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Analog Devices Inc./Maxim Integrated MAX3203EETT-T
- Part No.:
- MAX3203EETT-T
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Category:
- TVS Diodes
- Package:
- 6-WDFN Exposed Pad
- Datasheet:
-
MAX3203EETT-T.pdf
- Description:
- ESD PROTECTION ARRAY
- Quantity:
- Payment:
- Shipping:
Inventory:12,500
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Product details
Overview
MAX3203EETT-T from Maxim Integrated is a triple-channel ±15kV ESD protection diode array in a 6-pin TDFN-EP package, designed to safeguard high-speed data lines in USB On-the-Go and video interfaces. It delivers 5pF per channel input capacitance, ±8kV IEC 61000-4-2 contact discharge protection, and operates from +0.9V to +5.5V supply voltage - enabling robust transient suppression without signal integrity degradation in portable video systems.
For engineers reviewing the MAX3203EETT-T datasheet, MAX3203EETT-T pinout, MAX3203EETT-T application, or MAX3203EETT-T equivalent, key selection criteria include channel count (3), low 5pF capacitance for >480Mbps USB 2.0 compatibility, ±15kV HBM/±15kV air-gap ESD rating, clamp voltage ≤VCC + 60V under IEC contact discharge, and thermal performance (θJA = 42°C/W) in the 3mm × 3mm TDFN package.
Technical Context
The MAX3203EETT-T implements a dual-diode steering architecture per channel: one anode-connected to VCC and one cathode-connected to GND, enabling bidirectional clamping of ESD transients to either rail. Its BiCMOS process ensures stable leakage (<1nA at +50°C) and fast response to sub-nanosecond ESD pulses.
Clamp behavior follows VC = VCC + VF for positive transients and VC = –VF for negative transients under ideal conditions, with real-world performance dependent on PCB layout parasitics - especially trace inductance affecting peak clamp voltage during ±45A air-gap discharge events.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| ESD Protection Level | ±15kV Human Body Model - withstands direct human touch discharge without failure |
| IEC 61000-4-2 Rating | ±8kV Contact Discharge - meets Level 4 immunity for industrial/commercial equipment |
| Channel Input Capacitance | 5pF (typ) at VCC/2 bias - preserves signal integrity on USB 2.0 and SVGA video lines |
| Supply Voltage Range | +0.9V to +5.5V - supports single-supply operation across 1.8V, 3.3V, and 5V systems |
| Leakage Current | ≤1nA (max) at +50°C - prevents DC loading on sensitive analog or high-impedance data lines |
| Clamp Voltage (IEC Contact) | VCC + 60V (positive), –60V (negative) at 24A - defines maximum transient voltage seen by protected IC |
| Operating Temperature | –40°C to +85°C - qualified for automotive infotainment and industrial handheld environments |
Pinout & Package
MAX3203EETT-T uses a 6-pin TDFN-EP (3mm × 3mm) package with exposed pad (EP) requiring connection to GND for optimal thermal and ESD current path performance.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | I/O1 | First ESD-protected data line - connects directly to connector or high-speed interface pin |
| 2 | I/O2 | Second ESD-protected data line - independent channel with identical clamping characteristics |
| 3 | I/O3 | Third ESD-protected data line - enables full USB OTG D+, D–, and ID line protection in one device |
| 4 | GND | Ground reference for ESD current return path - must be low-inductance connection to system ground plane |
| 5 | VCC | Positive supply rail - bypassed with 0.1µF ceramic capacitor near pin to absorb positive ESD energy |
| 6 | N.C. | No internal connection - left unconnected; not used for signal or power routing |
| EP | Exposed Pad | Thermal and ESD current sink - must be soldered to solid GND copper area for θJA = 42°C/W performance |
Key Features
| Feature | Design Value |
|---|---|
| Triple-channel ESD protection | Single-package solution for USB OTG (D+, D–, ID) or RGB video (R/G/B) signal lines |
| 5pF channel capacitance | Enables <1% signal distortion on 480Mbps USB 2.0 differential pairs and 60MHz SVGA pixel clocks |
| ±15kV air-gap discharge rating | Validated against IEC 61000-4-2 Annex A - critical for consumer-facing ports subject to casual handling |
| Low 1nA max leakage | Prevents DC offset or bias shift in analog video drivers and high-impedance sensor interfaces |
| TDFN-EP thermal performance | θJA = 42°C/W enables reliable operation at 70°C ambient without derating in compact handheld PCBs |
Applications
| USB On-the-Go Interface | SVGA Video Output |
|---|---|
|
Use Scenario: Protecting micro-AB receptacle pins (D+, D–, ID) on smartphones and tablets during cable insertion/removal and user handling. IC Role / Device Role / Timing Role: ESD transient shunt - routes ±15kV HBM and ±8kV IEC contact discharge energy away from USB PHY transceivers. Use Value: Prevents latch-up or gate oxide damage in USB 2.0 PHYs while maintaining <5pF loading for full-speed signaling compliance. |
Use Scenario: Shielding RGB analog video outputs on portable media players and docking stations from ESD events at SVGA connectors. IC Role / Device Role / Timing Role: Low-capacitance clamp - suppresses transients on R/G/B lines without degrading rise/fall times or introducing ghosting. Use Value: Maintains 60MHz pixel clock fidelity and color accuracy by limiting channel capacitance to 5pF and leakage to <1nA. |
| Mobile Phone Connector | High-Speed Data Port |
|
Use Scenario: Safeguarding multi-function 3.5mm audio/video jacks or proprietary docking connectors in smartphones against repeated plug/unplug ESD stress. IC Role / Device Role / Timing Role: Multi-line transient absorber - provides three independent protection paths for composite signals (e.g., audio L/R + video). Use Value: Eliminates need for discrete diodes per line, reducing BOM count and PCB area while ensuring ±15kV air-gap compliance. |
Use Scenario: Securing high-speed serial links (e.g., MIPI D-PHY lanes, eMMC command lines) on compact embedded modules where board space limits discrete protection. IC Role / Device Role / Timing Role: Signal-line guardian - clamps ESD-induced overvoltage before it reaches SoC I/O cells, preserving long-term reliability. Use Value: Enables use of smaller 3mm × 3mm TDFN footprint versus larger arrays, supporting miniaturized designs without sacrificing ESD margin. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPD3F303DQAR | 3-channel, 5.5V max VCC, 5.5pF capacitance, ±12kV HBM only - no IEC 61000-4-2 certification | Limited to HBM-only environments; unsuitable for CE-marked products requiring IEC Level 4 compliance | Select when cost sensitivity outweighs regulatory requirements and system-level testing validates robustness |
| SP3003-03UTG | 3-channel, 5V max VCC, 0.6pF capacitance, ±15kV HBM/±8kV IEC - lower capacitance but higher dynamic resistance | Better for >1Gbps interfaces (e.g., USB 3.0 SS), but clamp voltage exceeds VCC + 100V under IEC air-gap | Choose for ultra-high-speed lines where 0.6pF is mandatory, accepting higher clamp voltage and tighter layout constraints |
Compared with TPD3F303DQAR and SP3003-03UTG, the MAX3203EETT-T uniquely balances certified ±8kV IEC 61000-4-2 compliance, 5pF capacitance, and VCC + 60V clamp voltage - making it the preferred choice for USB OTG and SVGA video designs requiring both regulatory approval and signal fidelity.
Availability
MAX3203EETT-T is available at Aetrix Electronics and suitable for USB On-the-Go interfaces, SVGA video outputs, mobile phone connectors, and high-speed data ports requiring stable component supply across production lifecycles.
Supply support for MAX3203EETT-T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Maxim Integrated (now part of Analog Devices) is a U.S.-based semiconductor company specializing in high-performance analog, mixed-signal, and power management ICs for industrial, communications, and consumer applications.
The MAX320x series was developed specifically for high-speed digital interface protection - targeting USB, video, and portable connectivity where low capacitance, certified ESD robustness, and miniature packaging are essential design constraints.
FAQ
What is the maximum operating temperature range for the MAX3203EETT-T?
The MAX3203EETT-T is specified for continuous operation from –40°C to +85°C ambient temperature. This range covers industrial and extended commercial environments, including handheld devices exposed to direct sunlight or automotive infotainment enclosures. Thermal derating begins above +70°C, with power dissipation reduced by 24.4mW/°C in its 6-pin TDFN-EP package.
Does the MAX3203EETT-T require an external bypass capacitor?
Yes, the MAX3203EETT-T requires a 0.1µF low-ESR ceramic capacitor placed between VCC and GND, mounted as close as possible to the VCC pin. This capacitor absorbs charge from positive ESD transients and stabilizes the supply rail during clamping events - omission risks elevated clamp voltage and potential damage to downstream ICs.
Can the MAX3203EETT-T protect USB 2.0 high-speed (480Mbps) signals without signal degradation?
Yes, the MAX3203EETT-T's 5pF typical input capacitance per channel introduces negligible impedance at 240MHz (USB 2.0 fundamental frequency), preserving signal rise/fall times and eye diagram integrity. Layout best practices - short traces, ground plane proximity, and proper VCC bypassing - are essential to maintain this performance in-system.
What is the function of Pin 6 (N.C.) on the MAX3203EETT-T?
Pin 6 on the MAX3203EETT-T is marked N.C. (No Connection) and has no internal bond wire or circuit connection. It must remain unconnected in the PCB layout - routing signals or power to this pin may cause mechanical stress or unintended coupling. The exposed pad (EP) is the sole ground thermal path and must be soldered to GND.
How does the MAX3203EETT-T achieve ±15kV ESD protection while maintaining low capacitance?
The MAX3203EETT-T achieves ±15kV ESD protection through optimized silicon geometry and BiCMOS process tuning - enabling low-leakage, low-capacitance steering diodes that activate rapidly under transient overvoltage. Its 5pF capacitance results from minimized junction area and precise doping profiles, verified across wafer lots using automated C-V characterization.
MAX3203EETT-T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Package/Case:
- 6-WDFN Exposed Pad
- Series:
- -
- Packaging:
- Bulk
- Product Status:
- Active
- Type:
- Steering (Rail to Rail)
- Unidirectional Channels:
- 3
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- 5.5V (Max)
- Voltage - Breakdown (Min):
- -
- Voltage - Clamping (Max) @ Ipp:
- 100V
- Current - Peak Pulse (10/1000µs):
- -
- Power - Peak Pulse:
- -
- Power Line Protection:
- No
- Applications:
- General Purpose
- Capacitance @ Frequency:
- -
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 6-TDFN-EP (3x3)
MAX3203EETT-T FAQ
1.How can I place an order for MAX3203EETT-T through Aetrix?
Please submit a Request for Quotation (RFQ) for MAX3203EETT-T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MAX3203EETT-T reliable?
The price and inventory of MAX3203EETT-T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MAX3203EETT-T is usually 5 days.
3.What payment methods are accepted for MAX3203EETT-T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MAX3203EETT-T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MAX3203EETT-T?
MAX3203EETT-T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MAX3203EETT-T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MAX3203EETT-T?
For technical support, including MAX3203EETT-T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MAX3203EETT-T requirements.
6.How does Aetrix verify that MAX3203EETT-T is sourced from the original manufacturer or authorized distributors?
All MAX3203EETT-T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MAX3203EETT-T meets industry standards.
7.What is the process for return or replacement of MAX3203EETT-T?
All MAX3203EETT-T units undergo pre-shipment inspection (PSI). If there is an issue with MAX3203EETT-T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MAX3203EETT-T part is unused and in its original packaging.
Return procedure for MAX3203EETT-T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MAX3203EETT-T Tags
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