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NXP Semiconductors MF3D8200DA6/00J

Part No.:
MF3D8200DA6/00J
Manufacturer:
NXP Semiconductors
Category:
RFID, RF Access, Monitoring ICs
Package:
MOB6, Smart Card Module
Datasheet:
AetrixMF3D8200DA6/00J.pdf
Description:
IC RFID READER 13.56MHZ PLLMC
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,115

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Product details

Overview

MF3D8200DA6/00J from NXP Semiconductors is a contactless multi-application smart card IC compliant with ISO/IEC 14443A, featuring 8 KB EEPROM, 17 pF input capacitance, Common Criteria EAL5+ security certification, and support for AES-128 and 3DES cryptographic engines. It enables secure public transport ticketing, micro-payment, and access management in single-card deployments.

For engineers reviewing the MF3D8200DA6/00J datasheet, MF3D8200DA6/00J pinout, MF3D8200DA6/00J application, or MF3D8200DA6/00J equivalent, key selection considerations include its 8 KB NV memory capacity, 17 pF input capacitance (standard variant), EV2-specific Transaction MAC and MIsmartApp features, and backward compatibility with MIFARE DESFire EV1 and D40 systems.

Technical Context

The MF3D8200DA6/00J implements a fully ISO/IEC 14443-4-compliant RF interface supporting data rates up to 848 kbit/s and configurable frame size (FSCI) up to 128 bytes. Its on-chip CPU executes a secure operating system enabling dynamic application creation, mutual three-pass authentication, and transaction-oriented anti-tear backup across all file types.

It integrates hardware-accelerated cryptographic engines for DES (56/112/168-bit keys) and AES-128, supports six file types including Transaction MAC files, and provides optional Random ID generation and Proximity Check to mitigate relay attacks. The device operates without battery, powered solely by the reader's RF field at 13.56 MHz.

Key Specifications

ParameterValue and Actual Design Meaning
Memory capacity8 KB EEPROM - supports multiple applications and up to 32 files per application with flexible sizing at creation time.
Input capacitance17 pF - standard capacitance variant optimized for typical antenna designs and interoperability with legacy MIFARE readers.
Security certificationCommon Criteria EAL5+ (HW & SW) - validated assurance level matching banking cards and e-passports.
Cryptographic enginesHardware 3DES and AES-128 - enables fast, authenticated, and encrypted RF communication with CMAC integrity protection.
Data retention25 years - guaranteed non-volatile data storage under ambient conditions (22 °C).
Write endurance500,000 cycles - ensures long-term reliability in high-frequency transaction environments like transit fare collection.
RF interfaceISO/IEC 14443A Type A - full compliance with Parts 1–4, including APDU wrapper support and ISO/IEC 7816-4 command mapping.

Pinout & Package

MF3D8200DA6/00J is supplied in MOB6 plastic leadless module carrier package (SOT500-3), designed for embedding into smart cards or inlays. It has no external pins - electrical connection is made via two integrated antenna pads (RF_IN and RF_OUT) bonded to an external coil.

Pin/TerminalCircuit RoleDesign Meaning
RF_INAntenna input terminalReceives modulated 13.56 MHz carrier from external coil; internal rectifier derives power and demodulates commands.
RF_OUTAntenna output terminalDrives backscattered response signal to external coil; supports load modulation for data transmission to reader.

Key Features

FeatureDesign Value
Transaction MAC file typeGenerates cryptographically signed transaction logs on-card, enabling backend verification of authenticity and integrity without exposing keys.
MIsmartApp (Delegated Application Management)Allows third-party application providers to create, manage, and update applications independently under PICC owner delegation - enabling scalable service ecosystems.
Multiple Key Sets per applicationSupports up to 16 key sets with fast rolling mechanism - simplifies key lifecycle management and enables seamless migration during security upgrades.
Virtual Card ArchitectureEnables privacy-preserving card/application selection on multi-VC devices by masking real AIDs during discovery - critical for citizen services and loyalty programs.
Proximity CheckDetects relay attacks by measuring RF round-trip time - prevents unauthorized remote access to card functions in transit or access control scenarios.

Applications

Public Transport TicketingSecure Access Control

Use Scenario: Contactless tap-in/tap-out for buses, trams, and metro systems using a single reusable card.

IC Role / Device Role / Timing Role: Secure storage and execution of fare calculation logic, balance updates, and audit trails with tamper-resistant transaction logging.

Use Value: Enables offline validation, reduces backend dependency, and guarantees atomic balance updates via anti-tear mechanism - preventing fare loss during mid-transaction power loss.

Use Scenario: Multi-site physical access for corporate campuses, government facilities, or healthcare institutions.

IC Role / Device Role / Timing Role: Stores role-based credentials, biometric templates (via external host), and time-based access rules with cryptographic session binding.

Use Value: Supports hierarchical key management and delegated application control - allowing facility managers to issue/revoke access rights without PICC-level privileges.

Micro-Payment & LoyaltySmart City Mobility Card

Use Scenario: Closed-loop e-wallet for vending machines, parking meters, and retail kiosks with offline transaction capability.

IC Role / Device Role / Timing Role: Hosts value files with backup, performs cryptographic signing of transactions, and enforces spending limits per session.

Use Value: Provides EMV-like transaction integrity using on-card CMAC and AES encryption - eliminating need for online authorization in low-bandwidth environments.

Use Scenario: Unified citizen card integrating transport, bike/car sharing, museum entry, and municipal services.

IC Role / Device Role / Timing Role: Serves as secure container for independent, mutually isolated applications managed by different authorities (e.g., transit agency, city council, cultural institution).

Use Value: Leverages Virtual Card Architecture and Originality Check to prevent cloning and ensure service provider trust - enabling cross-domain interoperability without shared infrastructure.

Equivalent & Alternatives

The following parts are listed as comparable options for similar contactless multi-application IC applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MF3D8200DA4/01Same 8 KB EEPROM and 17 pF capacitance, but packaged in MOA4 (SOT500-2) instead of MOB6 (SOT500-3); smaller footprint and thinner profile.Preferred for thin smart cards or inlays where height clearance or PCB space is constrained.Select MF3D8200DA4/01 when mechanical integration requires SOT500-2 footprint; otherwise MF3D8200DA6/00J offers identical electrical and functional behavior.
MF3DH8200DA6/01Identical MOB6 package and 8 KB memory, but uses 70 pF input capacitance - optimized for small-form-factor antennas and compact reader coils.Suitable for wearable tokens, wristbands, or embedded modules where antenna size is limited and higher coupling efficiency is needed.Choose MF3DH8200DA6/01 only if antenna design requires higher input capacitance; MF3D8200DA6/00J remains optimal for standard ISO/IEC 14443A reader interoperability.

Compared with MF3D8200DA4/01, MF3D8200DA6/00J provides identical security, memory, and RF performance but in a larger SOT500-3 package better suited for robust card lamination processes; compared with MF3DH8200DA6/01, it delivers standard 17 pF capacitance essential for predictable tuning with conventional reader antennas.

Availability

MF3D8200DA6/00J is available at Aetrix Electronics and suitable for secure public transport ticketing, multi-application smart city cards, and micro-payment systems requiring stable component supply, long-term lifecycle support, and certified security compliance.

Supply support for MF3D8200DA6/00J includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and identification markets, with leadership in contactless IC technology since the introduction of MIFARE.

The MF3D8200DA6/00J belongs to the MIFARE DESFire EV2 product line, engineered specifically for high-assurance, multi-service contactless smart cards used in transportation, access control, and digital identity applications.

FAQ

What is the memory capacity and type used in MF3D8200DA6/00J?

The MF3D8200DA6/00J integrates 8 KB of EEPROM non-volatile memory, organized as a flexible file system supporting up to 32 files per application. This memory retains data for 25 years and withstands 500,000 write cycles - making it suitable for high-transaction environments such as transit fare collection and loyalty programs where durability and long-term reliability are critical. The MF3D8200DA6/00J uses this memory to store applications, keys, and transaction records securely.

Does MF3D8200DA6/00J support AES encryption and what security certifications does it hold?

Yes, MF3D8200DA6/00J includes a hardware-accelerated AES-128 cryptographic engine alongside 3DES support, enabling fast and secure RF communication with CMAC integrity protection. It is certified to Common Criteria EAL5+ for both hardware and software - the same assurance level required for banking cards and electronic passports. This certification validates its resistance to side-channel, fault injection, and logical attacks, confirming that MF3D8200DA6/00J meets stringent requirements for high-security deployments.

How does MF3D8200DA6/00J differ from earlier MIFARE DESFire generations like EV1 or D40?

The MF3D8200DA6/00J introduces several enhancements over MIFARE DESFire EV1 and D40, including unlimited application count (vs. 28 max), Transaction MAC file type, MIsmartApp for delegated management, Multiple Key Sets with rolling, and Proximity Check against relay attacks. It maintains full backward compatibility - operating as an EV1 in default mode - while enabling new business models through features like Virtual Card Architecture and enhanced ISO/IEC 7816-4 APDU support. These capabilities make MF3D8200DA6/00J uniquely suited for evolving smart city ecosystems.

What package type and dimensions does MF3D8200DA6/00J use, and how is it connected?

MF3D8200DA6/00J is housed in the MOB6 plastic leadless module carrier package (SOT500-3), measuring 4.0 mm × 4.0 mm × 0.5 mm. It has no wire-bonded pins - instead, it features two antenna terminals (RF_IN and RF_OUT) designed for flip-chip bonding to an external planar coil. This construction eliminates solder joints and improves mechanical robustness in laminated smart cards. The MF3D8200DA6/00J relies entirely on inductive coupling at 13.56 MHz for power and data transfer.

Is MF3D8200DA6/00J compatible with existing MIFARE DESFire EV1 infrastructure?

Yes, MF3D8200DA6/00J is functionally backward compatible with MIFARE DESFire EV1 and D40 systems. In its default delivery configuration, it behaves identically to an EV1 device - supporting the same command set, file structure, and cryptographic modes (2TDEA, 3TDEA). New EV2 features such as Transaction MAC or MIsmartApp require explicit activation via dedicated commands. This allows seamless infrastructure upgrades without replacing readers or reworking middleware - ensuring MF3D8200DA6/00J integrates directly into deployed EV1 environments.

MF3D8200DA6/00J Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
-
Package/Case:
MOB6, Smart Card Module
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Type:
RFID Reader
Frequency:
13.56MHz
Standards:
ISO 14443
Interface:
-
Voltage - Supply:
-
Operating Temperature:
-25°C ~ 70°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
PLLMC

MF3D8200DA6/00J FAQ

1.How can I place an order for MF3D8200DA6/00J through Aetrix?

Please submit a Request for Quotation (RFQ) for MF3D8200DA6/00J on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MF3D8200DA6/00J reliable?

The price and inventory of MF3D8200DA6/00J are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MF3D8200DA6/00J is usually 5 days.

3.What payment methods are accepted for MF3D8200DA6/00J?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MF3D8200DA6/00J transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MF3D8200DA6/00J?

MF3D8200DA6/00J orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MF3D8200DA6/00J order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MF3D8200DA6/00J?

For technical support, including MF3D8200DA6/00J datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MF3D8200DA6/00J requirements.

6.How does Aetrix verify that MF3D8200DA6/00J is sourced from the original manufacturer or authorized distributors?

All MF3D8200DA6/00J products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MF3D8200DA6/00J meets industry standards.

7.What is the process for return or replacement of MF3D8200DA6/00J?

All MF3D8200DA6/00J units undergo pre-shipment inspection (PSI). If there is an issue with MF3D8200DA6/00J, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MF3D8200DA6/00J part is unused and in its original packaging.

Return procedure for MF3D8200DA6/00J:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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