Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

NXP Semiconductors MF3D4300DA4/00J

Part No.:
MF3D4300DA4/00J
Manufacturer:
NXP Semiconductors
Category:
RFID, RF Access, Monitoring ICs
Package:
MOA4, Smart Card Module
Datasheet:
AetrixMF3D4300DA4/00J.pdf
Description:
MF3D4300DA4
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,492

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

MF3D4300DA4/00 from NXP Semiconductors is a MIFARE DESFire EV3 contactless multi-application IC with 4 kB non-volatile memory, 17 pF input capacitance, Common Criteria EAL5+ hardware and software security certification, ISO/IEC 14443A compliance, and support for AES-128 and 3DES cryptographic engines. It enables secure public transport ticketing, micro-payment, and smart city mobility cards.

For engineers reviewing the MF3D4300DA4/00 datasheet, MF3D4300DA4/00 pinout, MF3D4300DA4/00 application, or MF3D4300DA4/00 equivalent, key selection considerations include memory size (4 kB), input capacitance (17 pF), backward compatibility with DESFire EV2/EV1/D40, Transaction MAC file support, and Secure Dynamic Messaging capability for NFC Forum Type 4 Tag compliance.

Technical Context

The MF3D4300DA4/00 implements a dual-layer security architecture: mutual three-pass authentication at PICC level and per-application authentication using configurable key sets (up to 14 keys/application, up to 16 key sets/application). Its on-chip backup management system enforces transaction-oriented data integrity across all file types via automatic anti-tear protection and a dedicated Transaction Timer to prevent Man-in-the-Middle attacks during power persistence.

It supports ISO/IEC 14443-4 transmission protocol with configurable FSCI up to 256 bytes, operates at 13.56 MHz, and delivers RF data rates of 106–848 kbit/s. The device integrates hardware AES-128, 3-key TDEA, CRC-16/32, CMAC, TRNG, and voltage/light/glitch/rail sensors for side-channel attack resistance.

Key Specifications

Parameter Value and Actual Design Meaning
Memory capacity 4 kB NV memory - sufficient for ≥10 applications with 32 files each, supporting complex multi-service deployments like integrated transit + e-payment + access control.
Input capacitance 17 pF - optimized for standard antenna designs in ISO/IEC 14443A-compliant cards; lower than 70 pF variant for wider interoperability.
Security certification Common Criteria EAL5+ (HW & SW) - meets banking-grade assurance requirements for electronic passports and financial cards.
Cryptographic engines Hardware AES-128 and 3-key TDEA - enables high-speed, low-power authenticated encryption for secure messaging and transaction signing.
Data retention 25 years - ensures long-term reliability in infrastructure deployments such as student ID or road tolling systems.
Write endurance 1,000,000 cycles - supports frequent balance updates in micro-payment or loyalty applications without memory wear-out.
RF data rate Up to 848 kbit/s - reduces transaction time in high-throughput environments like automated fare collection gates.
File types 6 types including Transaction MAC file - enables backend-verified transaction logging with secret-key-signed MACs per application.

Pinout & Package

MF3D4300DA4/00 is packaged in MOA4 - a plastic leadless module carrier package (SOT500-2) designed for embedding into contactless smart cards or inlays. This is a monolithic IC die with no external pins; electrical interface is exclusively via RF coupling through an integrated antenna coil.

Key Features

Feature Design Value
Transaction MAC file Generates application-level message authentication codes signed with secret keys - provides cryptographically verifiable proof of transaction completion to backend systems.
Virtual Card Architecture Enables privacy-preserving card/application selection on multi-VC devices - prevents unauthorized tracking during proximity-based service discovery.
Proximity Check Detects relay attacks by measuring RF field strength decay - blocks man-in-the-middle exploitation in access control or payment scenarios.
Originality Check Verifies genuine NXP silicon at runtime - prevents counterfeit ICs from compromising system security in critical infrastructure.
MIsmartApp delegation Allows third-party application creation and management under controlled permissions - supports scalable SaaS-based smart city service models.
Secure Dynamic Messaging (SDM) Mirrors encrypted dynamic data as plain-text NDEF - enables NFC-enabled smartphones to read context-aware service information without proprietary readers.

Applications

Secure Public Transport Ticketing Multi-Application Smart City Card

Use Scenario: Tap-and-go fare validation across buses, trams, and metro lines with real-time balance deduction and trip history storage.

IC Role / Device Role / Timing Role: Contactless secure transaction processor handling AES-encrypted balance updates, session key negotiation, and Transaction MAC generation per ride.

Use Value: Enables offline transaction processing with guaranteed data consistency via anti-tear mechanism and backend-verifiable MACs - eliminating network dependency at point-of-use.

Use Scenario: Single credential for public transport, bike sharing, municipal building access, and local e-payment at vendors.

IC Role / Device Role / Timing Role: Multi-application secure element managing isolated application folders, shared files between transport and payment apps, and Virtual Card Architecture for privacy-aware service selection.

Use Value: Reduces credential fragmentation while maintaining strict inter-application isolation - allows independent lifecycle management of each service without cross-app privilege escalation.

Micro-Payment & Loyalty Student ID & Campus Access

Use Scenario: Small-value contactless payments at cafeterias, vending machines, and retail kiosks with instant balance update and merchant-specific loyalty points accrual.

IC Role / Device Role / Timing Role: Secure value file handler with built-in backup and atomic update logic; supports multiple key sets for merchant-specific encryption domains.

Use Value: Ensures zero-loss transaction integrity even during unexpected RF field loss - prevents double-spending or partial balance corruption during high-speed tap interactions.

Use Scenario: Integrated campus ID enabling dormitory access, library book checkout, meal plan deduction, and exam registration verification.

IC Role / Device Role / Timing Role: Trusted identity anchor storing biometric templates (in encrypted files), academic credentials, and access rights with Proximity Check against relay attacks at door readers.

Use Value: Eliminates need for separate physical keys or swipe cards - leverages Originality Check to prevent cloning of student IDs used for high-security facilities.

Equivalent & Alternatives

The following parts are listed as comparable options for similar contactless multi-application IC applications.

Alternative Part Technical Difference Application Difference Selection Advice
MF3D4300DA8/00 Same 4 kB memory and 17 pF capacitance, but in MOA8 package (SOT500-4) - larger footprint, higher thermal mass, different mechanical mounting. Preferred for thicker card constructions or inlays requiring greater mechanical robustness; less suitable for ultra-thin wearable formats. Select MF3D4300DA8/00 only when board-level integration or custom antenna layout requires the MOA8 form factor.
MF3DH4300DA4/00 Identical MOA4 package and 4 kB memory, but 70 pF input capacitance - optimized for small-form-factor antennas with reduced coil area. Better suited for compact devices like wearables, key fobs, or embedded modules where antenna size is constrained. Choose MF3DH4300DA4/00 when antenna geometry limits inductance and requires higher capacitance tuning for reliable 13.56 MHz resonance.

Compared with MF3D4300DA4/00, MF3D4300DA8/00 offers mechanical stability at the cost of increased PCB footprint, while MF3DH4300DA4/00 trades standard antenna compatibility for miniaturization - both retain identical security, memory, and command-set functionality.

Availability

MF3D4300DA4/00 is available at Aetrix Electronics and suitable for secure public transport ticketing, smart city mobility credentialing, and micro-payment systems requiring stable component supply, long-term lifecycle support, and certified cryptographic assurance.

Supply support for MF3D4300DA4/00 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and identification markets, with leadership in contactless IC technology since the introduction of MIFARE.

The MF3D4300DA4/00 belongs to the MIFARE DESFire EV3 product line, engineered specifically for high-assurance, multi-service contactless smart cards deployed in transportation, government ID, and financial services infrastructure.

FAQ

What security certifications does the MF3D4300DA4/00 hold?

The MF3D4300DA4/00 holds Common Criteria EAL5+ certification for both hardware and software, validating its suitability for high-security applications such as banking cards and electronic passports. This certification covers the full stack - from RF interface and cryptographic accelerators to the operating system and file management layer - ensuring resistance against physical, side-channel, and logical attacks. The MF3D4300DA4/00 implements mutual three-pass authentication, Proximity Check, and Originality Check as part of this certified security envelope.

Does the MF3D4300DA4/00 support backward compatibility with older MIFARE DESFire systems?

Yes, the MF3D4300DA4/00 is functionally backward compatible with MIFARE DESFire EV2, EV1, and D40 (MF3ICD40) in its default delivery configuration. It supports legacy secure messaging modes (D40 Native, EV1, EV2) alongside its native EV3 commands. No infrastructure changes are required to deploy MF3D4300DA4/00 in existing EV2-based systems - all standard ISO/IEC 7816-4 APDU wrappers and file operations remain fully operational without firmware updates.

What is the difference between MF3D4300DA4/00 and MF3DH4300DA4/00?

The MF3D4300DA4/00 and MF3DH4300DA4/00 share identical memory (4 kB), cryptographic capabilities, and MOA4 package (SOT500-2), but differ in input capacitance: MF3D4300DA4/00 uses 17 pF, while MF3DH4300DA4/00 uses 70 pF. The higher capacitance enables reliable operation with smaller antenna geometries common in wearables or key fobs. Both parts are drop-in replacements in terms of software and security features - only antenna matching network design differs.

Can the MF3D4300DA4/00 be used in NFC Forum Type 4 Tag applications?

Yes, the MF3D4300DA4/00 is NFC Forum Type 4 Tag certified (Certificate ID 58652). It supports NDEF message mirroring via Secure Dynamic Messaging (SDM), allowing dynamic data - such as service URLs or transaction tokens - to be exposed as plain-text NDEF records readable by standard NFC smartphones. This enables smartphone-initiated interactions without proprietary reader infrastructure, extending MF3D4300DA4/00 use beyond traditional card readers into mobile-first service models.

How many applications and files can the MF3D4300DA4/00 support?

The MF3D4300DA4/00 supports an unlimited number of applications limited only by its 4 kB NV memory capacity, with up to 32 files per application. Six file types are available: Standard Data, Backup Data, Value, Linear Record, Cyclic Record, and Transaction MAC. File sizes are user-defined at creation (except Transaction MAC), enabling precise memory allocation. The MF3D4300DA4/00 also supports shared file access across two applications within a single transaction - essential for coordinated services like transit + parking.

MF3D4300DA4/00J Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
-
Package/Case:
MOA4, Smart Card Module
Packaging:
Tape & Reel (TR)
Product Status:
Active
Type:
RFID Reader
Frequency:
13.56MHz
Standards:
ISO 14443A
Interface:
-
Voltage - Supply:
-
Operating Temperature:
-25°C ~ 85°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
PLLMC

MF3D4300DA4/00J FAQ

1.How can I place an order for MF3D4300DA4/00J through Aetrix?

Please submit a Request for Quotation (RFQ) for MF3D4300DA4/00J on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MF3D4300DA4/00J reliable?

The price and inventory of MF3D4300DA4/00J are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MF3D4300DA4/00J is usually 5 days.

3.What payment methods are accepted for MF3D4300DA4/00J?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MF3D4300DA4/00J transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MF3D4300DA4/00J?

MF3D4300DA4/00J orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MF3D4300DA4/00J order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MF3D4300DA4/00J?

For technical support, including MF3D4300DA4/00J datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MF3D4300DA4/00J requirements.

6.How does Aetrix verify that MF3D4300DA4/00J is sourced from the original manufacturer or authorized distributors?

All MF3D4300DA4/00J products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MF3D4300DA4/00J meets industry standards.

7.What is the process for return or replacement of MF3D4300DA4/00J?

All MF3D4300DA4/00J units undergo pre-shipment inspection (PSI). If there is an issue with MF3D4300DA4/00J, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MF3D4300DA4/00J part is unused and in its original packaging.

Return procedure for MF3D4300DA4/00J:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

MF3D4300DA4/00J Tags

  • MF3D4300DA4/00J
  • MF3D4300DA4/00J PDF
  • MF3D4300DA4/00J Datasheet
  • MF3D4300DA4/00J Specifications
  • MF3D4300DA4/00J Images
  • NXP Semiconductors
  • NXP Semiconductors MF3D4300DA4/00J
  • Buy MF3D4300DA4/00J
  • MF3D4300DA4/00J Price
  • MF3D4300DA4/00J Distributor
  • MF3D4300DA4/00J Supplier
  • MF3D4300DA4/00J Wholesale
Related Products
SL2S2602FTBX
SL2S2602FTBX

NXP Semiconductors

ST25DV04K-IER6S3
ST25DV04K-IER6S3

STMicroelectronics

ST25DV04K-IER6C3
ST25DV04K-IER6C3

STMicroelectronics

LXMSJZNCMD-217
LXMSJZNCMD-217

Murata Electronics

NT3H2111W0FTTJ
NT3H2111W0FTTJ

NXP Semiconductors

NT3H2111W0FHKH
NT3H2111W0FHKH

NXP Semiconductors

M24LR04E-RMC6T/2
M24LR04E-RMC6T/2

STMicroelectronics

ST25DV04KC-JF6D3
ST25DV04KC-JF6D3

STMicroelectronics

ST25DV64KC-IE6S3
ST25DV64KC-IE6S3

STMicroelectronics

ST25DV64K-IER6T3
ST25DV64K-IER6T3

STMicroelectronics

NT3H2211W0FTTJ
NT3H2211W0FTTJ

NXP Semiconductors

NT3H2211W0FHKH
NT3H2211W0FHKH

NXP Semiconductors

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER