NXP Semiconductors MF3D2201DUD/00V

Overview

MF3D2201DUD/00V from NXP Semiconductors is a contactless multi-application IC compliant with ISO/IEC 14443A, featuring 2 KB EEPROM, 17 pF input capacitance, Common Criteria EAL5+ security certification, and support for AES-128 and 3DES cryptographic engines. It serves as the secure core of smart city mobility cards, public transport tickets, and access control systems requiring high-integrity transaction handling.

For engineers reviewing the MF3D2201DUD/00V datasheet, MF3D2201DUD/00V pinout, MF3D2201DUD/00V application, or MF3D2201DUD/00V equivalent, key selection considerations include its 2 KB memory capacity, EAL5+ hardware/software security rating, Transaction MAC file support, MIsmartApp delegated management capability, and backward compatibility with MIFARE DESFire EV1 and D40 infrastructure.

Technical Context

The MF3D2201DUD/00V implements a dedicated ISO/IEC 14443-4 RF interface with configurable FSCI supporting up to 128-byte frame size, operates at 13.56 MHz, and delivers data rates up to 848 kbit/s. Its on-chip architecture integrates a TRNG, voltage/rail/light/glitch sensors, and active shielding for tamper resistance.

It supports mutual three-pass authentication using hardware-accelerated DES (56/112/168-bit) or AES-128, enforces application-level access control via up to 14 keys per application, and provides transaction-oriented anti-tear protection across all file types including Standard Data, Value, Linear/Cyclic Record, Backup Data, and Transaction MAC files.

Key Specifications

Pinout & Package

MF3D2201DUD/00V is supplied in FFC (Film Frame Carrier) wafer format - an unpackaged die intended for embedding into smart card laminates or custom modules. It has no external pins; electrical connection is made via bond pads compatible with standard flip-chip or wire-bond assembly processes. The device uses a contactless RF interface only and contains no wire-bondable I/O terminals.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar contactless multi-application IC applications.

Compared with MF3D4201DUD/01, MF3D2201DUD/00V offers lower memory cost and smaller die area for simpler deployments; compared with MF3DH2201DUD/01, it delivers better RF performance in conventional smart card form factors while maintaining identical security and functional capabilities.

Availability

MF3D2201DUD/00V is available at Aetrix Electronics and suitable for public transport ticketing, secure access management, and micro-payment systems requiring stable component supply, long-term lifecycle support, and certified security compliance.

Supply support for MF3D2201DUD/00V includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and identification markets, with leadership in contactless IC technology since the introduction of MIFARE.

The MF3D2201DUD/00V belongs to the MIFARE DESFire EV2 product line, engineered specifically for high-assurance, multi-application contactless smart cards used in Smart City infrastructure, transit systems, and secure identity programs.

FAQ

What is the memory capacity and type used in MF3D2201DUD/00V?

The MF3D2201DUD/00V integrates 2 KB of electrically erasable programmable read-only memory (EEPROM) with guaranteed 25-year data retention and typical 500,000 write endurance cycles. This non-volatile memory stores applications, cryptographic keys, transaction logs, and user data in a flexible file system supporting up to 32 files per application. The MF3D2201DUD/00V does not include RAM or ROM beyond its fixed firmware.

Does MF3D2201DUD/00V support AES encryption and what is its security certification level?

Yes, MF3D2201DUD/00V supports hardware-accelerated AES-128 encryption as part of its cryptographic engine alongside 3DES variants. It holds Common Criteria EAL5+ certification for both hardware and software, validating its resistance against side-channel attacks, fault injection, and logical exploitation - matching the assurance level required for banking cards and electronic passports.

Is MF3D2201DUD/00V pin-compatible with earlier MIFARE DESFire generations?

MF3D2201DUD/00V is not a packaged IC with pins; it is delivered as an unpackaged die in FFC format for embedding. Functionally, it is backward compatible with MIFARE DESFire EV1 and D40 in default delivery configuration - meaning existing readers and application logic can operate without modification, though new features like Transaction MAC require explicit activation via updated commands.

What file types does MF3D2201DUD/00V support and how many files per application?

The MF3D2201DUD/00V supports six file types: Standard Data, Backup Data, Value, Linear Record, Cyclic Record, and Transaction MAC. Each application can contain up to 32 files, with file sizes defined at creation time (except Transaction MAC). All file types benefit from automatic anti-tear protection, ensuring data consistency during power loss or RF interruption during transactions.

How does MF3D2201DUD/00V handle relay attack protection?

MF3D2201DUD/00V implements Proximity Check, a hardware-based relay attack countermeasure that measures RF field propagation time between the reader and the IC. If the measured delay exceeds a predefined threshold indicating signal extension via repeater devices, the IC aborts authentication and communication - preventing unauthorized remote access in physical access or payment scenarios. This feature is enabled by default and requires no host-side configuration.