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Analog Devices Inc./Maxim Integrated MAX3203EETT+T
- Part No.:
- MAX3203EETT+T
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Category:
- TVS Diodes
- Package:
- 6-WDFN Exposed Pad
- Datasheet:
-
MAX3203EETT+T.pdf
- Description:
- TVS DIODE 6TDFN
- Quantity:
- Payment:
- Shipping:
Inventory:2,170
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Product details
Overview
MAX3203EETT+T from Maxim Integrated is a triple-channel ±15kV ESD protection diode array in a 6-pin TDFN-EP package, designed for USB On-The-Go (OTG) and high-speed video interfaces. It delivers 5pF per channel input capacitance, ≤1nA leakage current at +50°C, ±8kV IEC 61000-4-2 contact discharge rating, and operates from +0.9V to +5.5V supply voltage - enabling robust transient suppression on compact mobile and portable video signal paths.
For engineers reviewing the MAX3203EETT+T datasheet, MAX3203EETT+T pinout, MAX3203EETT+T application, or MAX3203EETT+T equivalent, this device is selected for high-speed data line protection where low capacitance, guaranteed triple-channel ESD clamping, and space-constrained PCB layouts are critical - especially in USB OTG, SVGA, and mobile connector designs requiring RoHS-compliant, exposed-pad thermal performance.
Technical Context
The MAX3203EETT+T implements a triple-diode array architecture with bidirectional steering: each I/O channel routes positive ESD transients to VCC via integrated forward-biased diodes and negative transients to GND via reverse-biased diodes. Its clamping behavior is defined by diode forward voltage (VF = 0.65–0.95V @ 10mA) plus supply rail voltage under positive pulses, yielding VC ≈ VCC + VF.
It operates across -40°C to +85°C, supports 0.1µF ceramic bypassing between VCC and GND, and relies on low-parasitic layout - including minimized trace inductance (L1/L2/L3) - to maintain effective clamp voltage during 1ns-rising 45A Air-Gap Discharge events. The exposed pad (EP) must be soldered to GND for thermal and electrical integrity.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| ESD Protection Level | ±15kV HBM, ±8kV IEC 61000-4-2 Contact, ±15kV Air-Gap - meets Level 4 immunity for end-equipment certification. |
| Channel Count | 3 independent ESD-protected I/O channels - matches USB OTG signal sets (D+, D-, ID) or RGB video lines. |
| Input Capacitance | 5pF per channel (typ) at VCC/2 bias - preserves signal integrity up to 480Mbps USB 2.0 without distortion. |
| Leakage Current | ≤1nA per channel at +50°C - avoids DC loading on high-impedance video or USB termination networks. |
| Supply Voltage Range | +0.9V to +5.5V - compatible with 1.8V, 3.3V, and 5V logic domains without level-shifting. |
| Clamp Voltage (IEC Air-Gap) | VCC + 100V (positive), -100V (negative) @ 45A - defines maximum transient overvoltage seen by protected ICs. |
| Package | 6-pin TDFN-EP (3mm × 3mm, 0.75mm height) with exposed pad - enables 42°C/W θJA and direct GND thermal path. |
Pinout & Package
MAX3203EETT+T is housed in a 6-pin TDFN-EP package (3mm × 3mm, 0.75mm height) with an exposed thermal pad (EP) that must be soldered to GND for optimal thermal dissipation and ESD return path integrity. Pin 1 is marked by a dot; the EP is electrically connected to GND.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | I/O1 | First ESD-protected signal line - routed directly from connector to protected IC input. |
| 2 | I/O2 | Second ESD-protected signal line - used for complementary or adjacent high-speed pair (e.g., USB D+). |
| 3 | I/O3 | Third ESD-protected signal line - supports ID pin in USB OTG or third video channel (e.g., Blue). |
| 4 | GND | Ground reference and primary ESD current sink - must connect to low-inductance system ground plane. |
| 5 | VCC | Power-supply input for positive transient clamping - requires 0.1µF ceramic bypass capacitor placed <1mm away. |
| 6 | N.C. | No internal connection - left unconnected; not used for signal or power routing. |
| EP | Exposed Pad | Thermal and electrical GND tie - must be soldered to PCB GND plane for θJC = 9°C/W and reliable ESD return path. |
Key Features
| Feature | Design Value |
|---|---|
| Triple-channel ESD protection | Simultaneous protection of three high-speed signals (e.g., USB OTG D+, D−, ID) in one footprint - reduces BOM count and layout area. |
| 5pF channel capacitance | Minimizes signal rise-time degradation and insertion loss - validated for USB 2.0 compliance without equalization. |
| ±15kV HBM / ±8kV IEC contact | Exceeds IEC 61000-4-2 Level 4 requirements - ensures field-reliability in consumer and industrial handheld devices. |
| 1nA max leakage @ +50°C | Prevents unintended bias shift or false triggering in high-impedance video or analog switch interfaces. |
| TDFN-EP thermal design | 42°C/W junction-to-ambient thermal resistance enables operation at full rating in 70°C ambient without derating. |
Applications
| USB On-The-Go (OTG) | SVGA Video Interface |
|---|---|
|
Use Scenario: Protecting micro-AB receptacle pins (D+, D−, ID) on smartphones or tablets supporting host/peripheral role switching. IC Role / Device Role / Timing Role: ESD transient shunt - clamps ±15kV discharges before they reach the USB PHY transceiver. Use Value: Enables certified USB OTG functionality without compromising PCB real estate or signal bandwidth - 5pF capacitance maintains eye diagram integrity at 480Mbps. |
Use Scenario: Shielding RGB analog video lines (Red, Green, Blue) and sync signals from ESD during hot-plug of SVGA cables in portable projectors. IC Role / Device Role / Timing Role: Low-capacitance voltage clamp - limits transient overshoot to <±100V during air-gap discharge, preserving analog signal fidelity. Use Value: Prevents visible video artifacts (snow, streaks) caused by ESD-induced latch-up in display driver ICs - verified at 15kV air-gap. |
| Mobile Phone Connector | High-Speed Data Port |
|
Use Scenario: Safeguarding multi-function connectors (e.g., micro-USB or USB-C) handling data, audio, and charging in compact handsets. IC Role / Device Role / Timing Role: Triple-channel bidirectional ESD suppressor - routes transients to VCC/GND without affecting DC bias or AC coupling. Use Value: Supports concurrent USB 2.0, analog audio, and accessory detection on shared pins - 0.9V–5.5V supply range accommodates mixed-voltage signaling. |
Use Scenario: Hardening external I/O ports on embedded controllers or IoT gateways exposed to frequent human interaction. IC Role / Device Role / Timing Role: System-level ESD front-end - absorbs >45A peak current from IEC 61000-4-2 events while limiting voltage excursion to protected ICs. Use Value: Eliminates need for discrete TVS arrays or RC filters - single-component solution reduces layout complexity and improves time-to-certification. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPD3F003DQAR | 3-channel, 5.5V max VCC, 0.5pF lower capacitance (4.5pF typ), no VCC pin - uses GND-only clamping architecture. | Requires no VCC rail; better suited for battery-powered systems with no local 3.3V/5V supply near connector. | Select when VCC is unavailable or when lowest possible capacitance is prioritized over dual-rail clamping headroom. |
| SP3003-03HTG | 3-channel, 5V max VCC, 6pF capacitance (max), ±12kV HBM only, no IEC 61000-4-2 certification data published. | Limited to HBM-rated environments; lacks documented IEC contact/air-gap validation - insufficient for CE/FCC certification-bound designs. | Acceptable only for cost-sensitive, non-certified internal modules where ±12kV HBM suffices and IEC testing is waived. |
Compared with TPD3F003DQAR and SP3003-03HTG, the MAX3203EETT+T uniquely combines IEC 61000-4-2 Level 4 compliance, VCC-assisted clamping for higher transient headroom, and production-validated 5pF performance - making it the preferred choice for certified USB OTG and portable video products requiring guaranteed ESD robustness.
Availability
MAX3203EETT+T is available at Aetrix Electronics and suitable for USB On-The-Go, SVGA video interface, and mobile phone connector applications requiring stable component supply, RoHS-compliant packaging, and guaranteed -40°C to +85°C operation.
Supply support for MAX3203EETT+T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Maxim Integrated (now part of Analog Devices) is a U.S.-based semiconductor company specializing in high-performance analog, mixed-signal, and power management ICs for industrial, communications, and consumer applications.
The MAX3203EETT+T belongs to Maxim's ESD protection array product line, engineered specifically for high-speed digital and analog interface hardening - targeting USB, video, and portable connectivity where low capacitance and certified IEC immunity are mandatory.
FAQ
What is the maximum operating temperature range for the MAX3203EETT+T?
The MAX3203EETT+T is specified to operate reliably from -40°C to +85°C ambient temperature. This range is fully supported across all electrical parameters in the datasheet, including leakage current, clamp voltage, and ESD protection performance. Thermal design must account for the 42°C/W junction-to-ambient resistance of the TDFN-EP package to ensure junction temperature remains below +150°C under worst-case power dissipation.
Does the MAX3203EETT+T require an external bypass capacitor, and if so, where should it be placed?
Yes, the MAX3203EETT+T requires a 0.1µF low-ESR ceramic capacitor between VCC and GND. Per the datasheet layout guidelines, this capacitor must be placed within 1mm of the VCC (pin 5) and GND (pin 4) terminals to minimize loop inductance. Failure to place it correctly degrades clamp performance during IEC 61000-4-2 events, as the capacitor absorbs charge from +8kV contact discharge transients and stabilizes the VCC rail during positive ESD pulses.
Can the MAX3203EETT+T protect signals operating at 1.8V logic levels?
Yes, the MAX3203EETT+T supports supply voltages from +0.9V to +5.5V, making it fully compatible with 1.8V I/O domains. At 1.8V VCC, its positive clamp voltage is approximately VCC + VF ≈ 2.45V (using VF = 0.65V min), well within safe tolerance for 1.8V-tolerant receivers. The 5pF capacitance also ensures minimal impact on rise/fall times of 1.8V high-speed signals such as USB Full-Speed or camera interfaces.
Is the exposed pad (EP) on the MAX3203EETT+T electrically connected, and how must it be handled in layout?
Yes, the exposed pad (EP) on the MAX3203EETT+T is internally connected to GND and must be soldered to a dedicated PCB GND plane. It serves both thermal conduction (θJC = 9°C/W) and low-inductance ESD current return. Layout requires ≥90% solder paste coverage on the EP pad, connection to inner-layer GND planes via ≥4 thermal vias (0.3mm diameter), and avoidance of signal traces beneath the pad to prevent coupling.
How does the MAX3203EETT+T differ from the MAX3202EETT+T in terms of channel count and application fit?
The MAX3203EETT+T provides three ESD-protected channels versus two in the MAX3202EETT+T. This makes the MAX3203EETT+T the designated solution for USB On-The-Go (requiring D+, D−, and ID lines) and three-wire video interfaces, whereas the MAX3202EETT+T targets standard USB 2.0 (D+/D− only). Both share identical 5pF capacitance, ±15kV HBM rating, and TDFN-EP packaging - but channel count drives functional compatibility.
MAX3203EETT+T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Package/Case:
- 6-WDFN Exposed Pad
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Steering (Rail to Rail)
- Unidirectional Channels:
- 3
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- -
- Voltage - Breakdown (Min):
- -
- Voltage - Clamping (Max) @ Ipp:
- -
- Current - Peak Pulse (10/1000µs):
- -
- Power - Peak Pulse:
- -
- Power Line Protection:
- No
- Applications:
- USB OTG
- Capacitance @ Frequency:
- -
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 6-TDFN (3x3)
MAX3203EETT+T FAQ
1.How can I place an order for MAX3203EETT+T through Aetrix?
Please submit a Request for Quotation (RFQ) for MAX3203EETT+T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MAX3203EETT+T reliable?
The price and inventory of MAX3203EETT+T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MAX3203EETT+T is usually 5 days.
3.What payment methods are accepted for MAX3203EETT+T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MAX3203EETT+T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MAX3203EETT+T?
MAX3203EETT+T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MAX3203EETT+T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MAX3203EETT+T?
For technical support, including MAX3203EETT+T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MAX3203EETT+T requirements.
6.How does Aetrix verify that MAX3203EETT+T is sourced from the original manufacturer or authorized distributors?
All MAX3203EETT+T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MAX3203EETT+T meets industry standards.
7.What is the process for return or replacement of MAX3203EETT+T?
All MAX3203EETT+T units undergo pre-shipment inspection (PSI). If there is an issue with MAX3203EETT+T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MAX3203EETT+T part is unused and in its original packaging.
Return procedure for MAX3203EETT+T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MAX3203EETT+T Tags
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