My Inquiry
My Account
NXP Semiconductors MF3D4200DA4/00J
- Part No.:
- MF3D4200DA4/00J
- Manufacturer:
- NXP Semiconductors
- Category:
- RFID, RF Access, Monitoring ICs
- Package:
- MOA4, Smart Card Module
- Datasheet:
-
MF3D4200DA4/00J.pdf
- Description:
- IC RFID READER 13.56MHZ PLLMC
- Quantity:
- Payment:
- Shipping:
Inventory:3,337
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MF3D4200DA4/00J from NXP Semiconductors is a contactless multi-application IC compliant with ISO/IEC 14443A, featuring 4 KB EEPROM, 17 pF input capacitance, Common Criteria EAL5+ security certification, and support for AES-128 and 3DES cryptographic engines. It serves as the secure core in smart city mobility cards, enabling concurrent public transport, e-payment, and access control on a single credential.
For engineers reviewing the MF3D4200DA4/00J datasheet, MF3D4200DA4/00J pinout, MF3D4200DA4/00J application, or MF3D4200DA4/00J equivalent, key selection considerations include its 4 KB NV memory capacity, 17 pF input capacitance optimized for standard antenna designs, EV2-specific Transaction MAC file support, and backward compatibility with MIFARE DESFire EV1 and D40 systems.
Technical Context
The MF3D4200DA4/00J implements a dedicated ISO/IEC 14443-4 RF interface with configurable FSCI supporting up to 128-byte frame size (for 2/4/8 kB variants), operates at 13.56 MHz, and integrates hardware-accelerated AES-128 and 3DES cryptographic engines with key versioning. Its on-chip memory management unit (MMU) enforces strict application isolation and supports up to 32 files per application across six file types-including Transaction MAC-each with independent access rights.
Security architecture includes mutual three-pass authentication, hardware exception sensors (glitch, voltage, temperature), Proximity Check against relay attacks, and Originality Check for NXP product verification. The device uses a fixed 7-byte UID and optionally supports Random ID generation during RF reset for enhanced privacy.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory capacity | 4 KB EEPROM with 25-year data retention and 500,000 write endurance cycles |
| RF interface | ISO/IEC 14443A Type A compliant; supports 106–848 kbit/s data rates |
| Input capacitance | 17 pF - optimized for standard antenna geometries and 100 mm operating distance |
| Cryptographic engines | Hardware AES-128 and 3DES (56/112/168-bit keys) with key versioning and CMAC integrity |
| Security certification | Common Criteria EAL5+ for both hardware and software - same level as banking cards and e-passports |
| File system | Up to 32 files per application; six file types including Transaction MAC and automatic anti-tear protection |
| Authentication | Mutual three-pass authentication with optional Random ID and Proximity Check for relay attack mitigation |
Pinout & Package
MF3D4200DA4/00J is packaged in MOA4 - a plastic leadless module carrier package conforming to SOT500-2 outline. This surface-mountable IC has no external pins; it interfaces exclusively via its integrated antenna coil connection points (RF_IN/RF_OUT) and ground reference, designed for embedding into smart card laminates or contactless modules.
Key Features
| Feature | Design Value |
|---|---|
| Transaction MAC file | Enables cryptographically signed transaction logs stored on-card for backend auditability and fraud detection |
| MIsmartApp delegation | Allows third-party application creation and management without exposing PICC master keys |
| Virtual Card Architecture | Supports privacy-preserving card/application selection on multi-VC devices using masked identifiers |
| Multiple Key Sets | Up to 16 key sets per application with fast rolling mechanism for seamless key migration and lifecycle management |
| Shared application access | Permits simultaneous file access from two applications within one transaction - critical for integrated transit + loyalty workflows |
Applications
| Public Transport Ticketing | Secure Campus Access |
|---|---|
Use Scenario: Contactless fare validation at bus/tram gates and metro turnstiles with offline balance updates. IC Role / Device Role / Timing Role: Secure storage of encrypted trip history, balance, and session keys; performs mutual authentication with reader in <100 ms. Use Value: Enables offline transaction processing with guaranteed data integrity via Transaction MAC and anti-tear backup - no network dependency during peak boarding. | Use Scenario: Multi-factor physical access control for university buildings, integrating student ID, library privileges, and lab equipment authorization. IC Role / Device Role / Timing Role: Hosts isolated applications with distinct key sets; validates credentials using AES-128 mutual authentication and Proximity Check. Use Value: Prevents relay attacks at door readers and allows granular permission delegation across departments without shared master keys. |
| Micro-Payment & Loyalty | Smart City Mobility Hub |
Use Scenario: Tap-to-pay vending machines, parking meters, and café POS terminals with closed-loop e-wallet functionality. IC Role / Device Role / Timing Role: Stores encrypted value files with backup; executes authenticated value decrement and Transaction MAC generation per transaction. Use Value: Ensures tamper-proof monetary state persistence across power loss or signal interruption - validated by on-card CMAC and rollback-safe file updates. | Use Scenario: Unified citizen card combining bike-sharing rental, museum entry, municipal service access, and local merchant discounts. IC Role / Device Role / Timing Role: Manages up to 32 files across multiple applications using Virtual Card Architecture for privacy-aware selection. Use Value: Eliminates need for separate credentials while preserving user anonymity between services via randomized application identifiers and segregated key domains. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar contactless multi-application IC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MF3D4201DUD/01 | Same 4 KB EEPROM and 17 pF capacitance, but supplied on 8-inch FFC wafer (not module carrier) | Requires full IC assembly and antenna integration; not pre-packaged for direct lamination | Select when building custom smart card substrates with internal antenna design control |
| MF3DH4200DA4/01 | Identical 4 KB EEPROM and MOA4/SOT500-2 package, but 70 pF input capacitance for small-form-factor antennas | Better suited for compact wearable or sticker form factors where antenna area is constrained | Select when antenna geometry limits coupling efficiency and higher input capacitance improves read range stability |
Compared with MF3D4200DA4/00J, MF3D4201DUD/01 requires full backend packaging infrastructure, while MF3DH4200DA4/01 trades standard antenna compatibility for miniaturization - making MF3D4200DA4/00J optimal for mainstream smart card and module-based deployments demanding proven interoperability and ease of integration.
Availability
MF3D4200DA4/00J is available at Aetrix Electronics and suitable for secure public transport ticketing, multi-application smart city cards, and micro-payment systems requiring stable component supply, long-term lifecycle assurance, and certified cryptographic compliance.
Supply support for MF3D4200DA4/00J includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and identification markets, with leadership in contactless IC technology since the introduction of MIFARE.
The MF3D4200DA4/00J belongs to the MIFARE DESFire EV2 product line - engineered specifically for high-assurance, multi-service contactless credential systems requiring EAL5+ certification, flexible file architecture, and future-proof cryptographic agility.
FAQ
What security certifications does the MF3D4200DA4/00J hold?
The MF3D4200DA4/00J is certified to Common Criteria EAL5+ for both hardware and software - the highest publicly available assurance level for smart card ICs, matching requirements for banking cards and electronic passports. This certification covers its cryptographic engines, memory protection mechanisms, and anti-tampering sensors, all verified under formal evaluation. MF3D4200DA4/00J maintains this certification across its entire production lot without deviation.
Does MF3D4200DA4/00J support ISO/IEC 7816-4 commands?
Yes, MF3D4200DA4/00J fully supports ISO/IEC 7816-4 APDU structure and file system commands including SELECT FILE (INS A4), READ BINARY (B0), UPDATE BINARY (D6), READ RECORDS (B2), APPEND RECORD (E2), GET CHALLENGE (84), INTERNAL AUTHENTICATE (88), and EXTERNAL AUTHENTICATE (82). These operate alongside native MIFARE DESFire commands and enable interoperability with existing PKI and EMV-compliant infrastructure.
How many applications and files can MF3D4200DA4/00J support?
MF3D4200DA4/00J supports an unlimited number of applications limited only by available 4 KB EEPROM space, with up to 32 files per application. Six file types are supported: Standard Data, Backup Data, Value, Linear Record, Cyclic Record, and Transaction MAC. File sizes are defined at creation time (except Transaction MAC), and each application enforces strict access control via dedicated key sets.
Is MF3D4200DA4/00J backward compatible with older MIFARE DESFire generations?
Yes, MF3D4200DA4/00J operates in default delivery configuration as a MIFARE DESFire EV1 device, ensuring functional backward compatibility with MF3ICD40 and MIFARE DESFire EV1 readers and infrastructure. All EV2-specific features - such as Transaction MAC, MIsmartApp, and Proximity Check - require explicit activation via new commands and do not interfere with legacy system operation.
What is the difference between MF3D4200DA4/00J and MF3DH4200DA4/01?
The MF3D4200DA4/00J and MF3DH4200DA4/01 share identical 4 KB EEPROM capacity and MOA4/SOT500-2 packaging, but differ in input capacitance: MF3D4200DA4/00J specifies 17 pF for standard antenna designs, while MF3DH4200DA4/01 specifies 70 pF optimized for compact or low-inductance antennas. This makes MF3D4200DA4/00J ideal for conventional smart cards, whereas MF3DH4200DA4/01 targets wearables and stickers.
MF3D4200DA4/00J Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- MOA4, Smart Card Module
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Type:
- RFID Reader
- Frequency:
- 13.56MHz
- Standards:
- ISO 14443
- Interface:
- -
- Voltage - Supply:
- -
- Operating Temperature:
- -25°C ~ 70°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PLLMC
MF3D4200DA4/00J FAQ
1.How can I place an order for MF3D4200DA4/00J through Aetrix?
Please submit a Request for Quotation (RFQ) for MF3D4200DA4/00J on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MF3D4200DA4/00J reliable?
The price and inventory of MF3D4200DA4/00J are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MF3D4200DA4/00J is usually 5 days.
3.What payment methods are accepted for MF3D4200DA4/00J?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MF3D4200DA4/00J transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MF3D4200DA4/00J?
MF3D4200DA4/00J orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MF3D4200DA4/00J order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MF3D4200DA4/00J?
For technical support, including MF3D4200DA4/00J datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MF3D4200DA4/00J requirements.
6.How does Aetrix verify that MF3D4200DA4/00J is sourced from the original manufacturer or authorized distributors?
All MF3D4200DA4/00J products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MF3D4200DA4/00J meets industry standards.
7.What is the process for return or replacement of MF3D4200DA4/00J?
All MF3D4200DA4/00J units undergo pre-shipment inspection (PSI). If there is an issue with MF3D4200DA4/00J, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MF3D4200DA4/00J part is unused and in its original packaging.
Return procedure for MF3D4200DA4/00J:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MF3D4200DA4/00J Tags
-
SL2S2602FTBX
NXP Semiconductors
-
ST25DV04K-IER6S3
STMicroelectronics
-
ST25DV04K-IER6C3
STMicroelectronics
-
LXMSJZNCMD-217
Murata Electronics
-
NT3H2111W0FTTJ
NXP Semiconductors
-
NT3H2111W0FHKH
NXP Semiconductors
-
M24LR04E-RMC6T/2
STMicroelectronics
-
ST25DV04KC-JF6D3
STMicroelectronics
-
ST25DV64KC-IE6S3
STMicroelectronics
-
ST25DV64K-IER6T3
STMicroelectronics
-
NT3H2211W0FTTJ
NXP Semiconductors
-
NT3H2211W0FHKH
NXP Semiconductors
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
