NXP Semiconductors MF2DL1001DUF/02Z
- Part No.:
- MF2DL1001DUF/02Z
- Manufacturer:
- NXP Semiconductors
- Category:
- RFID, RF Access, Monitoring ICs
- Package:
- Die
- Datasheet:
-
MF2DL1001DUF/02Z.pdf
- Description:
- MIFARE DESFIRE LIGHT CONTACTLESS
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
MF2DL1001DUF/02Z from NXP Semiconductors is a contactless application IC implementing the MIFARE DESFire Light platform for secure, single-entity smart card systems. It delivers AES-128 authentication, 640 bytes of ISO/IEC 7816-4 file-based user memory (including three standard data files, one value file, and one cyclic record file), 17 pF input capacitance, and full ISO/IEC 14443-4 compliance - enabling use in transport ticketing, access management, and electronic voucher applications.
For engineers reviewing the MF2DL1001DUF/02Z datasheet, MF2DL1001DUF/02Z pinout, MF2DL1001DUF/02Z application, or MF2DL1001DUF/02Z equivalent, key selection considerations include its 17 pF antenna interface for Class 1 smart card designs, transaction-protected value file with upper/lower limits, LRP-wrapped AES side-channel resistance, TMAC support for payment clearing verification, and functional compatibility with MIFARE DESFire EV2 multi-application environments.
Technical Context
The MF2DL1001DUF/02Z implements a dedicated contactless PICC architecture compliant with ISO/IEC 14443-2/3/4 Type A, supporting data rates up to 848 kbit/s and configurable ATS for legacy terminal interoperability. Its on-die analog front-end includes a rectifier, band-gap reference, and resonance capacitor interface optimized for 13.56 MHz operation with 17 pF input capacitance.
Digital execution relies on an embedded CPU/MMU with ROM firmware, AES-128 co-processors, TRNG, and dedicated security sensors. Memory management enforces atomic transactions via automatic anti-tearing, while file-level access control uses five customer-defined keys and per-file CommMode.Plain/MAC/Full settings aligned with ISO/IEC 7816-4 command semantics.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| RF Interface | Fully compliant with ISO/IEC 14443-2/3/4 Type A; enables interoperability with NFC smartphones and legacy proximity terminals. |
| User Memory | 640 bytes organized as six pre-defined ISO/IEC 7816-4 files: three StandardData (256/256/32 B), one Value (4-byte signed integer), one CyclicRecord (4 × 16 B), and optional TMAC file. |
| Security | AES-128 encryption with five customer-defined keys; optional LRP-wrapped AES for enhanced side-channel/fault resistance; Common Criteria EAL4 certified. |
| Input Capacitance | 17 pF - optimized for standard Class 1 smart card antenna designs per ISO/IEC 14443-2. |
| Data Retention & Endurance | 10-year data retention and minimum 200,000 write cycles per EEPROM cell - validated at 22 °C. |
| Communication Modes | Three modes: Plain (unencrypted), MAC-protected (integrity/authenticity), and Full (full encryption + CMAC) - selectable per file or command. |
| Transaction Protection | Built-in anti-tearing mechanism; optional Transaction Message Authentication Code (TMAC) file for cryptographic transaction checksums verifiable by clearing entities. |
Pinout & Package
MF2DL1001DUF/02Z is supplied in an FFC (Film Frame Carrier) wafer format - sawn, 75 μm thickness, Au bumps - intended for module assembly into plastic leadless carriers (e.g., MOA4/MOA8) or embedded antenna substrates. It has no active pins; electrical interface is exclusively via two antenna terminals (LA and LB).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| LA | Antenna coil connection LA | Primary RF input terminal for 13.56 MHz carrier coupling; forms resonant LC tank with external antenna and internal 17 pF capacitance. |
| LB | Antenna coil connection LB | Secondary RF input terminal completing antenna loop; enables balanced differential coupling and EMI resilience. |
Key Features
| Feature | Design Value |
|---|---|
| File-based ISO/IEC 7816-4 structure | Predefined six-file layout (DF + EFs) enables rapid deployment of access, ticketing, and micropayment logic without custom filesystem development. |
| Value file with bounds enforcement | 4-byte signed integer storage with programmable upper/lower limits ensures safe monetary operations - e.g., transit fare capping or loyalty point ceilings. |
| Cyclic record logging | 4-entry × 16-byte on-card transaction log supports audit trails for entry/exit events or service usage without host-side storage dependency. |
| LRP-wrapped AES cryptography | Leakage Resilient Primitive enhances physical-layer attack resistance beyond standard AES-128 - critical for high-trust credential applications. |
| MIFARE DESFire EV2 compatibility | Shared command set and file system allows MF2DL1001DUF/02Z-based single applications to coexist in multi-application EV2 environments with minimal integration effort. |
Applications
| Transport Ticketing | Access Management |
|---|---|
Use Scenario: Contactless tap-in/tap-out for metro, bus, or light rail systems with offline balance validation and fare capping. IC Role / Device Role / Timing Role: Secure PICC executing value file debit/credit and cyclic record logging of journey events - all within <100 ms per transaction. Use Value: Enables offline fare calculation and audit logging using only on-card resources, eliminating real-time network dependency during peak boarding. |
Use Scenario: Physical access control for office buildings or secure facilities using encrypted credential presentation and dynamic session keys. IC Role / Device Role / Timing Role: ISO/IEC 14443-4-compliant PICC performing mutual 3-pass AES authentication and file-read operations for credential validation. Use Value: Prevents cloning and replay attacks via LRP-wrapped AES and Random ID support - meeting GDPR and national identity assurance requirements. |
| Electronic Voucher | Loyalty Program |
Use Scenario: Disposable or reusable digital vouchers for retail promotions, redeemed at POS terminals via NFC handshake. IC Role / Device Role / Timing Role: Value file storing voucher balance with upper limit enforced at commit; TMAC file validating redemption integrity for backend reconciliation. Use Value: Guarantees voucher validity and prevents double-spending through atomic transaction commits and cryptographic TMAC verification. |
Use Scenario: Tap-to-earn/tap-to-redeem loyalty cards where points accrue per transaction and are redeemable for discounts or rewards. IC Role / Device Role / Timing Role: StandardData file storing member ID and profile metadata; Value file tracking accumulated points with lower-bound zero enforcement. Use Value: Supports offline point updates and redemption across distributed POS systems - no cloud sync required for basic loyalty functions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar contactless secure application IC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MF2DL1001DUD/02 | Same die, identical functionality, but 120 μm wafer thickness and 17 pF input capacitance - optimized for thicker module carriers. | Preferred for MOA8/SOT500-4 modules requiring mechanical robustness; less suitable for ultra-thin wristband or fob form factors. | Select MF2DL1001DUD/02 when module stack height > 0.6 mm is acceptable and higher mechanical yield is prioritized over minimal thickness. |
| MF2DLH1001DUF/02 | Same 75 μm wafer thickness as MF2DL1001DUF/02Z, but 50 pF input capacitance - designed for small-form-factor devices like key fobs and wearables. | Required for compact antenna designs with reduced coil area; incompatible with standard Class 1 smart card antennas calibrated for 17 pF. | Choose MF2DLH1001DUF/02 only when integrating into sub-30 mm diameter fobs or wristbands where antenna size constraints demand higher input capacitance. |
Compared with MF2DL1001DUF/02Z, MF2DL1001DUD/02 offers greater mechanical stability in thicker modules, while MF2DLH1001DUF/02 enables miniaturization at the cost of antenna redesign - neither is pin-compatible nor drop-in replaceable due to differing wafer thickness and capacitance specifications.
Availability
MF2DL1001DUF/02Z is available at Aetrix Electronics and suitable for transport ticketing, physical access control, and electronic voucher applications requiring stable component supply, long-term lifecycle support, and traceable sourcing from authorized NXP channels.
Supply support for MF2DL1001DUF/02Z includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and identification markets, with deep expertise in contactless IC design and Common Criteria–certified security architectures.
The MF2DL(H)x0 product line delivers cost-optimized, single-application secure ICs targeting high-volume, privacy-sensitive use cases such as transit, access, and loyalty - balancing performance, certification rigor, and ease of integration with existing infrastructure.
FAQ
What is the primary function of the MF2DL1001DUF/02Z in a contactless system?
The MF2DL1001DUF/02Z serves as a secure contactless PICC (Proximity Integrated Circuit Card) implementing the MIFARE DESFire Light platform. It executes ISO/IEC 14443-4 communication, performs AES-128 mutual authentication, manages six pre-defined ISO/IEC 7816-4 files, and enforces transaction-atomic operations - all within a single-die IC. Its role is to securely store and process application data (e.g., transit balances, access credentials) without requiring host-side cryptographic processing. The MF2DL1001DUF/02Z is not a reader IC or MCU; it operates exclusively as a passive, field-powered smart card IC.
Does the MF2DL1001DUF/02Z support NFC Forum Type 4 Tag operation?
Yes, the MF2DL1001DUF/02Z supports NFC Forum Type 4 Tag operation through its ISO/IEC 7816-4 file system and command set. Its default DF name and file structure comply with NFC Type 4 Tag requirements, and users can configure AID and FID to match existing Type 4 deployments. The IC supports NDEF message wrapping via standard ISOReadBinary/ISOUpdateBinary commands on designated StandardData files. However, native NDEF parsing is not implemented - host readers must handle NDEF formatting, while the MF2DL1001DUF/02Z provides secure, authenticated storage and access control for the underlying data.
How does the Transaction Message Authentication Code (TMAC) feature work in the MF2DL1001DUF/02Z?
The TMAC feature in the MF2DL1001DUF/02Z generates a cryptographic checksum over the complete transaction payload - including value changes, record writes, and reader ID - using a dedicated AES-128 TMAC key. This checksum is stored in the TMAC file alongside a transaction counter and is automatically updated only upon successful CommitTransaction. Clearing entities verify the TMAC using the same key, ensuring transaction integrity and preventing tampering or replay. The MF2DL1001DUF/02Z does not compute TMAC on-the-fly during read; it stores committed values for post-transaction validation, making it suitable for offline micropayment reconciliation.
Can the MF2DL1001DUF/02Z be used in wearable form factors like wristbands?
The MF2DL1001DUF/02Z is rated for 17 pF input capacitance and targets standard Class 1 smart card antenna designs, not ultra-small form factors. For wristbands or key fobs with limited antenna area, NXP specifies the MF2DLH1001DUF/02 variant - which uses the same 75 μm wafer but delivers 50 pF input capacitance to compensate for reduced coil inductance. Using MF2DL1001DUF/02Z in a wristband would require antenna redesign to meet 17 pF impedance matching, likely resulting in reduced read range or reliability. Therefore, MF2DL1001DUF/02Z is not recommended for wearables; select MF2DLH1001DUF/02 instead.
What security certifications apply to the MF2DL1001DUF/02Z?
The MF2DL1001DUF/02Z holds Common Criteria EAL4 certification for both hardware and software components, validating its resistance to logical and physical attacks including side-channel analysis and fault injection. It implements AES-128 per NIST SP 800-38A/B, supports 3-pass mutual authentication, and includes ECC-based NXP originality signatures to prevent counterfeiting. The optional LRP wrapper around AES further strengthens side-channel resilience. These certifications are inherited from the MIFARE DESFire Light platform and apply specifically to the MF2DL1001DUF/02Z configuration - no additional evaluation is required for this exact part number.
MF2DL1001DUF/02Z Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- MIFARE®
- Package/Case:
- Die
- Packaging:
- Tray
- Product Status:
- Active
- Type:
- RFID Transponder
- Frequency:
- 13.56MHz
- Standards:
- Mifare, ISO 14443, ISO 7816-4
- Interface:
- -
- Voltage - Supply:
- -
- Operating Temperature:
- -25°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- -
- Supplier Device Package:
- Wafer
MF2DL1001DUF/02Z FAQ
1.How can I place an order for MF2DL1001DUF/02Z through Aetrix?
Please submit a Request for Quotation (RFQ) for MF2DL1001DUF/02Z on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MF2DL1001DUF/02Z reliable?
The price and inventory of MF2DL1001DUF/02Z are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MF2DL1001DUF/02Z is usually 5 days.
3.What payment methods are accepted for MF2DL1001DUF/02Z?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MF2DL1001DUF/02Z transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MF2DL1001DUF/02Z?
MF2DL1001DUF/02Z orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MF2DL1001DUF/02Z order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MF2DL1001DUF/02Z?
For technical support, including MF2DL1001DUF/02Z datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MF2DL1001DUF/02Z requirements.
6.How does Aetrix verify that MF2DL1001DUF/02Z is sourced from the original manufacturer or authorized distributors?
All MF2DL1001DUF/02Z products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MF2DL1001DUF/02Z meets industry standards.
7.What is the process for return or replacement of MF2DL1001DUF/02Z?
All MF2DL1001DUF/02Z units undergo pre-shipment inspection (PSI). If there is an issue with MF2DL1001DUF/02Z, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MF2DL1001DUF/02Z part is unused and in its original packaging.
Return procedure for MF2DL1001DUF/02Z:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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