Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

NXP Semiconductors MF3D2200DA4/00J

Part No.:
MF3D2200DA4/00J
Manufacturer:
NXP Semiconductors
Category:
RFID, RF Access, Monitoring ICs
Package:
MOA4, Smart Card Module
Datasheet:
AetrixMF3D2200DA4/00J.pdf
Description:
IC RFID TRANSP 13.56MHZ PLLMC
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,191

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

MF3D2200DA4/00J from NXP Semiconductors is a contactless multi-application smart card IC compliant with ISO/IEC 14443A, featuring 2 KB EEPROM, 17 pF input capacitance, Common Criteria EAL5+ security certification, and support for AES-128 and 3DES cryptographic engines. It serves as the secure core in transit ticketing cards, student IDs, and micro-payment systems where tamper-resistant file management and transaction integrity are critical.

For engineers reviewing the MF3D2200DA4/00J datasheet, MF3D2200DA4/00J pinout, MF3D2200DA4/00J application, or MF3D2200DA4/00J equivalent, this page delivers verified technical context, exact memory and RF interface specifications, confirmed backward compatibility with MIFARE DESFire EV1/D40, real-world application mappings, and two validated alternative part numbers with documented functional differences.

Technical Context

The MF3D2200DA4/00J implements a dedicated ISO/IEC 14443-4 contactless interface with configurable FSCI supporting up to 128-byte frame size, operates at 13.56 MHz, and uses mutual three-pass authentication with hardware-accelerated AES-128 or 3DES. Its on-chip memory management unit (MMU) enforces strict application isolation and supports six file types including Transaction MAC files.

It integrates TRNG, voltage/rail/light/glitch sensors, and active shielding for side-channel attack resistance. The device supports optional Random ID generation and includes Proximity Check and Originality Check features to prevent relay attacks and verify genuine NXP silicon - all validated under Common Criteria EAL5+ for both hardware and software.

Key Specifications

ParameterValue and Actual Design Meaning
Memory capacity2 KB EEPROM with 25-year data retention and 500,000 write endurance cycles
RF interfaceISO/IEC 14443A compliant; supports 106–848 kbit/s data rates and configurable ATS
Cryptographic engineHardware-accelerated AES-128 and 3DES with key versioning and CMAC authentication
Security certificationCommon Criteria EAL5+ certified for both hardware and software components
Input capacitance17 pF - optimized for standard antenna designs without high-capacitance compensation
File systemUnlimited applications; up to 32 files per application across 6 file types including Transaction MAC
UIDFixed 7-byte unique identifier; optional Random ID mode for privacy-sensitive deployments

Pinout & Package

MF3D2200DA4/00J is supplied in MOA4 plastic leadless module carrier package (SOT500-2), designed for embedding into smart cards or contactless modules. This surface-mount package contains no external pins - the IC interfaces exclusively via its integrated antenna coil connection points and requires no discrete pin assignment for end-user circuit design.

Key Features

FeatureDesign Value
Transaction MAC file typeEnables cryptographically signed transaction logs stored on-card for backend auditability
MIsmartApp delegationAllows third-party application creation and management without PICC master key exposure
Virtual Card ArchitectureSupports privacy-preserving card selection across multiple virtual credentials on one physical card
Proximity CheckDetects and blocks relay attacks by measuring signal propagation time between PCD and PICC
Originality CheckVerifies genuine NXP silicon using embedded hardware signature, preventing counterfeit integration

Applications

Public Transport TicketingSecure Campus Access

Use Scenario: Contactless fare payment and trip validation in metro/bus systems with offline balance updates.

IC Role / Device Role / Timing Role: Secure storage of encrypted e-purse balances, trip history, and access rights; performs mutual authentication with gate readers.

Use Value: Enables offline transaction processing with guaranteed atomicity via anti-tear mechanism and Transaction MAC logging.

Use Scenario: Multi-door building access control with role-based permissions and visitor pass issuance.

IC Role / Device Role / Timing Role: Hosts separate applications for staff ID, visitor badge, and facility reservation - each with independent key sets and file structures.

Use Value: Eliminates need for multiple physical credentials through MIsmartApp-delegated application management and shared file access.

Micro-Payment & LoyaltyEvent Ticketing

Use Scenario: Tap-to-pay vending machines and retail kiosks with loyalty point accrual and redemption.

IC Role / Device Role / Timing Role: Stores value files with backup, linear record files for transaction history, and AES-encrypted session keys for secure messaging.

Use Value: Supports fast, low-power transactions (<100 ms) while maintaining PCI-compliant data integrity via CMAC and encrypted channel.

Use Scenario: Entry validation for concerts/festivals with dynamic seat assignment and re-entry tracking.

IC Role / Device Role / Timing Role: Holds event-specific application with cyclic record file for entry timestamps and Transaction MAC for backend reconciliation.

Use Value: Prevents duplicate scanning via Originality Check and ensures tamper-proof audit trail using on-card MAC generation.

Equivalent & Alternatives

The following parts are listed as comparable options for similar contactless multi-application IC applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MF3D4200DA4/014 KB EEPROM (double memory), same 17 pF input capacitance and MOA4/SOT500-2 packageSupports larger application footprints (e.g., multi-agency transit + banking + health records)Select when >2 KB persistent storage is required for complex multi-service credentialing
MF3DH2200DA4/01Same 2 KB EEPROM but 70 pF input capacitance for compact antenna integrationBetter suited for thin-form-factor cards or wearables with space-constrained antenna layoutsSelect when antenna miniaturization demands higher input capacitance without changing memory or security profile

Compared with MF3D4200DA4/01 and MF3DH2200DA4/01, the MF3D2200DA4/00J provides optimal cost-performance balance for mid-tier transit and ID applications requiring EAL5+ security and 2 KB of trusted storage - avoiding over-provisioned memory or unnecessary capacitance tuning.

Availability

MF3D2200DA4/00J is available at Aetrix Electronics and suitable for public transport ticketing, secure campus access, and micro-payment systems requiring stable component supply, long-term lifecycle assurance, and certified security compliance.

Supply support for MF3D2200DA4/00J includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and identification markets, with headquarters in Eindhoven, Netherlands.

The MF3D2200DA4/00J belongs to the MIFARE DESFire EV2 product line - engineered specifically for high-assurance, multi-application contactless smart cards used in transportation, government ID, and secure commerce ecosystems.

FAQ

What security certifications does MF3D2200DA4/00J hold?

The MF3D2200DA4/00J is certified to Common Criteria EAL5+ for both hardware and software components - the same assurance level required for banking cards and electronic passports. This certification validates its resistance to physical, fault injection, and side-channel attacks, and confirms secure boot, key management, and cryptographic operation integrity. All security claims for MF3D2200DA4/00J are derived directly from NXP's official Product Short Data Sheet Rev. 3.2.

Does MF3D2200DA4/00J support ISO/IEC 7816-4 commands?

Yes, MF3D2200DA4/00J fully supports ISO/IEC 7816-4 APDU structure and file system commands including SELECT FILE (INS A4), READ BINARY (B0), UPDATE BINARY (D6), READ RECORDS (B2), APPEND RECORD (E2), GET CHALLENGE (84), INTERNAL AUTHENTICATE (88), and EXTERNAL AUTHENTICATE (82). These enable interoperability with existing smart card infrastructure and simplify migration from legacy contact-based systems.

How does MF3D2200DA4/00J handle memory corruption during power loss?

MF3D2200DA4/00J implements a transaction-oriented automatic anti-tear mechanism that guarantees atomic updates across multiple files. When a power interruption occurs mid-transaction, either all related file changes commit successfully or none apply - preserving data consistency. This behavior is hardware-enforced and applies to all file types supporting backup, including Value, Linear Record, and Cyclic Record files.

Is MF3D2200DA4/00J backward compatible with older MIFARE DESFire generations?

Yes, MF3D2200DA4/00J operates in default delivery configuration as a MIFARE DESFire EV1 device, ensuring full functional backward compatibility with MF3ICD40 and MIFARE DESFire EV1 systems. New EV2 features like Transaction MAC and MIsmartApp require explicit activation via dedicated commands and do not interfere with legacy infrastructure operation.

What is the difference between MF3D2200DA4/00J and MF3D2200DA4/01?

The MF3D2200DA4/00J and MF3D2200DA4/01 share identical electrical, functional, and security specifications - including 2 KB EEPROM, 17 pF input capacitance, MOA4 package, and EAL5+ certification. The suffix "/00J" denotes a specific wafer lot or internal revision code used by NXP for traceability; it does not indicate a functional or parametric deviation from the /01 variant referenced in the official ordering table.

MF3D2200DA4/00J Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
-
Package/Case:
MOA4, Smart Card Module
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Type:
RFID Transponder
Frequency:
13.56MHz
Standards:
ISO 14443
Interface:
-
Voltage - Supply:
-
Operating Temperature:
-25°C ~ 70°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
PLLMC

MF3D2200DA4/00J FAQ

1.How can I place an order for MF3D2200DA4/00J through Aetrix?

Please submit a Request for Quotation (RFQ) for MF3D2200DA4/00J on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MF3D2200DA4/00J reliable?

The price and inventory of MF3D2200DA4/00J are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MF3D2200DA4/00J is usually 5 days.

3.What payment methods are accepted for MF3D2200DA4/00J?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MF3D2200DA4/00J transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MF3D2200DA4/00J?

MF3D2200DA4/00J orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MF3D2200DA4/00J order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MF3D2200DA4/00J?

For technical support, including MF3D2200DA4/00J datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MF3D2200DA4/00J requirements.

6.How does Aetrix verify that MF3D2200DA4/00J is sourced from the original manufacturer or authorized distributors?

All MF3D2200DA4/00J products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MF3D2200DA4/00J meets industry standards.

7.What is the process for return or replacement of MF3D2200DA4/00J?

All MF3D2200DA4/00J units undergo pre-shipment inspection (PSI). If there is an issue with MF3D2200DA4/00J, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MF3D2200DA4/00J part is unused and in its original packaging.

Return procedure for MF3D2200DA4/00J:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

MF3D2200DA4/00J Tags

  • MF3D2200DA4/00J
  • MF3D2200DA4/00J PDF
  • MF3D2200DA4/00J Datasheet
  • MF3D2200DA4/00J Specifications
  • MF3D2200DA4/00J Images
  • NXP Semiconductors
  • NXP Semiconductors MF3D2200DA4/00J
  • Buy MF3D2200DA4/00J
  • MF3D2200DA4/00J Price
  • MF3D2200DA4/00J Distributor
  • MF3D2200DA4/00J Supplier
  • MF3D2200DA4/00J Wholesale
Related Products
SL2S2602FTBX
SL2S2602FTBX

NXP Semiconductors

ST25DV04K-IER6S3
ST25DV04K-IER6S3

STMicroelectronics

ST25DV04K-IER6C3
ST25DV04K-IER6C3

STMicroelectronics

LXMSJZNCMD-217
LXMSJZNCMD-217

Murata Electronics

NT3H2111W0FTTJ
NT3H2111W0FTTJ

NXP Semiconductors

NT3H2111W0FHKH
NT3H2111W0FHKH

NXP Semiconductors

M24LR04E-RMC6T/2
M24LR04E-RMC6T/2

STMicroelectronics

ST25DV04KC-JF6D3
ST25DV04KC-JF6D3

STMicroelectronics

ST25DV64KC-IE6S3
ST25DV64KC-IE6S3

STMicroelectronics

ST25DV64K-IER6T3
ST25DV64K-IER6T3

STMicroelectronics

NT3H2211W0FTTJ
NT3H2211W0FTTJ

NXP Semiconductors

NT3H2211W0FHKH
NT3H2211W0FHKH

NXP Semiconductors

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER