NXP Semiconductors MF1S7001XDUF/V1V

Overview

MF1S7001XDUF/V1 from NXP Semiconductors is a contactless smart card IC compliant with ISO/IEC 14443 Type A, featuring 4 kB EEPROM organized in 40 sectors (32×4-block + 8×16-block), 13.56 MHz operating frequency, 106 kbit/s data rate, and CRYPTO1-based three-pass mutual authentication. It delivers <100 ms typical ticketing transaction time and supports 7-byte UID for secure public transport fare collection.

For engineers reviewing the MF1S7001XDUF/V1 datasheet, MF1S7001XDUF/V1 pinout, MF1S7001XDUF/V1 application, or MF1S7001XDUF/V1 equivalent, key selection considerations include UID length (7-byte), wafer thickness (75 μm), FFC bump packaging, EEPROM access control granularity per sector, and CRYPTO1 authentication compatibility with legacy MIFARE Classic infrastructure.

Technical Context

The MF1S7001XDUF/V1 implements a fully integrated RF interface per ISO/IEC 14443A, including rectifier, voltage regulator, clock regenerator, and Power-On Reset - requiring no external components beyond an antenna coil. Its digital control unit manages anticollision, sector-based authentication, and value-block arithmetic (increment/decrement/transfer) with built-in backup management.

Memory access is enforced via sector-level access bits stored in trailer blocks, enabling fine-grained read/write/modify permissions per block using either Key A or Key B. All memory operations require prior successful three-pass authentication, and communication integrity is ensured by 16-bit CRC, odd parity, bit counting, and bit coding per frame.

Key Specifications

Pinout & Package

MF1S7001XDUF/V1 is supplied as a bumped die on 8-inch wafer (75 μm thickness) in film frame carrier (FFC) format, with Au bumps and electronic fail die marking per SECS-II. It has no conventional pins; electrical connection is made exclusively via two antenna terminals (LA and LB) bonded directly to an external coil.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar contactless smart card IC applications.

Compared with MF1S7001XDUD/V1, the MF1S7001XDUF/V1 offers thinner die (75 μm) for tighter bend radius in flexible card substrates, while MF1S7000XDA4/V1 trades die-level integration for plug-and-play module compatibility - all retain identical CRYPTO1 security, 4 kB EEPROM layout, and ISO/IEC 14443A command interface.

Availability

MF1S7001XDUF/V1 is available at Aetrix Electronics and suitable for public transportation fare systems, secure physical access control, and electronic toll collection requiring stable component supply and long-term lifecycle support.

Supply support for MF1S7001XDUF/V1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and consumer applications, with deep expertise in RFID, NFC, and trusted execution environments.

The MF1S7001XDUF/V1 belongs to the MIFARE Classic EV1 family - designed specifically for cost-sensitive, high-volume contactless smart card deployments where ISO/IEC 14443A interoperability, proven CRYPTO1 security, and sectorized EEPROM flexibility are primary requirements.

FAQ

What is the primary function of the MF1S7001XDUF/V1 in a contactless smart card system?

The MF1S7001XDUF/V1 serves as the secure contactless IC core in ISO/IEC 14443A-compliant smart cards, providing 4 kB EEPROM storage, CRYPTO1-based mutual authentication, sector-level access control, and value-block arithmetic for applications like transit fare collection. Its RF interface harvests power and exchanges data without batteries or contacts, making MF1S7001XDUF/V1 ideal for disposable or durable credential cards.

Does the MF1S7001XDUF/V1 support both 4-byte and 7-byte UID configurations?

No - the MF1S7001XDUF/V1 is specifically configured with a 7-byte UID, as confirmed by its ordering code suffix "/V1" and the "7-byte UID" designation in Table 2 of the datasheet. The 4-byte non-unique ID variants carry "MF1S7031..." part numbers. Using MF1S7001XDUF/V1 ensures deterministic anticollision and unique device identification required for secure transit and access systems.

What package type and mounting format does the MF1S7001XDUF/V1 use?

The MF1S7001XDUF/V1 is supplied as a bumped die on an 8-inch wafer with 75 μm thickness, mounted on a film frame carrier (FFC), with gold bumps and electronic fail die marking per SECS-II format. It has no leads or encapsulation - it must be bonded directly to an antenna coil using flip-chip or wire-bond processes, making MF1S7001XDUF/V1 suitable for thin, flexible smart card laminates.

How does the MF1S7001XDUF/V1 ensure data integrity during wireless communication?

The MF1S7001XDUF/V1 enforces data integrity through multiple hardware mechanisms: 16-bit CRC per data block, odd parity bits for every transmitted byte, bit-count validation, Manchester-style bit coding to distinguish '0', '1', and idle states, and real-time channel monitoring of protocol sequence and bit stream. These features collectively prevent undetected corruption in noisy RF environments, ensuring reliable operation of MF1S7001XDUF/V1 in transit gates and access readers.

Can the MF1S7001XDUF/V1 be used as a drop-in replacement for earlier MIFARE Classic 4K devices?

Yes - the MF1S7001XDUF/V1 maintains full command, memory map, and CRYPTO1 compatibility with legacy MIFARE Classic 4K ICs (e.g., MF1S70xx), supporting identical REQA/WUPA/Select/Authentication/Read/Write sequences and sector trailer structure. However, it is not pin-compatible with packaged modules; direct substitution requires matching the FFC bump die format and antenna interface of MF1S7001XDUF/V1.