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Analog Devices Inc./Maxim Integrated MAX3206EETC+
- Part No.:
- MAX3206EETC+
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Category:
- TVS Diodes
- Package:
- 12-WQFN Exposed Pad
- Datasheet:
-
MAX3206EETC+.pdf
- Description:
- TVS DIODE 12TQFN
- Quantity:
- Payment:
- Shipping:
Inventory:127
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Product details
Overview
The MAX3206EETC+ from Maxim Integrated is a six-channel, low-capacitance ESD protection diode array designed to safeguard high-speed data lines-including cell phone connectors and SVGA video interfaces-against ±15kV HBM, ±8kV IEC 61000-4-2 contact discharge, and ±15kV air-gap discharge events. It features 5pF per-channel input capacitance, 1nA max leakage current, and operates from +0.9V to +5.5V supply voltage.
For engineers reviewing the MAX3206EETC+ datasheet, MAX3206EETC+ pinout, MAX3206EETC+ application, or MAX3206EETC+ equivalent, key selection criteria include channel count (6), ultra-low capacitance for signal integrity, IEC 61000-4-2 Level 4 compliance, thermal performance in 12-pin TQFN-EP package, and compatibility with USB 2.0, SVGA, and mobile interface layouts.
Technical Context
The MAX3206EETC+ implements a bidirectional diode-steering architecture that routes ESD transients to VCC or GND via integrated clamping diodes. Each of its six I/O channels is independently protected with matched forward voltage (VF = 0.65–0.95V at 10mA) and clamp voltage limits of VCC + 25V (HBM), VCC + 60V (IEC contact), and VCC + 100V (IEC air-gap).
It requires external 0.1µF ceramic bypassing between VCC and GND to absorb transient energy and stabilize clamping behavior under ±8kV IEC contact discharge (24A peak). The device operates across –40°C to +85°C and relies on low-parasitic PCB layout-especially minimized trace inductance-to maintain effective clamp voltage at the protected node.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| ESD Protection Level | ±15kV HBM, ±8kV IEC 61000-4-2 contact, ±15kV air-gap - meets IEC Level 4 for system-level immunity |
| Channel Count | 6 independent ESD-protected I/O lines - matches multi-lane interfaces like SVGA (RGBHV) or mobile docking connectors |
| Input Capacitance | 5pF per channel at VCC/2 bias - preserves signal integrity up to ~500Mbps without measurable rise-time degradation |
| Leakage Current | ±1nA max per channel at 0°C to +50°C - avoids DC loading on high-impedance video or USB D+/D− lines |
| Supply Voltage Range | +0.9V to +5.5V - supports single-supply operation across 1.8V, 3.3V, and 5V logic domains |
| Clamp Voltage (IEC Air-Gap) | VCC + 100V (at 45A, 1ns di/dt) - defines worst-case overvoltage seen by downstream ICs during fast transients |
| Operating Temperature | –40°C to +85°C - qualified for industrial and consumer portable equipment environments |
Pinout & Package
The MAX3206EETC+ is housed in a 12-pin TQFN-EP package (4mm × 4mm, 0.75mm height) with exposed pad (EP) for thermal and grounding enhancement. Pin 11 is VCC, Pin 5 is GND, Pins 1–4, 7–9 are I/O_ channels, and Pins 6, 10, 12 are no-connect (N.C.). EP must be soldered to a solid GND plane.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3, 4, 7, 8 | I/O_ (Channels 1–6) | ESD-protected bidirectional signal terminals - connect directly to connector pins or high-speed traces |
| 5 | GND | Primary ground return for ESD current shunting - must tie to low-inductance GND plane |
| 11 | VCC | Power rail for positive transient clamping - requires local 0.1µF ceramic bypass to Pin 5 |
| 6, 10, 12 | N.C. | No internal connection - leave unconnected or float; no routing or stitching required |
| EP | Exposed Pad | Thermal and electrical GND path - must be soldered to ≥40mm² GND copper area for θJA = 41°C/W |
Key Features
| Feature | Design Value |
|---|---|
| 6-channel ESD protection | Enables full-interface protection (e.g., SVGA RGBHV + sync, or 6-line mobile dock) in one footprint |
| 5pF channel capacitance | Minimizes signal distortion on >100MHz video or USB 2.0 differential pairs without equalization |
| ±15kV HBM / ±15kV IEC air-gap | Exceeds EN 61000-4-2 Level 4 requirements for handheld and peripheral product certifications |
| 1nA max leakage at +50°C | Prevents false triggering or DC offset in analog video paths and high-Z USB idle states |
| 12-pin TQFN-EP package | Offers superior thermal dissipation (θJC = 6°C/W) vs. WLP variants - critical for sustained surge handling |
Applications
| Cell Phone Connectors | SVGA Video Interfaces |
|---|---|
Use Scenario: Protecting micro-USB, MHL, or proprietary docking connectors on smartphones against user-handling ESD. IC Role / Device Role / Timing Role: Front-end transient suppressor placed between connector and baseband processor or PMIC interface. Use Value: Prevents latch-up or gate oxide damage in 28nm/40nm SoCs while maintaining <10ps added jitter on high-speed lanes. |
Use Scenario: Shielding RGBHV analog video signals in portable projectors or docking stations from cable-discharge events. IC Role / Device Role / Timing Role: Low-capacitance clamp on each video line to limit overvoltage without attenuating 15.75kHz horizontal sync or 640×480 bandwidth. Use Value: Eliminates visible "snow" or color shift during hot-plug by clamping transients below 100V peak at the ADC input. |
| USB 2.0 Host Ports | Industrial Display Interfaces |
Use Scenario: Hardening USB 2.0 upstream ports on embedded controllers or hubs against repeated plug/unplug ESD. IC Role / Device Role / Timing Role: Dual-channel protection (D+, D−) plus VBUS and ID lines - MAX3206EETC+ covers all six with shared VCC/GND. Use Value: Maintains eye diagram compliance at 480Mbps while surviving >10,000 contact-discharge cycles per port. |
Use Scenario: Securing VGA or custom parallel video buses in factory HMIs where cables are frequently routed near motors or relays. IC Role / Device Role / Timing Role: Six-channel guard for red/green/blue/horizontal/vertical/data-enable lines against induced surges. Use Value: Avoids firmware resets or display corruption caused by 4kV burst noise coupling into analog video rails. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPD6E001DRBR | 6-channel, 3pF/channel, ±12kV HBM, no VCC pin - uses GND-only clamping | Lacks VCC-referenced clamping; lower capacitance suits >1Gbps links but less effective on noisy power rails | Choose when board lacks clean local VCC or requires lowest possible CIN; verify downstream IC can tolerate higher negative clamp voltage |
| SP3206-01UTG | 6-channel, 5.5pF/channel, ±15kV HBM, ±8kV IEC, 3.3V fixed VCC range only | Fixed 3.3V operation restricts use in 1.8V or 5V systems; identical TQFN-12 footprint | Select for drop-in replacement in existing 3.3V designs; not suitable for mixed-voltage interfaces without level-shifting |
Compared with MAX3206EETC+, TPD6E001DRBR offers lower capacitance but sacrifices VCC-assisted clamping headroom, while SP3206-01UTG matches mechanical fit and ESD rating but locks supply voltage-making MAX3206EETC+ the only option supporting 0.9V–5.5V universal interfacing with optimal transient energy diversion.
Availability
The MAX3206EETC+ is available at Aetrix Electronics and suitable for cell phone connector hardening, SVGA video interface protection, and USB 2.0 host port hardening requiring stable component supply across production lifecycles.
Supply support for MAX3206EETC+ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Maxim Integrated (now part of Analog Devices) designs precision analog, mixed-signal, and high-reliability ICs for industrial, automotive, and communications markets.
The MAX320x series targets high-speed interface protection, delivering low-capacitance ESD arrays optimized for USB, video, and mobile connectivity where signal fidelity and robustness must coexist.
FAQ
What is the maximum operating temperature range for the MAX3206EETC+?
The MAX3206EETC+ is specified to operate reliably from –40°C to +85°C. This range is validated per JEDEC JESD22-A104 thermal cycling and JESD22-A108 high-temperature operating life tests, ensuring suitability for consumer handhelds and industrial displays without derating.
Does the MAX3206EETC+ require an external bypass capacitor?
Yes, the MAX3206EETC+ requires a 0.1µF low-ESR ceramic capacitor placed between Pin 11 (VCC) and Pin 5 (GND), mounted within 2mm of the package. This capacitor absorbs transient energy during ±8kV IEC contact discharge (24A peak) and stabilizes clamping voltage-omission risks exceeding downstream IC absolute maximum ratings.
Can the MAX3206EETC+ be used on 1.8V logic interfaces?
Yes, the MAX3206EETC+ supports supply voltages from +0.9V to +5.5V. At 1.8V, its clamp voltage remains VCC + 25V (HBM) or VCC + 100V (IEC air-gap), and leakage stays ≤1nA - making it compatible with 1.8V FPGA I/O banks, mobile AP interfaces, and low-power display drivers without level shifters.
What is the thermal resistance of the MAX3206EETC+ in its TQFN-EP package?
The MAX3206EETC+ in the 12-pin TQFN-EP package has a junction-to-ambient thermal resistance (θJA) of 41°C/W and junction-to-case (θJC) of 6°C/W when mounted on a standard 4-layer PCB with full EP soldering to a 40mm² GND plane. This enables safe operation under repetitive 15kV ESD pulses without thermal runaway.
Are the N.C. pins on the MAX3206EETC+ required to be grounded or left floating?
The N.C. pins (6, 10, 12) on the MAX3206EETC+ are not internally connected and must be left electrically floating - no routing, stitching, or grounding is permitted. Connecting them may introduce parasitic coupling or violate internal isolation boundaries defined in the BiCMOS process design rules.
MAX3206EETC+ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Package/Case:
- 12-WQFN Exposed Pad
- Series:
- -
- Packaging:
- Tube
- Product Status:
- Active
- Type:
- Steering (Rail to Rail)
- Unidirectional Channels:
- 6
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- -
- Voltage - Breakdown (Min):
- -
- Voltage - Clamping (Max) @ Ipp:
- -
- Current - Peak Pulse (10/1000µs):
- -
- Power - Peak Pulse:
- -
- Power Line Protection:
- No
- Applications:
- General Purpose
- Capacitance @ Frequency:
- -
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 12-TQFN (4x4)
MAX3206EETC+ FAQ
1.How can I place an order for MAX3206EETC+ through Aetrix?
Please submit a Request for Quotation (RFQ) for MAX3206EETC+ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MAX3206EETC+ reliable?
The price and inventory of MAX3206EETC+ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MAX3206EETC+ is usually 5 days.
3.What payment methods are accepted for MAX3206EETC+?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MAX3206EETC+ transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MAX3206EETC+?
MAX3206EETC+ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MAX3206EETC+ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MAX3206EETC+?
For technical support, including MAX3206EETC+ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MAX3206EETC+ requirements.
6.How does Aetrix verify that MAX3206EETC+ is sourced from the original manufacturer or authorized distributors?
All MAX3206EETC+ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MAX3206EETC+ meets industry standards.
7.What is the process for return or replacement of MAX3206EETC+?
All MAX3206EETC+ units undergo pre-shipment inspection (PSI). If there is an issue with MAX3206EETC+, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MAX3206EETC+ part is unused and in its original packaging.
Return procedure for MAX3206EETC+:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MAX3206EETC+ Tags
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