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NXP Semiconductors MF2DL1001DUF/02V

Part No.:
MF2DL1001DUF/02V
Manufacturer:
NXP Semiconductors
Category:
RFID, RF Access, Monitoring ICs
Package:
Die
Datasheet:
AetrixMF2DL1001DUF/02V.pdf
Description:
MIFARE DESFIRE LIGHT CONTACTLESS
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,687

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Product details

Overview

MF2DL1001DUF/02V from NXP Semiconductors is a contactless application IC implementing the MIFARE DESFire Light platform for secure, single-entity smart card systems. It delivers AES-128 authentication, 640 bytes of ISO/IEC 7816-4 file-based user memory (including three standard data files, one value file, and one cyclic record file), 17 pF input capacitance, and full ISO/IEC 14443-4 compliance - enabling use in transport ticketing, access management, and NFC-enabled loyalty cards.

For engineers reviewing the MF2DL1001DUF/02V datasheet, MF2DL1001DUF/02V pinout, MF2DL1001DUF/02V application, or MF2DL1001DUF/02V equivalent, key selection considerations include its 17 pF antenna interface for Class 1 smart card designs, transaction-safe value file with upper/lower limits, LRP-wrapped AES for side-channel resistance, and functional compatibility with MIFARE DESFire EV2 for multi-application integration.

Technical Context

The MF2DL1001DUF/02V implements a dedicated contactless PICC architecture compliant with ISO/IEC 14443-2/3/4 and ISO/IEC 7816-4, featuring an integrated analog front-end with 13.56 MHz RF interface, on-die power regulator, and AES-128 co-processor with optional Leakage Resilient Primitive (LRP) wrapping. Its memory controller enforces atomic transaction commit/rollback for value and record files via built-in anti-tearing logic.

It supports configurable communication modes - Plain, CMAC-protected, or Full Enciphered plus CMAC - per file or command, with five customer-defined AES keys, individual file-level access control (Read/Write/ReadWrite/Change), and optional Random ID for GDPR-aligned privacy. The device operates without external power, drawing energy solely from the RF field.

Key Specifications

Parameter Value and Actual Design Meaning
RF Interface Fully compliant ISO/IEC 14443A-2/3/4 and ISO/IEC 7816-4 frames - ensures interoperability with legacy terminals and NFC smartphones.
User Memory 640 bytes organized as six pre-defined ISO/IEC 7816-4 files: three StandardData (32 + 2×256 B), one Value (4-byte signed integer), one CyclicRecord (4×16 B), and optional TMAC file - enables micropayment, logging, and secure data storage without dynamic file creation.
Security AES-128 with five customer keys, LRP-wrapped AES option, 3-pass mutual authentication, ECC-based originality signature - provides EAL4-certified hardware/software security for payment-grade applications.
Input Capacitance 17 pF - optimized for standard Class 1 smart card antenna layouts, supporting reliable operation at up to 10 cm read distance.
Data Retention & Endurance 10-year data retention and ≥200,000 write cycles per EEPROM cell - guarantees long-term reliability in high-turnover transit or access tokens.
Communication Speeds Supports 106/212/424/848 kbit/s - allows fast transaction throughput in high-throughput fare gates or event entry points.

Pinout & Package

MF2DL1001DUF/02V is supplied in FFC (Film Frame Carrier) wafer format - sawn, 75 μm thickness, Au bumps - intended for embedding into plastic cards, key fobs, or wristbands. It has no conventional package pins; electrical connection is made exclusively via two antenna terminals (LA and LB) bonded to an external coil.

Pin/Terminal Circuit Role Design Meaning
LA Antenna coil connection A Primary RF input terminal; connects to one end of the printed or embedded antenna loop - forms resonant LC tank with internal 17 pF capacitance.
LB Antenna coil connection B Secondary RF input terminal; completes antenna interface path - enables differential coupling and optimal power harvesting from reader field.

Key Features

Feature Design Value
Transaction-safe value file 4-byte signed integer with programmable upper/lower limits and atomic commit/rollback - enables tamper-resistant micropayments without host-side reconciliation.
LRP-wrapped AES Leakage Resilient Primitive applied as AES wrapper - enhances resistance against side-channel and fault injection attacks beyond standard AES-128.
ISO/IEC 7816-4 file system Predefined DF with six EFs (including cyclic record and TMAC file) - eliminates need for custom filesystem development and ensures NFC Forum Type 4 Tag compatibility.
Configurable ATS & UID Default ATS supports 128-byte frames and speeds up to 848 kbit/s; UID is factory-programmed and locked - simplifies personalization while maintaining interoperability with existing infrastructure.
Functional EV2 compatibility Subset of MIFARE DESFire EV2 commands and secure messaging supported - allows incremental migration from MF2DL1001DUF/02V to multi-application EV2 platforms.

Applications

Access Control System Public Transport Ticketing

Use Scenario: Secure door entry using contactless credential cards issued by a single organization (e.g., corporate campus or university).

IC Role / Device Role / Timing Role: Contactless PICC performing mutual authentication, file-based credential validation, and session key establishment over ISO/IEC 14443-4.

Use Value: Prevents cloning via EAL4-certified AES-128 and LRP protection; 17 pF input capacitance ensures consistent read range across diverse card form factors.

Use Scenario: Disposable or reloadable transit tickets used in metro fare gates with high throughput requirements.

IC Role / Device Role / Timing Role: Transaction-oriented contactless IC executing atomic value decrement (Debit) and cyclic log update within single RF session.

Use Value: Anti-tearing mechanism guarantees balance integrity even during abrupt field loss; 848 kbit/s support reduces gate dwell time.

Loyalty & Voucher Program NFC Mobile Pairing Service

Use Scenario: Consumer-facing loyalty cards storing points, coupons, and tier status managed by a single merchant.

IC Role / Device Role / Timing Role: ISO/IEC 7816-4-compliant file system hosting encrypted StandardData files for coupon redemption and Value file for point balance.

Use Value: Five customer keys enable granular access control - e.g., "free read" for balance display, authenticated write for point accrual.

Use Scenario: Business card sharing or Bluetooth/Wi-Fi pairing initiated via NFC tap between smartphone and physical token.

IC Role / Device Role / Timing Role: NFC Forum Type 4 Tag-compliant platform delivering FCI and application data via ISOSelectFile and ISOReadBinary.

Use Value: User-configurable AID and FID allow alignment with existing NFC data models; Random ID option satisfies GDPR-compliant user anonymity.

Equivalent & Alternatives

The following parts are listed as comparable options for similar contactless application IC applications.

Alternative Part Technical Difference Application Difference Selection Advice
MF2DL1001DUD/02 Same die, 120 μm wafer thickness, 17 pF input capacitance - identical RF performance but thicker substrate. Preferred for standard smart cards where mechanical robustness outweighs ultra-thin form factor needs. Select MF2DL1001DUD/02 when card lamination process requires higher wafer rigidity; MF2DL1001DUF/02 is optimal for thin wristbands or flexible substrates.
MF2DLH1001DUF/02 Same wafer format (75 μm), but 50 pF input capacitance - designed for small-form-factor devices like key fobs with miniaturized antennas. Required for compact NFC tokens where antenna size limits achievable Q-factor and coupling efficiency. Choose MF2DLH1001DUF/02 only when antenna geometry mandates >30 pF loading; MF2DL1001DUF/02 maintains optimal range in standard card layouts.

Compared with MF2DL1001DUD/02 and MF2DLH1001DUF/02, the MF2DL1001DUF/02 uniquely balances 75 μm thinness with 17 pF capacitance - delivering maximum read range in space-constrained yet standard-antenna applications, without requiring antenna redesign or sacrificing mechanical yield.

Availability

MF2DL1001DUF/02V is available at Aetrix Electronics and suitable for access control systems, public transport ticketing, and NFC mobile pairing services requiring stable component supply, long-term lifecycle assurance, and traceable sourcing from authorized channels.

Supply support for MF2DL1001DUF/02V includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and identification markets, with decades of expertise in contactless IC design and Common Criteria–certified security architectures.

The MF2DL1001DUF/02V belongs to the MIFARE DESFire Light family - engineered for cost-sensitive, single-entity applications demanding high security, NFC interoperability, and simplified deployment without multi-application complexity.

FAQ

What is the primary function of the MF2DL1001DUF/02V in a contactless system?

The MF2DL1001DUF/02V serves as a secure contactless PICC (Proximity Integrated Circuit Card) that executes ISO/IEC 14443-4 transactions, performs AES-128 mutual authentication, and manages application data in a fixed ISO/IEC 7816-4 file structure. Its role is to validate credentials, store transactional data (e.g., value balances or logs), and ensure cryptographic integrity - all without external power. The MF2DL1001DUF/02V is not a reader IC or MCU; it operates solely as a passive, field-powered endpoint.

Does the MF2DL1001DUF/02V support NFC Forum Type 4 Tag operation?

Yes, the MF2DL1001DUF/02V supports NFC Forum Type 4 Tag functionality through its ISO/IEC 7816-4 file system, configurable AID/FID, and default ATS parameters aligned with NFC Digital Protocol. It responds to ISOSelectFile and ISOReadBinary commands, delivers FCI data from file 1Fh, and enables smartphone-initiated services like business card sharing. This capability is inherent to the MF2DL1001DUF/02V design and does not require firmware modification.

How does the MF2DL1001DUF/02V handle power loss during a value file debit operation?

The MF2DL1001DUF/02V implements hardware-enforced transaction atomicity: debit operations on the value file are held in volatile state until CommitTransaction is successfully executed. If RF power is lost before commit, the original value remains intact and fully recoverable. This anti-tearing mechanism is built into the MF2DL1001DUF/02V's memory controller and requires no host-side error recovery logic - ensuring balance consistency even in high-interference environments like subway gates.

What antenna design guidance applies to the MF2DL1001DUF/02V?

The MF2DL1001DUF/02V specifies 17 pF input capacitance and is optimized for standard ISO/IEC 14443 Class 1 smart card antenna layouts (e.g., ~7–8 cm² copper area, 1–2 μH inductance). Its LA/LB terminals connect directly to the coil ends; no external capacitor is needed. Antenna tuning must target resonance at 13.56 MHz with this 17 pF load. Deviating from this value - such as using a 50 pF variant - will reduce read range and reliability in standard card formats.

Can the MF2DL1001DUF/02V be used alongside MIFARE DESFire EV2 in the same system?

Yes, the MF2DL1001DUF/02V offers functional compatibility with MIFARE DESFire EV2: it supports a subset of EV2 commands (e.g., Authenticate, ReadData, WriteData), shares the same file system structure and secure messaging framework, and allows applications developed for MF2DL1001DUF/02V to operate within an EV2 multi-application environment. This compatibility is explicitly documented in the MF2DL(H)x0 datasheet and requires no hardware change - only application-layer adaptation for extended EV2 features.

MF2DL1001DUF/02V Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
MIFARE®
Package/Case:
Die
Packaging:
Tray
Product Status:
Active
Type:
RFID Transponder
Frequency:
13.56MHz
Standards:
Mifare, ISO 14443, ISO 7816-4
Interface:
-
Voltage - Supply:
-
Operating Temperature:
-25°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
-
Supplier Device Package:
Wafer

MF2DL1001DUF/02V FAQ

1.How can I place an order for MF2DL1001DUF/02V through Aetrix?

Please submit a Request for Quotation (RFQ) for MF2DL1001DUF/02V on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MF2DL1001DUF/02V reliable?

The price and inventory of MF2DL1001DUF/02V are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MF2DL1001DUF/02V is usually 5 days.

3.What payment methods are accepted for MF2DL1001DUF/02V?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MF2DL1001DUF/02V transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MF2DL1001DUF/02V?

MF2DL1001DUF/02V orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MF2DL1001DUF/02V order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MF2DL1001DUF/02V?

For technical support, including MF2DL1001DUF/02V datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MF2DL1001DUF/02V requirements.

6.How does Aetrix verify that MF2DL1001DUF/02V is sourced from the original manufacturer or authorized distributors?

All MF2DL1001DUF/02V products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MF2DL1001DUF/02V meets industry standards.

7.What is the process for return or replacement of MF2DL1001DUF/02V?

All MF2DL1001DUF/02V units undergo pre-shipment inspection (PSI). If there is an issue with MF2DL1001DUF/02V, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MF2DL1001DUF/02V part is unused and in its original packaging.

Return procedure for MF2DL1001DUF/02V:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

MF2DL1001DUF/02V Tags

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