NXP Semiconductors MF3D2301DUD/00Z

Overview

MF3D2301DUD/00Z from NXP Semiconductors is a contactless multi-application smart card IC compliant with ISO/IEC 14443A, featuring Common Criteria EAL5+ hardware and software security certification, 2 kB non-volatile memory, 17 pF input capacitance, and support for AES-128 and 3DES cryptographic engines. It serves as the secure transaction core in public transport ticketing systems where tamper-resistant data integrity and multi-service application isolation are required.

For engineers reviewing the MF3D2301DUD/00Z datasheet, MF3D2301DUD/00Z pinout, MF3D2301DUD/00Z application, or MF3D2301DUD/00Z equivalent, key selection considerations include EAL5+ security validation, Transaction MAC file support, backward compatibility with MIFARE DESFire EV2/EV1, and 7-byte UID vs. Random ID configuration for privacy-sensitive deployments.

Technical Context

The MF3D2301DUD/00Z implements a dedicated ISO/IEC 14443-4 transmission protocol stack with configurable FSCI up to 256 bytes, enabling high-speed data transfer at 106–848 kbit/s. Its on-chip analog front-end includes voltage, temperature, light, and glitch sensors for active shielding against physical attacks.

It executes mutual three-pass authentication using hardware-accelerated AES-128 or 3DES, supports up to 14 keys per application with multiple key sets (up to 16), and enforces transaction-oriented anti-tear protection across all file types-including the dedicated Transaction MAC file type-ensuring atomic updates during power loss or relay attack interruption.

Key Specifications

Pinout & Package

MF3D2301DUD/00Z is supplied in FFC (Film Frame Carrier) wafer format - 12-inch wafer, sawn, 120 μm thickness - intended for embedding into contactless smart cards or inlays. No discrete pinout applies; electrical interface is exclusively via integrated antenna coupling per ISO/IEC 14443A.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar contactless multi-application IC applications.

Compared with MF3D4301DUD/00 and MF3DH2301DUD/00, the MF3D2301DUD/00Z offers optimal cost-performance balance for mid-tier transit and access systems requiring EAL5+ assurance without memory or form-factor headroom overhead.

Availability

MF3D2301DUD/00Z is available at Aetrix Electronics and suitable for secure public transport ticketing, multi-application smart city cards, and micro-payment systems requiring stable component supply, long-term lifecycle support, and certified cryptographic assurance.

Supply support for MF3D2301DUD/00Z includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and identification markets, with leadership in contactless IC design since the introduction of MIFARE technology.

The MF3D2301DUD/00Z belongs to the MIFARE DESFire EV3 product line - engineered specifically for high-assurance, multi-service contactless applications demanding Common Criteria EAL5+ certification, flexible file architecture, and seamless migration from legacy DESFire platforms.

FAQ

What security certifications does the MF3D2301DUD/00Z hold?

The MF3D2301DUD/00Z holds Common Criteria EAL5+ certification for both hardware and software - the same assurance level required for banking cards and electronic passports. This certification validates its resistance to side-channel, fault injection, and logical attacks. The MF3D2301DUD/00Z also supports Proximity Check and Originality Check to detect relay and counterfeit devices in real time.

Does the MF3D2301DUD/00Z support backward compatibility with older MIFARE DESFire systems?

Yes, the MF3D2301DUD/00Z is functionally backward compatible with MIFARE DESFire EV2, EV1, and D40 (MF3ICD40) in its default delivery configuration. It supports legacy secure messaging modes (D40 Native, EV1, EV2) and ISO/IEC 7816-4 APDU commands. New EV3 features like Transaction MAC or Virtual Card Architecture require explicit activation via dedicated commands.

What is the memory capacity and organization of the MF3D2301DUD/00Z?

The MF3D2301DUD/00Z contains 2 kB of non-volatile memory with 25-year data retention and 1,000,000 write endurance cycles. Memory is organized into applications (no hard limit), each supporting up to 32 files of six types - including Standard Data, Value, Linear/Cyclic Record, Backup Data, and Transaction MAC files - with file sizes defined at creation time.

How does the MF3D2301DUD/00Z ensure data integrity during power loss or transaction interruption?

The MF3D2301DUD/00Z implements an automatic anti-tear mechanism for all file types with backup, ensuring atomic updates across multiple files within a single transaction. Combined with the Transaction Timer feature, it prevents Man-in-the-Middle delay attacks and guarantees that either all data fields are updated or none are altered - preserving consistency in fare calculation, access logs, or balance records.

What distinguishes the MF3D2301DUD/00Z from the MF3DH2301DUD/00 variant?

The MF3D2301DUD/00Z has 17 pF input capacitance and is optimized for standard ISO/IEC 14443A antenna designs, whereas the MF3DH2301DUD/00 variant offers 70 pF input capacitance for compact or low-inductance antenna layouts. Both share identical 2 kB memory, EAL5+ certification, and command set - the choice depends solely on antenna matching requirements in the target card or inlay.