NXP Semiconductors MF1S5031XDUF/V1V
- Part No.:
- MF1S5031XDUF/V1V
- Manufacturer:
- NXP Semiconductors
- Category:
- RFID, RF Access, Monitoring ICs
- Package:
- Die
- Datasheet:
-
MF1S5031XDUF/V1V.pdf
- Description:
- IC RFID TRANSP 13.56MHZ DIE
- Quantity:
- Payment:

- Shipping:

Inventory:3,530
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MF1S5031XDUF/V1 from NXP Semiconductors is a contactless smart card IC compliant with ISO/IEC 14443 Type A, featuring 1 kB EEPROM organized in 16 sectors, 4-byte non-unique ID (NUID), 13.56 MHz operating frequency, and Crypto1-based mutual three-pass authentication. It enables sub-100 ms ticketing transactions in public transport systems.
For engineers reviewing the MF1S5031XDUF/V1 datasheet, MF1S5031XDUF/V1 pinout, MF1S5031XDUF/V1 application, or MF1S5031XDUF/V1 equivalent, this page delivers verified technical context, memory access behavior, RF interface timing, UID handling for non-unique deployments, and secure sector-based key management - all specific to the 4-byte NUID bump die variant on 8-inch wafer with 75 μm thickness.
Technical Context
The MF1S5031XDUF/V1 implements a fully integrated RF interface per ISO/IEC 14443A, including rectifier, voltage regulator, clock regenerator, and Power-On Reset - requiring no external components beyond the antenna coil. Its digital control unit executes anticollision, sector-selective authentication, and encrypted memory operations using the CRYPTO1 stream cipher.
Memory is partitioned into 16 sectors (each with 4 blocks of 16 bytes), where sector trailers store two keys and programmable access bits governing read/write/increment/decrement permissions per block. The 4-byte NUID version returns ATQA = 0004h and SAK = 08h, and does not guarantee UID uniqueness - necessitating application-layer collision handling during selection.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Size | 1 kB EEPROM, organized as 16 sectors × 4 blocks × 16 bytes; supports value blocks with built-in backup management for electronic purse functions. |
| Operating Frequency | 13.56 MHz - compatible with standard ISO/IEC 14443A readers and antenna designs without tuning adjustments. |
| Data Rate | 106 kbit/s - defines maximum raw throughput for block reads/writes and cryptographic handshakes. |
| Authentication | Mutual three-pass authentication per ISO/IEC DIS 9798-2 using CRYPTO1; requires sector-specific Key A or Key B prior to any memory access. |
| Identifier | 4-byte non-unique ID (NUID) - returned in anticollision; not guaranteed globally unique; mandates application-level duplicate handling. |
| Endurance & Retention | 200,000 write cycles and 10-year data retention at 22 °C - validated for high-cycle transit fare updates and long-life campus credential storage. |
| RF Interface | Passive power harvesting via LA/LB antenna terminals; no external capacitor or regulator required - simplifies embedding into thin PVC or PET cards. |
Pinout & Package
MF1S5031XDUF/V1 is supplied as a bumped die on 8-inch wafer (75 μm thickness), mounted on film frame carrier. It has no leadframe or molded package - only two RF terminals: LA and LB for direct connection to an external antenna coil.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| LA | Antenna coil connection (terminal A) | AC-coupled RF input/output node; connects to one end of planar antenna loop; forms resonant LC tank with on-die capacitance (~16.9 pF typical). |
| LB | Antenna coil connection (terminal B) | AC-coupled RF input/output node; connects to opposite end of antenna loop; completes passive energy harvesting and bidirectional 106 kbit/s ASK-modulated communication path. |
Key Features
| Feature | Design Value |
|---|---|
| Contactless power & data transfer | Enables battery-free operation within ~100 mm reader range; eliminates need for PCB traces, connectors, or power routing in card substrate. |
| Sub-100 ms transaction time | Includes full sequence: anticollision, select, three-pass auth, and block read/write - critical for high-throughput transit gate throughput (>25 users/min). |
| Sector-based dual-key security | Each of 16 sectors has independent Key A and Key B with configurable access bits - supports multi-application isolation (e.g., access + loyalty on same card). |
| Value block arithmetic | Hardware-accelerated increment/decrement/transfer/restore commands with triple-stored values and address backup - prevents corruption during power loss in e-purse use. |
| NXP Originality Check support | Allows host systems to verify genuine NXP silicon via challenge-response protocol - mitigates cloning risk in high-value credential deployments. |
Applications
| Public Transportation Ticketing | Access Management |
|---|---|
Use Scenario: Contactless tap-to-enter gates in metro systems processing >10,000 daily riders per station. IC Role / Device Role / Timing Role: Secure credential storage and real-time fare deduction using value blocks with hardware-backed decrement/transfer. Use Value: Sub-100 ms transaction ensures <1.2 s cumulative dwell time per rider at peak flow; 4-byte NUID enables cost-effective mass issuance without UID collision checks. |
Use Scenario: Multi-door office building with role-based entry zones (executive floor, lab, server room). IC Role / Device Role / Timing Role: Sector-isolated credential storage - separate sectors hold access rights, biometric template hashes, and audit logs. Use Value: Dual-key per sector allows IT admins to update door permissions (via Key A) while facility staff manage visitor badges (via Key B) without cross-access risk. |
| Electronic Toll Collection (ETC) | School & Campus Cards |
Use Scenario: Drive-through toll plazas requiring reliable read at 40 km/h under variable weather and metal interference. IC Role / Device Role / Timing Role: RF interface optimized for high-speed modulation/demodulation at 106 kbit/s with 16-bit CRC and parity validation. Use Value: Robust data integrity mechanisms (bit coding, bit counting, channel monitoring) maintain >99.98% read success rate even with antenna detuning from vehicle proximity. |
Use Scenario: Integrated student ID supporting library loans, cafeteria payments, and lab equipment access. IC Role / Device Role / Timing Role: Single IC hosting multiple applications across isolated sectors - each with independent keys and access conditions. Use Value: Enables phased rollout: library system deployed first (Sector 0), then cafeteria (Sector 1), then labs (Sector 2) - all on same physical card without reissuance. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar contactless smart card IC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MF1S5001XDUF/V1 | Same bump die package but uses 7-byte UID instead of 4-byte NUID; ATQA = 0044h vs. 0004h; retains identical memory map, crypto, and timing. | Required where global UID uniqueness is mandated (e.g., national ID programs); unsuitable for high-volume low-cost transit where NUID suffices. | Select MF1S5001XDUF/V1 only if system architecture depends on guaranteed UID uniqueness and can accommodate longer anticollision cascade (two levels). |
| MF1S5030XDA4/V1 | MOA4 module variant (SOT500-2) with same 4-byte NUID, but pre-mounted on leadless plastic carrier; includes integrated antenna matching capacitor. | Used in embedded reader designs or OEM modules where wafer-level die integration is impractical; adds ~0.3 mm Z-height and fixed 35 mm tape format. | Choose MF1S5030XDA4/V1 when prototyping with surface-mount modules or when antenna co-design is not feasible; avoid for ultra-thin card laminates. |
Compared with MF1S5031XDUF/V1, the 7-byte UID variant offers deterministic anticollision at the cost of longer selection latency, while the MOA4 module trades die-level integration flexibility for simplified assembly - neither is pin-compatible due to differing form factors (bare die vs. packaged module).
Availability
MF1S5031XDUF/V1 is available at Aetrix Electronics and suitable for public transportation ticketing, access management, and electronic toll collection requiring stable component supply across multi-year deployment cycles.
Supply support for MF1S5031XDUF/V1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and identification markets, with core expertise in RFID, NFC, and trusted execution environments.
The MF1S5031XDUF/V1 belongs to the MIFARE Classic EV1 family - designed specifically for cost-sensitive, high-volume contactless smart card applications demanding proven security, interoperability with legacy infrastructure, and seamless integration into ISO/IEC 14443A ecosystems.
FAQ
What is the UID type and uniqueness guarantee for MF1S5031XDUF/V1?
The MF1S5031XDUF/V1 features a 4-byte non-unique ID (NUID), meaning the identifier is not guaranteed to be globally unique. It returns ATQA = 0004h during anticollision and requires application-layer handling of potential duplicates. This differs from the 7-byte UID variants (e.g., MF1S5001XDUF/V1), which provide manufacturer-assigned uniqueness. MF1S5031XDUF/V1 is intended for deployments where cost and simplicity outweigh absolute UID uniqueness.
How does MF1S5031XDUF/V1 handle memory access security?
MF1S5031XDUF/V1 enforces memory access through sector-based authentication: each of its 16 sectors has two programmable keys (A and B) and access bits stored in the sector trailer. Before reading or writing any block, the host must authenticate using the correct key for that sector. Access bits define granular permissions - e.g., "read/write with Key A only" or "increment/decrement with Key B" - enabling multi-application isolation on a single IC.
What antenna interface requirements apply to MF1S5031XDUF/V1?
MF1S5031XDUF/V1 interfaces directly to an external antenna coil via LA and LB terminals - no external capacitors or matching components are needed. Its input capacitance is 16.9 pF typical, forming a resonant LC tank with the antenna inductance. Antenna design must target 13.56 MHz resonance; recommended geometry follows ISO/IEC 14443A guidelines, with typical loop inductance between 1.0–1.5 μH for optimal coupling and operating distance up to 100 mm.
Can MF1S5031XDUF/V1 support electronic purse functionality?
Yes, MF1S5031XDUF/V1 natively supports electronic purse operations via value blocks. Each value block stores a signed 4-byte value three times (twice non-inverted, once inverted) plus a 1-byte address stored four times - enabling hardware-verified increment, decrement, restore, and transfer commands. These operations execute atomically with built-in backup management, preventing corruption during unexpected power loss - essential for fare deduction or micro-payment use cases.
What is the expected transaction time for a full fare deduction using MF1S5031XDUF/V1?
A complete fare deduction transaction using MF1S5031XDUF/V1 - including anticollision, card selection, three-pass authentication, value block decrement, and transfer - typically completes in less than 100 ms. This includes ~2.5 ms for anticollision (with 4-byte NUID), ~2 ms for authentication, ~2.5 ms for decrement, and ~4.5 ms for transfer, plus overhead for CRC and framing. Real-world performance remains consistent across temperature and field strength due to on-die voltage regulation and adaptive demodulation.
MF1S5031XDUF/V1V Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- Die
- Packaging:
- Bulk
- Product Status:
- Not For New Designs
- Type:
- RFID Transponder
- Frequency:
- 13.56MHz
- Standards:
- ISO 14443
- Interface:
- UART
- Voltage - Supply:
- -
- Operating Temperature:
- -25°C ~ 70°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- Die
MF1S5031XDUF/V1V FAQ
1.How can I place an order for MF1S5031XDUF/V1V through Aetrix?
Please submit a Request for Quotation (RFQ) for MF1S5031XDUF/V1V on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MF1S5031XDUF/V1V reliable?
The price and inventory of MF1S5031XDUF/V1V are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MF1S5031XDUF/V1V is usually 5 days.
3.What payment methods are accepted for MF1S5031XDUF/V1V?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MF1S5031XDUF/V1V transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MF1S5031XDUF/V1V?
MF1S5031XDUF/V1V orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MF1S5031XDUF/V1V order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MF1S5031XDUF/V1V?
For technical support, including MF1S5031XDUF/V1V datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MF1S5031XDUF/V1V requirements.
6.How does Aetrix verify that MF1S5031XDUF/V1V is sourced from the original manufacturer or authorized distributors?
All MF1S5031XDUF/V1V products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MF1S5031XDUF/V1V meets industry standards.
7.What is the process for return or replacement of MF1S5031XDUF/V1V?
All MF1S5031XDUF/V1V units undergo pre-shipment inspection (PSI). If there is an issue with MF1S5031XDUF/V1V, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MF1S5031XDUF/V1V part is unused and in its original packaging.
Return procedure for MF1S5031XDUF/V1V:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MF1S5031XDUF/V1V Tags

-
SL2S2602FTBX
NXP Semiconductors

-
ST25DV04K-IER6S3
STMicroelectronics

-
ST25DV04K-IER6C3
STMicroelectronics

-
LXMSJZNCMD-217
Murata Electronics

-
NT3H2111W0FTTJ
NXP Semiconductors

-
NT3H2111W0FHKH
NXP Semiconductors

-
M24LR04E-RMC6T/2
STMicroelectronics

-
ST25DV04KC-JF6D3
STMicroelectronics

-
ST25DV64KC-IE6S3
STMicroelectronics
-
ST25DV64K-IER6T3
STMicroelectronics

-
NT3H2211W0FTTJ
NXP Semiconductors

-
NT3H2211W0FHKH
NXP Semiconductors
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
