My Inquiry
My Account
NXP Semiconductors MF2DLH1001DUD/02V
- Part No.:
- MF2DLH1001DUD/02V
- Manufacturer:
- NXP Semiconductors
- Category:
- RFID, RF Access, Monitoring ICs
- Package:
- Die
- Datasheet:
-
MF2DLH1001DUD/02V.pdf
- Description:
- MIFARE DESFIRE LIGHT CONTACTLESS
- Quantity:
- Payment:
- Shipping:
Inventory:4,924
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MF2DLH1001DUD/02V from NXP Semiconductors is a contactless application IC implementing the MIFARE DESFire Light platform for secure, single-entity smart card systems. It delivers AES-128 authentication, 640 bytes of ISO/IEC 7816-4 file-based user memory (including three standard data files, one value file, and one cyclic record file), 50 pF input capacitance for small-form-factor antenna design, and full ISO/IEC 14443-2/3/4 and ISO/IEC 7816-4 compliance - deployed in transport ticketing, access management, and electronic voucher applications.
For engineers reviewing the MF2DLH1001DUD/02V datasheet, MF2DLH1001DUD/02V pinout, MF2DLH1001DUD/02V application, or MF2DLH1001DUD/02V equivalent, this page provides verified technical context on its LRP-wrapped AES security, transaction-consistent file system, 13.56 MHz RF interface with up to 848 kbit/s data rates, and dual-capacitance (50 pF) wafer-level packaging optimized for wristbands and key fobs.
Technical Context
The MF2DLH1001DUD/02V implements a dedicated contactless PICC architecture compliant with ISO/IEC 14443A Type A, featuring integrated analog front-end (LA/LB antenna interface), digital baseband (CIU, CPU/MMU, AES-128 co-processor), and EEPROM-based file system. Its RF interface supports ATQA 0344h (7-byte UID) or 0304h (Random ID), SAK 20h, and configurable ATS including TL=06h, T0=77h, TA(1)=77h, TB(1)=71h, TC(1)=02h, and T1=80h.
It executes transaction-atomic operations via CommitTransaction, enforces per-file access control using five customer-defined AES-128 keys, and supports optional Transaction Message Authentication Code (TMAC) with dedicated TMAC file (EF0Fh). Security includes EAL4 Common Criteria certification, LRP-wrapped AES for side-channel resistance, and ECC-based NXP originality signature verification.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| RF Protocol | Fully compliant with ISO/IEC 14443-2/3/4 and ISO/IEC 7816-4 - ensures interoperability with legacy terminals, NFC smartphones, and MIFARE DESFire EV2 infrastructure. |
| User Memory | 640 bytes organized as six pre-defined ISO/IEC 7816-4 files: three StandardData files (32 + 256 + 256 bytes), one Value file (4-byte signed integer), one CyclicRecord file (4 × 16-byte entries), and one optional TMAC file - enabling micropayment, logging, and secure transaction auditing. |
| Input Capacitance | 50 pF - enables reliable coupling with compact antennas in key fobs, wristbands, and thin cards without tuning compensation. |
| Data Retention & Endurance | 10-year data retention and ≥200,000 write cycles per EEPROM cell - suitable for high-cycle applications like transit fare updates and loyalty point accrual. |
| Security Certification | Common Criteria EAL4 certified for both hardware and software - validated assurance level for government-issued credentials and regulated financial services. |
| Communication Speeds | Supports 106, 212, 424, and 848 kbit/s - allows fast transaction throughput in high-throughput gates and mobile readers. |
| Authentication | Three-pass mutual authentication with five configurable AES-128 keys and optional LRP-wrapped AES - mitigates side-channel and fault injection attacks in physical deployment environments. |
Pinout & Package
MF2DLH1001DUD/02V is supplied in FFC (Film Frame Carrier) wafer format - sawn, 120 μm thickness, Au bumps - intended for direct flip-chip bonding onto antenna substrates. It has no traditional package pins; electrical connection is made exclusively via two RF terminals: LA and LB.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| LA | Antenna coil connection (terminal A) | Primary RF input node for 13.56 MHz carrier coupling; requires impedance-matched trace layout to achieve optimal read range at 50 pF input capacitance. |
| LB | Antenna coil connection (terminal B) | Secondary RF input node completing resonant LC tank; LA–LB differential interface enables robust operation across variable antenna geometries and environmental loading. |
Key Features
| Feature | Design Value |
|---|---|
| LRP-wrapped AES cryptography | Enhances side-channel and fault resistance beyond standard AES-128 by applying Leakage Resilient Primitive as cryptographic wrapper - critical for tamper-resilient credential issuance. |
| Transaction-consistent file updates | Atomic CommitTransaction mechanism ensures all file modifications (value, record, data) either fully commit or fully roll back - prevents partial writes during power loss or RF dropout. |
| Configurable Random ID (RID) | Enables privacy-by-design compliance (e.g., GDPR) by replacing fixed UID with transient 4-byte identifier - eliminates persistent tracking across reader sessions. |
| ISO/IEC 7816-4 file system | Predefined DF with six EFs (EF00h, EF01h, EF03h, EF04h, EF0Fh, EF1Fh) and per-file access rights - simplifies integration into existing PKI and EMV-compliant backend systems. |
| TMAC file support (EF0Fh) | Stores transaction counter (TMC), transaction MAC value (TMV), and committed ReaderID - enables offline transaction verification and clearing entity reconciliation without real-time network dependency. |
| Functional compatibility with DESFire EV2 | Shares command set subset, secure messaging structure, and file system layout - allows incremental migration from MF2DLH1001DUD/02V to multi-application EV2 platforms without re-engineering core application logic. |
Applications
| Transport Ticketing | Access Management |
|---|---|
Use Scenario: Contactless tap-in/tap-out at metro gates and bus validators with offline balance validation and fare capping. IC Role / Device Role / Timing Role: Secure PICC executing AES-authenticated value file debit/credit and cyclic record logging of last 4 journeys. Use Value: Enables 10 cm read range and sub-200 ms transaction time using 50 pF input capacitance and 848 kbit/s mode - reducing passenger dwell time and queue formation. |
Use Scenario: Physical access control for office buildings using multi-level credential hierarchy (employee, contractor, visitor). IC Role / Device Role / Timing Role: File-based authentication token storing encrypted access profiles and time-based permissions in StandardData files. Use Value: Leverages per-file AES-128 key control and ChangeFileSettings to dynamically update access rights without reissuing cards - lowering administrative overhead. |
| Electronic Voucher | Loyalty Program |
Use Scenario: Retail gift card with balance, expiry, and merchant-specific restrictions stored on device. IC Role / Device Role / Timing Role: Value file (EF03h) enforcing upper/lower limits and atomic credit/debit; TMAC file (EF0Fh) validating redemption integrity. Use Value: Prevents balance manipulation via LRP-wrapped AES and TMAC-backed transaction audit trail - meeting PCI SSC requirements for stored-value instruments. |
Use Scenario: Tap-to-earn points at POS terminals with instant balance reflection and campaign-triggered notifications. IC Role / Device Role / Timing Role: Cyclic record file (EF01h) logging last 4 redemptions; StandardData file (EF00h) storing encrypted member ID and tier status. Use Value: Achieves <150 ms response time using 424 kbit/s mode and plain communication for non-sensitive reads - improving checkout throughput. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar contactless application IC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MF2DL1001DUD/02 | 17 pF input capacitance vs. 50 pF - requires larger antenna area or external matching for equivalent read range. | Optimized for standard smart cards (ID-1 form factor); less suitable for ultra-thin or curved surfaces. | Select when integrating into legacy card laminates with established 17 pF antenna designs and no space constraints. |
| MF2DLH1000DA8/02 | MOA8 module package (SOT500-4) with pre-mounted antenna interface vs. bare-die FFC - adds mechanical robustness but reduces form factor flexibility. | Targeted at module-based designs (e.g., embedded readers, payment terminals) rather than direct antenna bonding. | Select when requiring solderable, tested RF performance and simplified assembly over wafer-level customization. |
Compared with MF2DLH1001DUD/02V, MF2DL1001DUD/02 trades antenna miniaturization for broader compatibility with conventional card layouts, while MF2DLH1000DA8/02 shifts from wafer-level integration to plug-and-play module deployment - making MF2DLH1001DUD/02V uniquely suited for high-volume, space-constrained wearable and fob applications demanding 50 pF optimization.
Availability
MF2DLH1001DUD/02V is available at Aetrix Electronics and suitable for transport ticketing, access management, and electronic voucher applications requiring stable component supply, long-term lifecycle assurance, and wafer-level sourcing for custom antenna integration.
Supply support for MF2DLH1001DUD/02V includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and identification markets, with headquarters in Eindhoven, Netherlands.
The MIFARE DESFire Light product line targets cost-optimized, single-application contactless credential systems - delivering certified security, NFC Forum Type 4 Tag compatibility, and seamless upgrade paths to multi-application DESFire EV2 platforms.
FAQ
What is the primary function of the MF2DLH1001DUD/02V in a contactless system?
The MF2DLH1001DUD/02V functions as a secure contactless PICC (Proximity Integrated Circuit Card) implementing the MIFARE DESFire Light platform. It executes ISO/IEC 14443-4 transactions, manages 640 bytes of file-based user memory with AES-128 authentication, and supports value, record, and data file operations - all within a certified EAL4 security framework. Its 50 pF input capacitance makes MF2DLH1001DUD/02V especially effective in compact form factors such as wristbands and key fobs.
Does the MF2DLH1001DUD/02V support NFC smartphone interaction?
Yes, the MF2DLH1001DUD/02V fully supports NFC smartphone interaction through ISO/IEC 14443-4 and ISO/IEC 7816-4 compliance. It responds to standard NFC Forum Type 4 Tag commands, accepts Android Host Card Emulation (HCE) readers, and enables use cases like business card sharing and mobile pairing. The MF2DLH1001DUD/02V also supports Random ID to comply with privacy regulations during smartphone-initiated sessions.
How does the MF2DLH1001DUD/02V ensure data integrity during power loss or RF interruption?
The MF2DLH1001DUD/02V ensures data integrity using a transaction-oriented anti-tearing mechanism: all file modifications (e.g., value updates, record writes) remain pending until CommitTransaction is successfully executed. If interrupted, the prior state is preserved. This applies to Value files, CyclicRecord files, and TMAC file updates - guaranteeing atomicity without external backup circuitry. MF2DLH1001DUD/02V implements this natively in silicon, not via firmware emulation.
Can the MF2DLH1001DUD/02V be used in multi-application environments?
The MF2DLH1001DUD/02V is designed for single-entity, single-application deployments but maintains functional compatibility with MIFARE DESFire EV2. While it cannot host multiple independent applications itself, an application developed for MF2DLH1001DUD/02V can be migrated to an EV2 platform where it coexists with other applications - enabling phased upgrades without rewriting core logic. MF2DLH1001DUD/02V does not support dynamic application loading or inter-application isolation.
What antenna design considerations apply to the MF2DLH1001DUD/02V due to its 50 pF input capacitance?
The 50 pF input capacitance of the MF2DLH1001DUD/02V requires antenna designs with lower inductance to maintain resonance at 13.56 MHz - typically achieved using smaller loop areas, fewer turns, or higher-conductivity traces. Unlike 17 pF variants, it avoids the need for external capacitors or complex matching networks, simplifying layout in constrained spaces like plastic fobs or silicone wristbands. Antenna tuning must validate read range at both low and high field strengths per ISO/IEC 10373-6.
MF2DLH1001DUD/02V Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- MIFARE®
- Package/Case:
- Die
- Packaging:
- Tray
- Product Status:
- Active
- Type:
- RFID Transponder
- Frequency:
- 13.56MHz
- Standards:
- Mifare, ISO 14443, ISO 7816-4
- Interface:
- -
- Voltage - Supply:
- -
- Operating Temperature:
- -25°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- -
- Supplier Device Package:
- Wafer
MF2DLH1001DUD/02V FAQ
1.How can I place an order for MF2DLH1001DUD/02V through Aetrix?
Please submit a Request for Quotation (RFQ) for MF2DLH1001DUD/02V on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MF2DLH1001DUD/02V reliable?
The price and inventory of MF2DLH1001DUD/02V are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MF2DLH1001DUD/02V is usually 5 days.
3.What payment methods are accepted for MF2DLH1001DUD/02V?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MF2DLH1001DUD/02V transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MF2DLH1001DUD/02V?
MF2DLH1001DUD/02V orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MF2DLH1001DUD/02V order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MF2DLH1001DUD/02V?
For technical support, including MF2DLH1001DUD/02V datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MF2DLH1001DUD/02V requirements.
6.How does Aetrix verify that MF2DLH1001DUD/02V is sourced from the original manufacturer or authorized distributors?
All MF2DLH1001DUD/02V products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MF2DLH1001DUD/02V meets industry standards.
7.What is the process for return or replacement of MF2DLH1001DUD/02V?
All MF2DLH1001DUD/02V units undergo pre-shipment inspection (PSI). If there is an issue with MF2DLH1001DUD/02V, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MF2DLH1001DUD/02V part is unused and in its original packaging.
Return procedure for MF2DLH1001DUD/02V:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MF2DLH1001DUD/02V Tags
-
SL2S2602FTBX
NXP Semiconductors
-
ST25DV04K-IER6S3
STMicroelectronics
-
ST25DV04K-IER6C3
STMicroelectronics
-
LXMSJZNCMD-217
Murata Electronics
-
NT3H2111W0FTTJ
NXP Semiconductors
-
NT3H2111W0FHKH
NXP Semiconductors
-
M24LR04E-RMC6T/2
STMicroelectronics
-
ST25DV04KC-JF6D3
STMicroelectronics
-
ST25DV64KC-IE6S3
STMicroelectronics
-
ST25DV64K-IER6T3
STMicroelectronics
-
NT3H2211W0FTTJ
NXP Semiconductors
-
NT3H2211W0FHKH
NXP Semiconductors
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
