Analog Devices Inc./Maxim Integrated MAX3204EETT+T
- Part No.:
- MAX3204EETT+T
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Category:
- TVS Diodes
- Package:
- 6-WDFN Exposed Pad
- Datasheet:
-
MAX3204EETT+T.pdf
- Description:
- TVS DIODE 6TDFN
- Quantity:
- Payment:

- Shipping:

Inventory:6,358
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MAX3204EETT+T from Maxim Integrated is a quad-channel, low-capacitance ESD protection diode array designed to safeguard high-speed data lines in Ethernet and FireWire® interfaces. It delivers ±15kV HBM, ±8kV IEC 61000-4-2 contact, and ±15kV air-gap ESD protection, with 5pF per channel capacitance, 1nA max leakage current, and operation from +0.9V to +5.5V supply.
For engineers reviewing the MAX3204EETT+T datasheet, MAX3204EETT+T pinout, MAX3204EETT+T application, or MAX3204EETT+T equivalent, key selection criteria include channel count (4), ultra-low input capacitance for signal integrity, IEC/ESD compliance level, TDFN-EP package thermal performance (θJA = 42°C/W), and compatibility with 3.3V/5V data bus voltage rails.
Technical Context
The MAX3204EETT+T implements a bidirectional diode-steering architecture that routes ESD transients to VCC or GND via internal clamping diodes. Each of its four I/O channels features matched forward voltage (VF = 0.65–0.95V at 10mA) and symmetrical ±100V clamp voltage under ±15kV IEC 61000-4-2 air-gap discharge (IF = 45A).
It operates across -40°C to +85°C and requires external 0.1µF ceramic bypassing between VCC and GND to maintain effective clamping during high-di/dt events. Its BiCMOS process ensures stable leakage (<1nA) and low parasitic capacitance independent of bias voltage.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| ESD Protection Level | ±15kV HBM, ±8kV IEC contact, ±15kV IEC air-gap - meets Level 4 immunity per IEC 61000-4-2 |
| Channel Count | 4 independent ESD-protected I/O lines - matches Ethernet (10/100/1000BASE-T) differential pair requirements |
| Input Capacitance | 5pF per channel at VCC/2 bias - preserves signal integrity on >100MHz data lines without added jitter |
| Clamp Voltage | +VCC + 100V / -100V peak under ±15kV IEC air-gap - defines maximum transient overvoltage seen by protected IC |
| Leakage Current | ±1nA max at 0°C to +50°C - avoids DC loading on high-impedance receivers or pull-up networks |
| Supply Range | +0.9V to +5.5V - supports legacy 3.3V and modern 1.8V/2.5V/5V interface rails |
| Package Thermal Resistance | θJA = 42°C/W (TDFN-EP) - enables reliable operation at 70°C ambient with <200mW dissipation |
Pinout & Package
The MAX3204EETT+T is housed in a 6-pin TDFN-EP package (3mm × 3mm, 0.75mm height) with exposed thermal pad connected to GND. Pin 1 is I/O1; Pin 2 is I/O2; Pin 3 is GND; Pin 4 is I/O3; Pin 5 is I/O4; Pin 6 is VCC. The EP pad must be soldered to a GND copper pour for thermal and ESD return path integrity.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | I/O1 | ESD-protected bidirectional data line - connects directly to Ethernet PHY TX+/RX+ or FireWire D+ pins |
| 2 | I/O2 | ESD-protected bidirectional data line - pairs with I/O1 for differential signaling |
| 3 | GND | Primary ESD current return path - must be low-inductance connection to system ground plane |
| 4 | I/O3 | ESD-protected bidirectional data line - used for second differential pair (e.g., TX-/RX-) |
| 5 | I/O4 | ESD-protected bidirectional data line - completes quad-channel protection set |
| 6 | VCC | Clamp voltage reference rail - bypassed with 0.1µF ceramic capacitor to GND for charge absorption |
| EP | Exposed Pad | Thermal and ESD return path - must be soldered to GND plane; contributes to θJC = 9°C/W |
Key Features
| Feature | Design Value |
|---|---|
| Quad-channel ESD protection | Enables full differential-pair coverage for 100BASE-TX or FireWire 400 without multiple discrete devices |
| 5pF channel capacitance | Minimizes insertion loss and phase distortion on 100MHz+ signals - critical for Ethernet eye diagram compliance |
| ±15kV IEC air-gap rating | Validated for real-world handling environments where ungrounded personnel approach connectors |
| 1nA max leakage | Prevents false logic states or bias shift in high-impedance USB/PCIe receiver inputs |
| TDFN-EP thermal performance | 42°C/W θJA allows sustained operation in compact industrial enclosures without forced airflow |
Applications
| Ethernet Interface Protection | FireWire® Data Line Protection |
|---|---|
Use Scenario: Protecting 10/100/1000BASE-T PHY transceivers on RJ-45 connector PCBs against user-handling ESD events. IC Role / Device Role / Timing Role: Bidirectional clamping diode array placed between magnetics and PHY IC, shunting ESD current to VCC/GND before it reaches sensitive analog front-end. Use Value: Maintains Ethernet link integrity after repeated ±15kV air-gap discharges - eliminates field failures due to PHY latch-up or gate oxide damage. | Use Scenario: Securing FireWire 400 (IEEE 1394a) data lines (TPA/TPB) on laptop docking stations exposed to frequent cable insertion/removal. IC Role / Device Role / Timing Role: Quad-channel ESD suppressor mounted adjacent to FireWire connector, providing symmetrical protection for both differential pairs. Use Value: Prevents permanent damage to FireWire link-layer controllers during hot-plug events - ensures guaranteed 400Mbps data transfer continuity. |
| Industrial Video Interface Protection | Embedded Networking Module Protection |
Use Scenario: Shielding SVGA video timing signals (Hsync/Vsync, R/G/B) routed through panel connectors in factory automation HMIs. IC Role / Device Role / Timing Role: Low-capacitance ESD array placed at connector entry point, preserving edge rates of 25–65MHz pixel clock and sync signals. Use Value: Eliminates video artifacts (snow, tearing) caused by ESD-induced transient coupling into analog video paths. | Use Scenario: Hardening Ethernet-enabled programmable logic controllers (PLCs) against ESD in electrically noisy manufacturing floors. IC Role / Device Role / Timing Role: Front-line ESD guard for industrial-grade PHYs operating in extended temperature range (-40°C to +85°C). Use Value: Ensures uninterrupted Modbus TCP communication during maintenance technician interaction with field I/O modules. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SP3012-04UTG | 4-channel, 0.3pF lower capacitance (4.7pF), higher clamp voltage (+VCC + 120V), SOT-143 package | Better suited for >1Gbps interfaces but less robust for ±15kV air-gap in space-constrained layouts | Select when signal bandwidth exceeds 1.25GHz and board layout permits larger footprint |
| TPD4E001DQAR | 4-channel, same 5pF capacitance, lower ±12kV HBM rating, X2SON package (1.0mm × 1.5mm) | Optimized for ultra-compact portable designs but does not meet full ±15kV IEC air-gap requirement | Choose for wearables or handhelds where size dominates over worst-case ESD survivability |
Compared with SP3012-04UTG and TPD4E001DQAR, the MAX3204EETT+T uniquely balances full IEC Level 4 compliance, industry-standard TDFN thermal performance, and proven reliability in Ethernet infrastructure - making it the preferred choice for industrial and networking equipment requiring certified ESD resilience.
Availability
MAX3204EETT+T is available at Aetrix Electronics and suitable for Ethernet PHY protection, FireWire® interface hardening, and industrial video signal conditioning requiring stable component supply across multi-year production cycles.
Supply support for MAX3204EETT+T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Maxim Integrated (now part of Analog Devices) is a U.S.-based semiconductor company specializing in high-performance analog, mixed-signal, and power management ICs for industrial, communications, and computing markets.
The MAX320x family was engineered specifically for high-speed serial interface ESD protection - prioritizing ultra-low capacitance, precise clamp voltage control, and compact packaging to enable robust connectivity in space- and signal-integrity-constrained systems.
FAQ
What is the maximum operating temperature range for the MAX3204EETT+T?
The MAX3204EETT+T is specified to operate reliably from -40°C to +85°C ambient temperature. This range covers industrial and commercial environments including factory-floor PLCs, network switches, and embedded video systems. Its BiCMOS process and TDFN-EP package ensure stable leakage current and clamping behavior across this full span, with no derating required up to +85°C.
Does the MAX3204EETT+T require an external bypass capacitor, and if so, what value?
Yes, the MAX3204EETT+T requires a 0.1µF ceramic capacitor placed between VCC and GND, mounted as close as possible to the device's VCC and GND pins. This capacitor absorbs charge injected during IEC 61000-4-2 contact discharge events (e.g., ±8kV), preventing VCC rail collapse and maintaining consistent clamp voltage. Failure to include this capacitor degrades ESD protection effectiveness and may cause downstream IC malfunction.
Can the MAX3204EETT+T protect both positive and negative ESD transients?
Yes, the MAX3204EETT+T provides symmetrical bidirectional protection. Its internal diode architecture steers positive transients to VCC and negative transients to GND, delivering ±15kV Human Body Model, ±8kV IEC 61000-4-2 contact, and ±15kV air-gap discharge protection on all four channels. This ensures robust defense against ESD events regardless of polarity or discharge method encountered in real-world use.
How does the 5pF input capacitance of the MAX3204EETT+T impact high-speed Ethernet signals?
The 5pF per-channel capacitance of the MAX3204EETT+T introduces negligible loading on 100BASE-TX (125MHz symbol rate) and 1000BASE-T (125MHz per pair) signals. Measured insertion loss remains below 0.5dB up to 250MHz, preserving Ethernet eye opening and jitter margin. This enables direct placement at RJ-45 magnetics outputs without equalization or signal conditioning - a key advantage over higher-capacitance alternatives.
Is the exposed pad (EP) on the MAX3204EETT+T package required to be connected to ground?
Yes, the exposed pad (EP) on the MAX3204EETT+T must be soldered to a solid GND copper pour. It serves dual functions: (1) thermal dissipation, contributing to θJC = 9°C/W, and (2) low-inductance ESD current return path. Leaving the EP floating compromises both thermal performance and ESD clamping efficacy - especially under high-di/dt events like ±15kV air-gap discharge where return path inductance directly elevates clamp voltage.
MAX3204EETT+T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Package/Case:
- 6-WDFN Exposed Pad
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Steering (Rail to Rail)
- Unidirectional Channels:
- 4
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- -
- Voltage - Breakdown (Min):
- -
- Voltage - Clamping (Max) @ Ipp:
- -
- Current - Peak Pulse (10/1000µs):
- -
- Power - Peak Pulse:
- -
- Power Line Protection:
- No
- Applications:
- Ethernet
- Capacitance @ Frequency:
- -
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 6-TDFN (3x3)
MAX3204EETT+T FAQ
1.How can I place an order for MAX3204EETT+T through Aetrix?
Please submit a Request for Quotation (RFQ) for MAX3204EETT+T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MAX3204EETT+T reliable?
The price and inventory of MAX3204EETT+T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MAX3204EETT+T is usually 5 days.
3.What payment methods are accepted for MAX3204EETT+T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MAX3204EETT+T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MAX3204EETT+T?
MAX3204EETT+T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MAX3204EETT+T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MAX3204EETT+T?
For technical support, including MAX3204EETT+T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MAX3204EETT+T requirements.
6.How does Aetrix verify that MAX3204EETT+T is sourced from the original manufacturer or authorized distributors?
All MAX3204EETT+T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MAX3204EETT+T meets industry standards.
7.What is the process for return or replacement of MAX3204EETT+T?
All MAX3204EETT+T units undergo pre-shipment inspection (PSI). If there is an issue with MAX3204EETT+T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MAX3204EETT+T part is unused and in its original packaging.
Return procedure for MAX3204EETT+T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MAX3204EETT+T Tags

-
ESD9B5.0ST5G
onsemi

-
DESD3V3E1BL-7B
Diodes Incorporated

-
ESD5Z3.3T1G
onsemi

-
D5V0H1B2LP-7B
Diodes Incorporated

-
D5V0P1B2LP-7B
Diodes Incorporated

-
DESD5V0U1BA-7
Diodes Incorporated

-
ESD5Z5.0T1G
onsemi

-
DESD5V0U1BB-7
Diodes Incorporated

-
D12V0L1B2LP-7B
Diodes Incorporated

-
PESD2V0Y1BSFYL
Nexperia USA Inc.

-
DF2S5M4CT,L3F
Toshiba Semiconductor and Storage

-
D5V0L1B2WS-7
Diodes Incorporated
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

