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Analog Devices Inc./Maxim Integrated MAX3203EETT
- Part No.:
- MAX3203EETT
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Category:
- TVS Diodes
- Package:
- 6-WDFN Exposed Pad
- Datasheet:
-
MAX3203EETT.pdf
- Description:
- ESD PROTECTION ARRAY
- Quantity:
- Payment:
- Shipping:
Inventory:64,278
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Product details
Overview
MAX3203EETT from Maxim Integrated is a triple-channel, low-capacitance ESD protection diode array designed for USB On-The-Go (OTG) and video interfaces. It delivers ±15kV HBM / ±8kV IEC 61000-4-2 contact / ±15kV air-gap ESD protection, features 5pF per-channel capacitance, 1nA max leakage current, and operates from +0.9V to +5.5V supply voltage.
For engineers reviewing the MAX3203EETT datasheet, MAX3203EETT pinout, MAX3203EETT application, or MAX3203EETT equivalent, key selection criteria include channel count (3), ultra-low capacitance for high-speed signal integrity, IEC-compliant transient clamping performance, and compatibility with compact TDFN-EP packaging for space-constrained mobile and portable designs.
Technical Context
The MAX3203EETT integrates three independent bidirectional ESD protection channels, each formed by a pair of steering diodes that shunt transient current to VCC or GND. Its BiCMOS process enables precise clamp voltage control under ±15kV HBM and ±8kV/±15kV IEC 61000-4-2 stress conditions.
Clamp voltage is specified at +VCC + 25V (positive transients) and –25V (negative transients) under ±15kV HBM, rising to +VCC + 100V/–100V under ±15kV IEC air-gap discharge due to higher peak current (45A). Input capacitance remains stable at 5pF (typ) across 0–5V bias, critical for preserving USB OTG and video signal fidelity.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| ESD Protection Level | ±15kV Human Body Model, ±8kV IEC 61000-4-2 Contact Discharge, ±15kV Air-Gap Discharge - meets Level 4 immunity for end-equipment compliance |
| Channel Count | 3 independent ESD-protected I/O lines - matches USB OTG's D+, D−, and ID pin requirements |
| Input Capacitance | 5pF (typ) per channel at VCC/2 bias - preserves signal integrity on >480Mbps USB 2.0 and VGA video lines |
| Leakage Current | ±1nA (max) per channel at 0°C to +50°C - prevents signal degradation in battery-powered devices |
| Supply Voltage Range | +0.9V to +5.5V - supports single-supply operation across USB, 3.3V logic, and 5V legacy interfaces |
| Clamp Voltage (HBM) | +VCC + 25V / –25V (at 10A) - limits transient overvoltage seen by downstream PHY or controller |
| Operating Temperature | –40°C to +85°C - qualified for industrial and consumer portable electronics environments |
Pinout & Package
MAX3203EETT is housed in a 6-pin TDFN-EP package (3mm × 3mm, pkg code T633-2) with exposed pad for thermal and grounding performance. The package supports reflow soldering per JEDEC J-STD-020 and requires connection of the EP pad to GND.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | I/O1 | First ESD-protected data line - used for USB D+ or video red channel |
| 2 | I/O2 | Second ESD-protected data line - used for USB D− or video green channel |
| 3 | GND | Ground reference for ESD current return path - must be low-inductance connection to system ground plane |
| 4 | I/O3 | Third ESD-protected data line - used for USB ID or video blue channel |
| 5 | VCC | Power-supply input for active clamping - bypassed with 0.1µF ceramic capacitor to GND |
| 6 | N.C. | No internal connection - left floating or tied to GND per layout best practice |
| EP | Exposed Pad | Thermal and electrical ground - must be soldered to PCB ground plane for optimal ESD dissipation and thermal performance |
Key Features
| Feature | Design Value |
|---|---|
| Triple-channel ESD protection | Matches exact pin count and signal routing needs of USB OTG connectors (D+, D−, ID), eliminating redundant channels and board area |
| 5pF channel capacitance | Minimizes insertion loss and signal distortion on high-speed differential pairs - validated for USB 2.0 full-speed and high-speed operation |
| ±15kV HBM / ±8kV IEC contact rating | Enables robust front-end protection without external TVS arrays - reduces BOM count and layout complexity |
| 1nA max leakage current | Prevents DC loading of sensitive analog video or USB pull-up/pull-down resistors - maintains bus enumeration reliability |
| TDFN-EP 3mm × 3mm package | Provides mechanical stability and thermal conduction superior to UCSP variants - preferred for production-grade mobile PCBs |
Applications
| USB On-The-Go (OTG) | SVGA Video Interface |
|---|---|
|
Use Scenario: Portable device acting as USB host (e.g., smartphone connecting to keyboard or flash drive) via micro-AB receptacle. IC Role / Device Role / Timing Role: ESD protection for D+, D−, and ID pins - ensures reliable cable insertion detection and role negotiation under field ESD stress. Use Value: Prevents latch-up or damage to USB transceiver during hot-plug events while maintaining <1ns response time and <5pF loading. |
Use Scenario: Laptop docking station with SVGA output driving analog RGB signals to external monitor. IC Role / Device Role / Timing Role: Per-channel ESD clamping for R, G, B, and sync lines - protects VGA DAC outputs and connector pins from user-handling discharges. Use Value: Maintains color fidelity and timing margin by limiting channel capacitance to 5pF and clamping transients below ±25V (HBM). |
| Mobile Phone Connector Protection | High-Speed Data Port Interface |
|
Use Scenario: Smartphone charging/data port exposed to repeated cable insertions and environmental ESD. IC Role / Device Role / Timing Role: Triple-channel guard for USB 2.0 D+, D−, and ID lines - provides first-line defense before internal PHY protection. Use Value: Enables compliance with IEC 61000-4-2 Level 4 without sacrificing signal rise/fall time due to ultra-low 5pF capacitance. |
Use Scenario: Industrial camera module with high-bandwidth parallel video interface subject to handling ESD. IC Role / Device Role / Timing Role: Low-capacitance ESD shunt for multi-line digital video buses - preserves edge rate and eye diagram integrity. Use Value: Delivers ±15kV air-gap protection while adding <0.5% signal delay - verified in 480Mbps USB 2.0 eye mask testing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPD3F003DQAR | 3-channel, 5.5V max VCC, 0.5pF lower capacitance (4.5pF typ), no VCC pin - uses capacitive coupling for clamping | Better suited for ultra-high-speed (>1Gbps) serial links where sub-5pF is mandatory; lacks active VCC clamping for high-energy transients | Select when minimizing capacitance is primary and system-level power rail design supports charge-pump clamping |
| ESD321DPYR | 3-channel, 5.5V VCC, 6pF capacitance (typ), ±12kV HBM only - no IEC 61000-4-2 certification | Cost-optimized solution for non-regulated consumer products where IEC compliance is not required | Choose for cost-sensitive designs where ±12kV HBM suffices and IEC 61000-4-2 Level 4 is not mandated |
Compared with TPD3F003DQAR and ESD321DPYR, the MAX3203EETT uniquely balances IEC 61000-4-2 Level 4 compliance, 5pF capacitance, and active VCC-coupled clamping - making it the preferred choice for USB OTG and certified industrial video interfaces requiring guaranteed transient suppression.
Availability
MAX3203EETT is available at Aetrix Electronics and suitable for USB On-The-Go implementations, SVGA video subsystems, and mobile phone connector protection requiring stable component supply and long-term production continuity.
Supply support for MAX3203EETT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Maxim Integrated (now part of Analog Devices) is a U.S.-based semiconductor company specializing in high-performance analog, mixed-signal, and power management ICs for industrial, communications, and consumer applications.
The MAX320x series was developed specifically for high-speed data interface protection, targeting USB, video, FireWire, and Ethernet ports where low capacitance and certified ESD robustness are essential design constraints.
FAQ
What is the maximum operating temperature range for the MAX3203EETT?
The MAX3203EETT is specified to operate reliably from –40°C to +85°C ambient temperature. This range covers standard industrial and commercial environments, including handheld devices, docking stations, and embedded video systems. Thermal derating is not required within this span, and the device maintains full ESD protection performance across the entire range.
Does the MAX3203EETT require an external bypass capacitor on the VCC pin?
Yes, the MAX3203EETT requires a 0.1µF low-ESR ceramic capacitor placed between VCC and GND, mounted as close as possible to the device. This capacitor absorbs energy from positive ESD transients and stabilizes the clamping reference. Without it, clamp voltage can exceed specifications during IEC 61000-4-2 events, risking damage to protected circuitry downstream of the MAX3203EETT.
Can the MAX3203EETT be used for USB 2.0 high-speed (480Mbps) data lines?
Yes, the MAX3203EETT is explicitly validated for USB 2.0 high-speed operation. Its 5pF typical input capacitance per channel introduces negligible signal degradation, and its <1ns response time ensures effective clamping before transients reach the USB transceiver. Layout guidelines (short traces, solid ground plane, proper VCC bypassing) must be followed to preserve eye diagram integrity at 480Mbps.
What is the function of Pin 6 (N.C.) on the MAX3203EETT?
Pin 6 of the MAX3203EETT is designated N.C. (No Connection) and is not internally bonded. It may be left unconnected or tied to GND for mechanical stability and improved thermal conduction - but it must never be connected to VCC or any active signal. This pin serves no electrical function and does not affect ESD performance or signal integrity when properly handled.
How does the MAX3203EETT differ from the MAX3202EETT in terms of channel configuration?
The MAX3203EETT provides three ESD-protected I/O channels (I/O1, I/O2, I/O3), whereas the MAX3202EETT offers only two (I/O1, I/O2). This makes the MAX3203EETT suitable for USB On-The-Go applications requiring ID pin protection, while the MAX3202EETT targets standard USB 2.0 D+/D− pairs. Both share identical electrical specs (5pF, ±15kV HBM, 1nA leakage), but pinout and functional coverage differ.
MAX3203EETT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Package/Case:
- 6-WDFN Exposed Pad
- Series:
- -
- Packaging:
- Bulk
- Product Status:
- Active
- Type:
- Steering (Rail to Rail)
- Unidirectional Channels:
- 3
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- 5.5V (Max)
- Voltage - Breakdown (Min):
- -
- Voltage - Clamping (Max) @ Ipp:
- 100V
- Current - Peak Pulse (10/1000µs):
- -
- Power - Peak Pulse:
- -
- Power Line Protection:
- No
- Applications:
- Ethernet, USB
- Capacitance @ Frequency:
- -
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 6-TDFN-EP (3x3)
MAX3203EETT FAQ
1.How can I place an order for MAX3203EETT through Aetrix?
Please submit a Request for Quotation (RFQ) for MAX3203EETT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MAX3203EETT reliable?
The price and inventory of MAX3203EETT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MAX3203EETT is usually 5 days.
3.What payment methods are accepted for MAX3203EETT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MAX3203EETT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MAX3203EETT?
MAX3203EETT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MAX3203EETT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MAX3203EETT?
For technical support, including MAX3203EETT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MAX3203EETT requirements.
6.How does Aetrix verify that MAX3203EETT is sourced from the original manufacturer or authorized distributors?
All MAX3203EETT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MAX3203EETT meets industry standards.
7.What is the process for return or replacement of MAX3203EETT?
All MAX3203EETT units undergo pre-shipment inspection (PSI). If there is an issue with MAX3203EETT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MAX3203EETT part is unused and in its original packaging.
Return procedure for MAX3203EETT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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