and VC = –VF for negative pulses-verified at ±15kV HBM (±25V peak), ±8kV IEC contact (±60V), and ±15kV IEC air-gap (±100V) test conditions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| ESD Protection Level | ±15kV Human Body Model - withstands direct human touch discharge without degradation |
| IEC 61000-4-2 Compliance | ±8kV Contact Discharge & ±15kV Air-Gap - meets Level 4 immunity for industrial/commercial equipment |
| Channel Input Capacitance | 5pF (typ) at VCC/2 bias - preserves signal integrity on USB OTG and video data lines up to 480Mbps |
| Leakage Current | ±1nA max (0°C to +50°C) - avoids loading of high-impedance source drivers or pull-up resistors |
| Supply Voltage Range | +0.9V to +5.5V - compatible with 1.2V, 1.8V, 3.3V, and 5V logic domains without level-shifting |
| Operating Temperature | –40°C to +85°C - qualified for consumer, industrial, and automotive infotainment ambient environments |
| Channel Count | 3 independent ESD-protected I/O lines - matches USB OTG (D+, D–, ID) and RGB video (R/G/B) pin counts |
Pinout & Package
MAX3203EEBT+T is housed in a 6-pin TDFN-EP package (3mm × 3mm, 0.5mm pitch) with exposed thermal pad. Pin 1 is I/O1, Pin 2 is I/O2, Pin 3 is I/O3, Pin 4 is GND, Pin 5 is VCC, and Pin 6 is NC. The exposed pad (EP) must be soldered to a GND plane for thermal and ESD return path integrity.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| I/O1, I/O2, I/O3 | ESD-Protected Signal Line | Each connects directly to a high-speed data line (e.g., USB D+, D–, ID); diode clamps transients to VCC or GND |
| GND | Ground Reference | Primary return path for negative ESD current; must be low-inductance connection to system ground plane |
| VCC | Power Supply Input | Bias rail for positive clamping; requires local 0.1µF ceramic bypass capacitor to minimize impedance during ESD events |
| NC | No Connection | Not internally bonded; left floating or tied to GND per layout best practice-no electrical function |
| EP | Exposed Thermal Pad | Thermal and ESD current sink; must be soldered to solid GND copper area for optimal θJA (42°C/W) and transient dissipation |
Key Features
| Feature | Design Value |
|---|---|
| Triple-channel ESD protection | Single-package solution for full USB OTG interface (D+, D–, ID) or RGB video lines-reduces BOM count and board area |
| 5pF channel capacitance | Enables <1% signal distortion on 480Mbps USB 2.0 eye diagrams; avoids timing skew in parallel video buses |
| ±15kV HBM / ±15kV IEC air-gap | Exceeds IEC 61000-4-2 Level 4 requirements-supports robust field reliability in handheld and docking applications |
| 1nA max leakage at +50°C | Prevents unintended pull-down of weakly driven lines (e.g., USB ID pin detection, analog video sync signals) |
| +0.9V to +5.5V supply range | Eliminates need for external LDO or charge pump when protecting mixed-voltage interfaces (e.g., 1.8V PHY + 3.3V controller) |
Applications
| USB On-the-Go (OTG) | RGB Video Interface |
|---|---|
|
Use Scenario: Protecting micro-AB receptacle pins (D+, D–, ID) in smartphones and tablets during cable insertion/removal and user handling. IC Role / Device Role / Timing Role: ESD transient shunt placed between connector and PHY, clamping fast-rising ESD pulses before they reach sensitive transceiver circuitry. Use Value: Prevents latch-up or gate oxide damage in USB PHYs while maintaining <5pF loading to preserve 480Mbps eye margin and jitter compliance. |
Use Scenario: Shielding RGB analog video lines (R, G, B, and optionally HSYNC/VSYNC) in portable projectors and docking stations. IC Role / Device Role / Timing Role: Low-capacitance clamp on each video signal path, referenced to local analog ground and AVDD rail. Use Value: Avoids color shift or ghosting caused by ESD-induced DC offset or transient ringing-critical for 720p/1080p analog video fidelity. |
| Mobile Phone Connector Protection | Industrial Camera Interface |
|
Use Scenario: Safeguarding high-density multi-function connectors (e.g., USB-C, micro-B) against repeated ESD exposure in daily consumer use. IC Role / Device Role / Timing Role: Front-line defense at connector edge, routing ESD energy away from baseband processor, PMIC, and codec ICs. Use Value: Extends product lifecycle beyond 10,000+ plug/unplug cycles with no performance drift-validated per JEDEC JESD22-A114E. |
Use Scenario: Hardening LVDS or parallel digital video inputs on machine vision cameras exposed to factory-floor ESD events. IC Role / Device Role / Timing Role: Channel-isolated clamp on each data lane, preserving differential pair impedance and common-mode rejection. Use Value: Maintains <10ps inter-lane skew under ±8kV contact discharge-ensures pixel-perfect image capture without frame corruption. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPD3F003DPWR | 3-channel, 5.5V max VCC, 0.5pF lower capacitance (4.5pF typ), but only ±12kV HBM / ±8kV IEC contact rated | Preferred for ultra-high-speed USB 3.0 Gen1 auxiliary lanes where sub-5pF is mandatory; not suitable for full USB OTG ID pin detection due to tighter VCC limit | Select when minimizing capacitive loading is primary concern and ESD threat level is ≤±12kV HBM; verify compatibility with 5.5V tolerant PHYs |
| SP3003-03UTG | 3-channel, same ±15kV HBM/IEC ratings, but 6.5pF capacitance (1.5pF higher), 50nA leakage (50× higher), and SOT-553 package (larger footprint) | Better thermal dissipation in high-power surge scenarios; less suitable for dense mobile PCBs due to size and leakage-induced voltage droop on weak pull-ups | Choose for cost-sensitive industrial designs where 3mm × 3mm TDFN is unavailable or where higher leakage tolerance exists in system architecture |
Compared with TPD3F003DPWR and SP3003-03UTG, MAX3203EEBT+T delivers balanced performance: identical ±15kV HBM/IEC air-gap rating as SP3003-03UTG but with 1.5pF lower capacitance and 50× lower leakage, while offering 3kV higher ESD immunity than TPD3F003DPWR at no penalty in board area or thermal resistance.
Availability
MAX3203EEBT+T is available at Aetrix Electronics and suitable for USB OTG, RGB video, mobile connector, and industrial camera interface applications requiring stable component supply, RoHS-compliant packaging, and guaranteed long-term manufacturability.
Supply support for MAX3203EEBT+T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Maxim Integrated (now part of Analog Devices) is a U.S.-based semiconductor company specializing in high-performance analog, mixed-signal, and power management ICs for precision, reliability, and efficiency-critical systems.
The MAX3203EEBT+T belongs to Maxim's ESD protection array product line, engineered specifically for high-speed serial and parallel data interfaces where low capacitance, tight clamping voltage, and multi-channel integration are essential for signal integrity and system-level EMC compliance.
FAQ
What is the maximum operating temperature range for MAX3203EEBT+T?
The MAX3203EEBT+T is specified to operate reliably from –40°C to +85°C ambient temperature. This range covers commercial and extended industrial environments, including smartphone internals, portable projectors, and factory-floor camera modules. Thermal performance is validated with θJA = 42°C/W in the 6-pin TDFN-EP package, and junction temperature remains within safe limits (<150°C) under typical ESD event duty cycles.
Does MAX3203EEBT+T require an external bypass capacitor?
Yes, MAX3203EEBT+T requires a 0.1µF low-ESR ceramic capacitor placed between VCC and GND, mounted as close as possible to the VCC pin. This capacitor absorbs charge injected during IEC 61000-4-2 contact discharge events (e.g., ±8kV), preventing VCC rail sag that would raise the positive clamp voltage VC = VCC + VF. Omitting it degrades ESD protection effectiveness and may cause system reset or data corruption.
Can MAX3203EEBT+T protect both USB 2.0 D+ and D– lines simultaneously?
Yes, MAX3203EEBT+T is explicitly designed for USB On-the-Go (OTG) applications and protects three independent lines-including D+, D–, and ID-simultaneously. Its triple-channel architecture ensures each line has dedicated diode steering to VCC or GND, with no crosstalk or shared impedance paths. The 5pF per-channel capacitance maintains USB 2.0 eye diagram compliance at 480Mbps.
What is the leakage current specification for MAX3203EEBT+T at room temperature?
MAX3203EEBT+T exhibits a maximum channel leakage current of ±1nA over the 0°C to +50°C range, with typical values well below 100pA at +25°C. This ultra-low leakage prevents false detection on USB ID pins, avoids loading of high-impedance video sync signals, and eliminates measurable voltage drop across standard 10kΩ–100kΩ pull-up/down resistors used in interface configuration circuits.
Is the exposed pad (EP) on MAX3203EEBT+T electrically connected or thermal-only?
The exposed pad (EP) on MAX3203EEBT+T is electrically connected to GND and must be soldered to a solid GND plane. It serves dual functions: providing a low-inductance return path for ESD current and enhancing thermal dissipation (θJA = 42°C/W). Leaving EP unconnected or floating violates the device's ESD performance validation and risks thermal runaway under repeated surge conditions.
MAX3203EEBT+T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Package/Case:
- 5-WFBGA, CSPBGA
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Type:
- Steering (Rail to Rail)
- Unidirectional Channels:
- 3
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- -
- Voltage - Breakdown (Min):
- -
- Voltage - Clamping (Max) @ Ipp:
- -
- Current - Peak Pulse (10/1000µs):
- -
- Power - Peak Pulse:
- -
- Power Line Protection:
- No
- Applications:
- USB OTG
- Capacitance @ Frequency:
- -
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 5-UCSP (1x1.52)
MAX3203EEBT+T FAQ
1.How can I place an order for MAX3203EEBT+T through Aetrix?
Please submit a Request for Quotation (RFQ) for MAX3203EEBT+T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MAX3203EEBT+T reliable?
The price and inventory of MAX3203EEBT+T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MAX3203EEBT+T is usually 5 days.
3.What payment methods are accepted for MAX3203EEBT+T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MAX3203EEBT+T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MAX3203EEBT+T?
MAX3203EEBT+T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MAX3203EEBT+T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MAX3203EEBT+T?
For technical support, including MAX3203EEBT+T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MAX3203EEBT+T requirements.
6.How does Aetrix verify that MAX3203EEBT+T is sourced from the original manufacturer or authorized distributors?
All MAX3203EEBT+T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MAX3203EEBT+T meets industry standards.
7.What is the process for return or replacement of MAX3203EEBT+T?
All MAX3203EEBT+T units undergo pre-shipment inspection (PSI). If there is an issue with MAX3203EEBT+T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MAX3203EEBT+T part is unused and in its original packaging.
Return procedure for MAX3203EEBT+T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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