NXP Semiconductors MF1PH2231DUD/00Z

Overview

MF1PH2231DUD/00Z from NXP Semiconductors is a contactless smart card IC compliant with ISO/IEC 14443-4 and ISO/IEC 7816-4 (SL3), featuring 2 kB non-volatile memory, 4-byte NUID, 70 pF input capacitance for compact form factors, and Common Criteria EAL5+ security certification. It serves as a secure authentication platform in transit ticketing, access control, and micro-payment systems requiring AES-128 cryptographic operations and sector-wise security upgrades.

For engineers reviewing the MF1PH2231DUD/00Z datasheet, MF1PH2231DUD/00Z pinout, MF1PH2231DUD/00Z application, or MF1PH2231DUD/00Z equivalent, this page delivers verified technical context, exact pin roles, real-world use cases, and validated alternative options - all grounded in NXP's Rev. 3.1 product short data sheet and official ordering information.

Technical Context

The MF1PH2231DUD/00Z implements dual-protocol activation: ISO/IEC 14443-3 for anti-collision and UID handling, and ISO/IEC 14443-4 (T=CL) for SL0/SL1/SL3 command execution including AES key updates, Read_Sig, and secure messaging. Its memory architecture comprises 32 sectors × 4 blocks (2 kB total), with sector trailers storing CRYPTO1 keys A/B and access bytes, plus dedicated configuration blocks for SL1 update restrictions and FieldConfiguration.

Security operation is segmented across three levels: SL0 enables personalization; SL1 supports MIFARE Classic EV1 backward compatibility with optional AES authentication and configurable DaVaBlock/SectorTrailer write restrictions; SL3 mandates AES-128 for all authentication and data integrity, enforces encrypted communication, and supports Transaction MAC and Transaction Timer to mitigate Man-in-the-Middle attacks.

Key Specifications

Pinout & Package

SOT500-2 package: ultra-thin (120 µm) wafer-level chip-scale package designed for embedding into plastic cards, laminates, or flexible substrates. Two-terminal RF interface eliminates need for external matching components.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar contactless smart card IC applications.

Compared with MF1PH2231DUD/00Z, MF1P2231DUD/00 trades compact form factor support for broader antenna design tolerance, while MF1PH4231DUD/00 extends memory capacity without altering RF interface or security architecture - both retain identical UID, SL behavior, and CC EAL5+ certification.

Availability

MF1PH2231DUD/00Z is available at Aetrix Electronics and suitable for public transportation ticketing, physical access control, and micro-payment terminals requiring stable component supply, long-term lifecycle assurance, and certified security compliance.

Supply support for MF1PH2231DUD/00Z includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and identification markets.

The MF1PH2231DUD/00Z belongs to the MIFARE Plus EV2 product line, engineered to deliver bank-grade security (EAL5+) in mainstream contactless applications while enabling phased infrastructure upgrades from MIFARE Classic - targeting transit, access, and digital identity systems.

FAQ

What is the primary security certification level of the MF1PH2231DUD/00Z?

The MF1PH2231DUD/00Z holds Common Criteria EAL5+ certification (AVA_VAN.5), confirming resistance against attackers with high attack potential - the same assurance level required for electronic passports and financial smart cards. This certification covers the full IC stack including AES-128 implementation, memory protection, and side-channel mitigation, and applies directly to the MF1PH2231DUD/00Z as shipped in SOT500-2 wafer format.

Does the MF1PH2231DUD/00Z support Random ID, and how is it enabled?

Yes, the MF1PH2231DUD/00Z supports ISO/IEC 14443-3 compliant Random ID to comply with privacy regulations. It is enabled via configuration in the FieldConfigurationBlock using the UseRID byte; once set, the PICC transmits a pseudorandom identifier instead of the programmed 4-byte NUID during anti-collision. The real NUID remains readable only after successful authentication using ISOSelect and ISOExternalAuthenticate commands.

How does the MF1PH2231DUD/00Z differ from the MF1P2231DUD/00 in terms of RF interface?

The MF1PH2231DUD/00Z features 70 pF input capacitance, optimized for compact antennas in wristbands, key fobs, and thin cards, whereas the MF1P2231DUD/00 has 17 pF input capacitance and targets standard ISO/IEC 7816-1 ID-1 cards. This difference means MF1PH2231DUD/00Z achieves equivalent read range (~10 cm) with smaller coils or lower-inductance designs, reducing mechanical integration constraints without sacrificing performance.

Can the MF1PH2231DUD/00Z be upgraded from SL1 to SL3 after personalization?

Yes, the MF1PH2231DUD/00Z supports both CardSecurityLevel and SectorSecurityLevel upgrades. A full-card SL1-to-SL3 transition is performed using the SL switch command after authentication, locking all sectors into AES-only mode. Alternatively, individual sectors can be migrated to SL3 while others remain in SL1 - enabling SL1SL3Mix operation where legacy and modern backends coexist securely within one MF1PH2231DUD/00Z device.

What is the purpose of the Transaction MAC (TMAC) feature in the MF1PH2231DUD/00Z?

The Transaction MAC (TMAC) in the MF1PH2231DUD/00Z calculates a cryptographic checksum over the complete transaction - including value changes, timestamps, and command sequence - enabling clearing entities to verify data integrity and detect tampering. It operates in SL3 mode and is mandatory for payment applications requiring end-of-day reconciliation and fraud detection, ensuring that no unauthorized modification occurs between card and host system.