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NXP Semiconductors MF3D8201DUD/00V

Part No.:
MF3D8201DUD/00V
Manufacturer:
NXP Semiconductors
Category:
RFID, RF Access, Monitoring ICs
Package:
Die
Datasheet:
AetrixMF3D8201DUD/00V.pdf
Description:
IC RFID READER 13.56MHZ DIE
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,897

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Product details

Overview

MF3D8201DUD/00V from NXP Semiconductors is a contactless multi-application IC compliant with ISO/IEC 14443A, featuring 8 KB EEPROM, 17 pF input capacitance, Common Criteria EAL5+ security certification, and support for AES-128 and 3DES cryptographic engines. It enables secure public transport ticketing, micro-payment, and access management in smart city infrastructure.

For engineers reviewing the MF3D8201DUD/00V datasheet, MF3D8201DUD/00V pinout, MF3D8201DUD/00V application, or MF3D8201DUD/00V equivalent, key selection considerations include its 8 KB NV memory capacity, EAL5+ hardware/software security certification, Transaction MAC file support, MIsmartApp delegated application management, and backward compatibility with MIFARE DESFire EV1 and D40 systems.

Technical Context

The MF3D8201DUD/00V implements a dedicated ISO/IEC 14443-4 RF interface supporting data rates up to 848 kbit/s and configurable frame size (FSCI) up to 128 bytes. Its on-chip cryptographic engine supports AES-128, 3TDEA, and single DES with hardware-accelerated CMAC generation and mutual three-pass authentication.

Memory organization uses a flexible file system with no hard limit on application count, up to 32 files per application across six file types-including Standard Data, Value, Linear/Cyclic Record, Backup Data, and Transaction MAC files-each sized at creation time and protected by transaction-oriented anti-tear mechanisms.

Key Specifications

ParameterValue and Actual Design Meaning
Memory capacity8 KB EEPROM with 25-year data retention and 500,000 write endurance cycles
RF interfaceISO/IEC 14443A compliant; supports 106–848 kbit/s data transfer rates
Security certificationCommon Criteria EAL5+ for both hardware and software components
Cryptographic enginesHardware-accelerated AES-128 and 3TDEA with key versioning and 8-byte CMAC
Input capacitance17 pF - optimized for standard antenna designs without high-capacitance compensation
UID length7-byte fixed serial number with optional Random ID mode for privacy protection
File systemUp to 32 files per application across 6 file types including Transaction MAC and Virtual Card Architecture support

Pinout & Package

MF3D8201DUD/00V is supplied in FFC (Film Frame Carrier) wafer format - 8-inch diameter, sawn die, 120 μm thickness - intended for embedding into contactless smart cards or inlays. No discrete pinout applies; the device interfaces exclusively via its integrated RF coil coupling to external reader antennas.

Key Features

FeatureDesign Value
MIsmartApp delegationEnables third-party application creation and management without PICC master key exposure
Transaction MAC fileGenerates cryptographically signed transaction proofs on-card for backend verification
Multiple Key SetsSupports up to 16 key sets per application with fast rolling and migration for lifecycle key management
Proximity CheckDetects relay attacks by measuring RF signal propagation delay during authentication
Originality CheckVerifies genuine NXP silicon via hardware-based challenge-response protocol
Virtual Card ArchitectureEnables privacy-preserving card/application selection using dynamic virtual identifiers

Applications

Secure Public Transport TicketingMulti-Application Smart City Card

Use Scenario: Contactless fare payment across buses, trams, and metro systems with offline balance updates and session-based validation.

IC Role / Device Role / Timing Role: Secure storage and cryptographic processing of transit credentials, balances, and audit logs within a tamper-resistant environment.

Use Value: Enables seamless cross-operator travel with encrypted value storage, transaction MAC integrity, and EAL5+-validated security against cloning and replay attacks.

Use Scenario: Single credential used for parking, bike sharing, museum access, and municipal loyalty programs across city-wide NFC readers.

IC Role / Device Role / Timing Role: Multi-application container hosting isolated, permissioned services with independent key sets and file structures per use case.

Use Value: Eliminates need for multiple physical cards by supporting concurrent applications with segregated security domains and delegated management via MIsmartApp.

Secure Access ManagementMicro-Payment & Loyalty

Use Scenario: Physical access control for corporate campuses or government facilities requiring strong two-factor authentication and audit trail logging.

IC Role / Device Role / Timing Role: Stores biometric templates or encrypted access keys, performs mutual authentication with readers, and logs entry events with CMAC-secured timestamps.

Use Value: Provides EAL5+ certified assurance against physical tampering and logical attacks while enabling centralized policy enforcement across distributed door controllers.

Use Scenario: Closed-loop e-wallet for cafeterias, vending machines, or retail kiosks with offline transaction capability and real-time backend reconciliation.

IC Role / Device Role / Timing Role: Holds encrypted purse value, executes AES-secured transactions, and generates Transaction MAC for backend fraud detection and dispute resolution.

Use Value: Delivers banking-grade security for low-value payments without network dependency, leveraging hardware AES and anti-tear file integrity guarantees.

Equivalent & Alternatives

The following parts are listed as comparable options for similar contactless multi-application IC applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MF3D4201DUD/014 KB EEPROM, same 17 pF input capacitance, identical FFC package and RF interfaceLower memory capacity limits number of concurrent applications and file depthSelect when application footprint and cost sensitivity outweigh need for extended storage headroom
MF3DH8201DUD/018 KB EEPROM with 70 pF input capacitance - optimized for compact antenna geometriesRequires antenna redesign for optimal coupling; not interchangeable without RF validationChoose for space-constrained inlays or thin-form-factor cards where higher input capacitance improves read range stability

Compared with MF3D4201DUD/01, MF3D8201DUD/00V provides double NV memory for deeper application nesting and larger transaction logs; compared with MF3DH8201DUD/01, it avoids high-capacitance antenna tuning requirements while retaining full feature parity and security certification.

Availability

MF3D8201DUD/00V is available at Aetrix Electronics and suitable for secure public transport ticketing, smart city credentialing, and micro-payment systems requiring stable component supply, long-term lifecycle support, and certified cryptographic assurance.

Supply support for MF3D8201DUD/00V includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and identification markets.

The MF3D8201DUD/00V belongs to the MIFARE DESFire EV2 product line - designed specifically for high-assurance, multi-application contactless smart card systems requiring Common Criteria EAL5+ certification, flexible file architecture, and future-proof cryptographic agility.

FAQ

What security certifications does MF3D8201DUD/00V hold?

MF3D8201DUD/00V holds Common Criteria EAL5+ certification for both hardware and software components - the same assurance level required for banking cards and electronic passports. This covers its cryptographic engines (AES-128, 3TDEA), memory protection, anti-tear mechanisms, and secure messaging protocols. The certification validates resistance to side-channel, fault injection, and logical attacks under defined threat models.

Does MF3D8201DUD/00V support ISO/IEC 7816-4 commands?

Yes, MF3D8201DUD/00V fully supports ISO/IEC 7816-4 APDU structure and file system commands including SELECT FILE (INS A4), READ BINARY (B0), UPDATE BINARY (D6), READ RECORDS (B2), APPEND RECORD (E2), GET CHALLENGE (84), INTERNAL AUTHENTICATE (88), and EXTERNAL AUTHENTICATE (82). These operate alongside native MIFARE DESFire commands and enable interoperability with legacy smart card infrastructure.

How many applications and files can MF3D8201DUD/00V support?

MF3D8201DUD/00V supports an unlimited number of applications limited only by available 8 KB EEPROM space. Each application can contain up to 32 files across six types: Standard Data, Backup Data, Value, Linear Record, Cyclic Record, and Transaction MAC. File sizes are user-defined at creation time, and automatic anti-tear ensures atomic updates across related records.

Is MF3D8201DUD/00V backward compatible with older MIFARE DESFire generations?

Yes, MF3D8201DUD/00V operates in default delivery configuration as a MIFARE DESFire EV1 device, ensuring functional backward compatibility with MF3ICD40 and MIFARE DESFire EV1 systems. All EV2-specific features - such as Transaction MAC, MIsmartApp, and Proximity Check - require explicit activation via new commands and do not interfere with legacy deployments.

What distinguishes MF3D8201DUD/00V from MF3DH8201DUD/01?

MF3D8201DUD/00V has 17 pF input capacitance and targets standard antenna designs, while MF3DH8201DUD/01 uses 70 pF input capacitance for compact or low-profile inlays. Both share identical 8 KB EEPROM, EAL5+ certification, and feature set. They are not pin-compatible substitutes - antenna matching and RF performance validation are required when switching between them.

MF3D8201DUD/00V Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
-
Package/Case:
Die
Packaging:
Bulk
Product Status:
Obsolete
Type:
RFID Reader
Frequency:
13.56MHz
Standards:
ISO 14443
Interface:
-
Voltage - Supply:
-
Operating Temperature:
-25°C ~ 70°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
Die

MF3D8201DUD/00V FAQ

1.How can I place an order for MF3D8201DUD/00V through Aetrix?

Please submit a Request for Quotation (RFQ) for MF3D8201DUD/00V on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MF3D8201DUD/00V reliable?

The price and inventory of MF3D8201DUD/00V are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MF3D8201DUD/00V is usually 5 days.

3.What payment methods are accepted for MF3D8201DUD/00V?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MF3D8201DUD/00V transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MF3D8201DUD/00V?

MF3D8201DUD/00V orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MF3D8201DUD/00V order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MF3D8201DUD/00V?

For technical support, including MF3D8201DUD/00V datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MF3D8201DUD/00V requirements.

6.How does Aetrix verify that MF3D8201DUD/00V is sourced from the original manufacturer or authorized distributors?

All MF3D8201DUD/00V products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MF3D8201DUD/00V meets industry standards.

7.What is the process for return or replacement of MF3D8201DUD/00V?

All MF3D8201DUD/00V units undergo pre-shipment inspection (PSI). If there is an issue with MF3D8201DUD/00V, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MF3D8201DUD/00V part is unused and in its original packaging.

Return procedure for MF3D8201DUD/00V:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

MF3D8201DUD/00V Tags

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