My Inquiry
My Account
Analog Devices Inc./Maxim Integrated MAX3206EETC
- Part No.:
- MAX3206EETC
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Category:
- TVS Diodes
- Package:
- 12-WQFN Exposed Pad
- Datasheet:
-
MAX3206EETC.pdf
- Description:
- ESD PROTECTION ARRAY
- Quantity:
- Payment:
- Shipping:
Inventory:3,638
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
The MAX3206EETC from Maxim Integrated is a six-channel, low-capacitance ESD protection diode array designed to safeguard high-speed data lines in portable and interface electronics. It delivers ±15kV HBM, ±8kV IEC 61000-4-2 contact, and ±15kV air-gap ESD protection, features 5pF per channel input capacitance, 1nA max leakage current, and operates from +0.9V to +5.5V - making it suitable for cell phone connector and SVGA video interface protection.
For engineers reviewing the MAX3206EETC datasheet, MAX3206EETC pinout, MAX3206EETC application, or MAX3206EETC equivalent, this device is selected for high-speed signal integrity-critical designs where ultra-low capacitance, multi-line transient suppression, and compact TQFN packaging are required - especially in space-constrained mobile and display interfaces.
Technical Context
The MAX3206EETC integrates six independent bidirectional ESD protection diodes, each steered between I/O pins and VCC/GND rails to clamp transients during ±15kV HBM or ±15kV IEC air-gap events. Its BiCMOS process enables low forward voltage (0.65V typ at 10mA) and tight leakage control (±1nA over 0°C–50°C).
Clamp voltage is defined by diode forward drop plus supply rail offset: VC = VCC + VF for positive pulses, VC = –VF for negative pulses - with peak clamping limited to +100V/–100V under ±15kV IEC air-gap discharge (45A pulse). The 12-pin TQFN-EP package includes an exposed pad tied to GND for thermal and ESD return path integrity.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| ESD Protection Level | ±15kV Human Body Model - withstands direct human-touch discharge without latch-up or degradation. |
| IEC 61000-4-2 Rating | ±8kV contact / ±15kV air-gap - meets Level 4 immunity for industrial and consumer end-equipment certification. |
| Channel Input Capacitance | 5pF (typ) at 5V bias - preserves signal integrity on >480Mbps USB 2.0 and SVGA pixel clock lines. |
| Leakage Current | ±1nA max (0°C to +50°C) - avoids DC loading on high-impedance video or data lines. |
| Supply Voltage Range | +0.9V to +5.5V - supports single-supply operation across legacy 3.3V and modern 1.8V/2.5V I/O domains. |
| Operating Temperature | –40°C to +85°C - qualified for use in handheld devices and embedded display modules. |
| Clamp Voltage (IEC Air-Gap) | +100V / –100V at 45A - limits transient overshoot to safe levels for downstream PHY receivers. |
Pinout & Package
The MAX3206EETC is housed in a 12-pin TQFN-EP package (4mm × 4mm, 0.5mm pitch) with exposed thermal pad connected to GND. Pin 1 is marked by a dot; EP must be soldered to a GND plane for optimal ESD current shunting and thermal performance.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3, 7, 8, 9 | I/O1–I/O6 | ESD-protected bidirectional signal terminals - each connects to one high-speed line (e.g., D+, D–, R/G/B, HSYNC/VSYNC). |
| 4, 6, 10, 12 | N.C. | No internal connection - left floating or grounded per layout; no electrical function. |
| 5 | GND | Primary ground reference for ESD current return - must tie directly to low-inductance system GND plane. |
| 11 | VCC | Positive supply rail - bypassed with 0.1µF ceramic capacitor placed ≤2mm from pin to suppress supply bounce during clamping. |
| EP | Exposed Pad | Thermal and ESD return path - requires solid solder connection to GND plane; accounts for ~70% of total heat dissipation. |
Key Features
| Feature | Design Value |
|---|---|
| 6-channel ESD protection | Single-package solution for full SVGA RGBHV (5 lines) + auxiliary control or dual-lane USB 2.0 differential pairs. |
| 5pF channel capacitance | Enables <1% signal distortion on 25MHz SVGA pixel clocks and maintains USB 2.0 eye diagram compliance. |
| ±15kV HBM / ±15kV IEC air-gap | Exceeds IEC 61000-4-2 Level 4 requirements - validated for field-reliable consumer product deployment. |
| 1nA max leakage @ 50°C | Prevents DC offset accumulation in analog video paths and avoids false triggering in high-impedance detection circuits. |
| +0.9V to +5.5V supply range | Supports direct integration with 1.8V camera interfaces, 3.3V display controllers, and 5V legacy peripherals without level shifters. |
Applications
| Cell Phone Connectors | SVGA Video Interfaces |
|---|---|
|
Use Scenario: ESD protection for micro-USB, HDMI-Mini, or proprietary docking connectors exposed to frequent user handling. IC Role / Device Role / Timing Role: Transient voltage suppressor placed between connector pins and baseband/application processor I/O. Use Value: Prevents permanent damage to USB PHY or display interface circuitry during ±15kV human-body discharges - validated per IEC 61000-4-2. |
Use Scenario: Protection of red/green/blue/horizontal sync/vertical sync lines in portable projectors or docking stations. IC Role / Device Role / Timing Role: Low-capacitance clamp array preserving 25MHz pixel clock rise/fall times while diverting ESD energy to VCC/GND. Use Value: Maintains color fidelity and sync stability by limiting channel capacitance to 5pF and clamping transients to ±100V under 45A IEC air-gap pulses. |
| USB 2.0 High-Speed Ports | Industrial Display Modules |
|
Use Scenario: Front-panel USB ports on medical monitors or test equipment subject to repeated cable insertion/removal. IC Role / Device Role / Timing Role: Six-channel protector covering D+, D–, ID, VBUS sense, and two control lines in compact form factor. Use Value: Enables robust 480Mbps data transmission by holding inter-channel capacitance mismatch <0.3pF - critical for differential skew control. |
Use Scenario: Embedded SVGA output on factory HMIs or ruggedized tablets operating in electrostatic-prone environments. IC Role / Device Role / Timing Role: Primary ESD defense layer before display driver IC, rated for continuous –40°C to +85°C operation. Use Value: Guarantees long-term reliability via 0.9V–5.5V supply compatibility and 1nA leakage - avoids drift in analog RGB bias networks. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPD6E001DRBR | 6-channel, 3pF typical capacitance, ±12kV HBM, no VCC connection - uses GND-only clamping architecture. | Lower capacitance suits >1Gbps interfaces; lacks VCC-assisted clamping - higher negative clamp voltage (–16V vs –100V). | Select when minimizing capacitance is critical and system VCC rail cannot be used for ESD return. |
| ESD324DPMR | 6-channel, 5.5pF capacitance, ±15kV HBM, ±8kV IEC contact, but only –40°C to +85°C rating and no air-gap validation data published. | Validated for USB 2.0 and HDMI; lacks published ±15kV IEC air-gap performance - insufficient for stringent display interface certifications. | Choose for cost-sensitive USB applications where air-gap compliance is not mandated. |
Compared with TPD6E001DRBR and ESD324DPMR, the MAX3206EETC uniquely combines ±15kV IEC air-gap validation, VCC-assisted clamping for lower positive overshoot, and guaranteed 5pF capacitance - making it the preferred choice for certified SVGA and cell phone connector designs requiring full IEC 61000-4-2 Level 4 compliance.
Availability
The MAX3206EETC is available at Aetrix Electronics and suitable for cell phone connector protection, SVGA video interface hardening, and USB 2.0 port hardening requiring stable component supply across production lifecycles.
Supply support for MAX3206EETC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Maxim Integrated (now part of Analog Devices) is a U.S.-based semiconductor company specializing in high-performance analog, mixed-signal, and power management ICs for industrial, communications, and consumer markets.
The MAX3206EETC belongs to Maxim's ESD protection array product line, engineered specifically for high-speed digital interfaces where sub-6pF capacitance, multi-kV transient immunity, and miniature packaging are mandatory design constraints.
FAQ
What is the maximum clamping voltage of the MAX3206EETC under IEC 61000-4-2 air-gap discharge?
The MAX3206EETC exhibits a maximum clamp voltage of +100V for positive transients and –100V for negative transients when subjected to ±15kV IEC 61000-4-2 air-gap discharge (45A pulse). This value is measured at TA = +25°C with VCC = +5V and reflects the combined effect of diode forward voltage and parasitic inductance mitigation in optimized layouts. The MAX3206EETC datasheet specifies this limit in the Electrical Characteristics table under "Channel Clamp Voltage".
Does the MAX3206EETC require an external bypass capacitor, and if so, what value and placement is recommended?
Yes, the MAX3206EETC requires a 0.1µF low-ESR ceramic capacitor between VCC and GND. Maxim specifies this capacitor must be placed within 2mm of the MAX3206EETC's VCC (pin 11) and GND (pin 5) to minimize loop inductance and ensure effective absorption of ESD charge during clamping events. Failure to place the capacitor close to the device increases effective clamp voltage due to supply rail bounce - a key layout requirement documented in the MAX3206EETC Applications Information section.
Can the MAX3206EETC be used to protect USB 2.0 differential pairs without degrading signal integrity?
Yes, the MAX3206EETC is explicitly validated for USB 2.0 applications. With 5pF typical input capacitance per channel and matched pin-to-pin capacitance (<0.3pF mismatch), it preserves differential impedance and eye diagram margins at 480Mbps. The MAX3206EETC's low leakage (1nA max) and fast response prevent jitter accumulation - confirmed in Maxim's Typical Operating Characteristics plots and USB 2.0 compliance notes.
What is the thermal resistance (θJA) of the MAX3206EETC in its 12-pin TQFN-EP package?
The MAX3206EETC in the 12-pin TQFN-EP package has a junction-to-ambient thermal resistance (θJA) of 41°C/W, as specified in the Package Thermal Characteristics table of the datasheet. This value assumes JEDEC-standard four-layer board conditions (JESD51-7). The exposed pad (EP) contributes significantly to thermal performance - it must be soldered to a dedicated GND plane to achieve the rated θJA and sustain continuous operation at +85°C ambient.
Is the MAX3206EETC RoHS-compliant and lead-free?
Yes, the MAX3206EETC is RoHS-compliant and lead-free. The "+" suffix in the ordering code (MAX3206EETC+) denotes lead(Pb)-free/RoHS-compliant packaging, per Maxim's package coding convention. The device meets EU RoHS Directive 2011/65/EU and is compatible with standard Pb-free reflow profiles (peak temperature up to +260°C), as confirmed in the Absolute Maximum Ratings and Package Information sections of the MAX3206EETC datasheet.
MAX3206EETC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Package/Case:
- 12-WQFN Exposed Pad
- Series:
- -
- Packaging:
- Bulk
- Product Status:
- Active
- Type:
- Steering (Rail to Rail)
- Unidirectional Channels:
- 6
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- 5.5V (Max)
- Voltage - Breakdown (Min):
- -
- Voltage - Clamping (Max) @ Ipp:
- 100V
- Current - Peak Pulse (10/1000µs):
- -
- Power - Peak Pulse:
- -
- Power Line Protection:
- No
- Applications:
- General Purpose
- Capacitance @ Frequency:
- -
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 12-TQFN (4x4)
MAX3206EETC FAQ
1.How can I place an order for MAX3206EETC through Aetrix?
Please submit a Request for Quotation (RFQ) for MAX3206EETC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MAX3206EETC reliable?
The price and inventory of MAX3206EETC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MAX3206EETC is usually 5 days.
3.What payment methods are accepted for MAX3206EETC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MAX3206EETC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MAX3206EETC?
MAX3206EETC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MAX3206EETC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MAX3206EETC?
For technical support, including MAX3206EETC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MAX3206EETC requirements.
6.How does Aetrix verify that MAX3206EETC is sourced from the original manufacturer or authorized distributors?
All MAX3206EETC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MAX3206EETC meets industry standards.
7.What is the process for return or replacement of MAX3206EETC?
All MAX3206EETC units undergo pre-shipment inspection (PSI). If there is an issue with MAX3206EETC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MAX3206EETC part is unused and in its original packaging.
Return procedure for MAX3206EETC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MAX3206EETC Tags
-
ESD9B5.0ST5G
onsemi
-
DESD3V3E1BL-7B
Diodes Incorporated
-
ESD5Z3.3T1G
onsemi
-
D5V0H1B2LP-7B
Diodes Incorporated
-
D5V0P1B2LP-7B
Diodes Incorporated
-
DESD5V0U1BA-7
Diodes Incorporated
-
ESD5Z5.0T1G
onsemi
-
DESD5V0U1BB-7
Diodes Incorporated
-
D12V0L1B2LP-7B
Diodes Incorporated
-
PESD2V0Y1BSFYL
Nexperia USA Inc.
-
DF2S5M4CT,L3F
Toshiba Semiconductor and Storage
-
D5V0L1B2WS-7
Diodes Incorporated
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
