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NXP Semiconductors MF3D8300DA8/00J

Part No.:
MF3D8300DA8/00J
Manufacturer:
NXP Semiconductors
Category:
RFID, RF Access, Monitoring ICs
Package:
MOA8, Smart Card Module
Datasheet:
AetrixMF3D8300DA8/00J.pdf
Description:
MF3D8300DA8
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,002

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Product details

Overview

MF3D8300DA8/00 from NXP Semiconductors is a MIFARE DESFire EV3 contactless multi-application IC with 8 kB non-volatile memory, 17 pF input capacitance, Common Criteria EAL5+ hardware and software certification, ISO/IEC 14443A compliance, and support for AES-128 and 3DES cryptographic engines. It enables secure public transport ticketing, micro-payment, and multi-service smart city cards.

For engineers reviewing the MF3D8300DA8/00 datasheet, MF3D8300DA8/00 pinout, MF3D8300DA8/00 application, or MF3D8300DA8/00 equivalent, key selection considerations include memory size (8 kB), input capacitance (17 pF), backward compatibility with DESFire EV2/EV1/D40, Transaction MAC file support, and Virtual Card Architecture for privacy-preserving card selection.

Technical Context

The MF3D8300DA8/00 implements a dedicated 32-bit CPU with ROM-based firmware, hardware AES-128 and triple-DES cryptographic accelerators, and on-chip TRNG. Its memory management unit (MMU) enforces strict isolation between applications, each supporting up to 32 files across six types-including Transaction MAC and cyclic record files-with per-application key sets and access rights.

It operates at 13.56 MHz with ISO/IEC 14443-4 protocol support, configurable frame size (up to 256 bytes), and optional Random ID generation. Security features include mutual three-pass authentication, Proximity Check against relay attacks, Originality Check for genuine NXP validation, and automatic anti-tear with Transaction Timer to prevent man-in-the-middle transaction delay.

Key Specifications

Parameter Value and Actual Design Meaning
Memory capacity 8 kB NV memory - supports multiple large-scale applications (e.g., transport + e-payment + access) without external storage.
Input capacitance 17 pF - optimized for standard antenna designs in ISO/IEC 14443A proximity cards and modules.
Cryptographic engines AES-128 and 3DES hardware acceleration - enables fast, low-power secure transactions compliant with banking-grade requirements.
Security certification Common Criteria EAL5+ (HW & SW) - validated assurance level matching electronic passports and EMV banking cards.
Data retention 25 years - ensures long-term reliability for infrastructure deployments like transit fare systems.
Write endurance 1,000,000 cycles - supports high-frequency usage in daily commuter tickets and loyalty programs.
RF data rates 106–848 kbit/s - enables rapid transaction completion (<100 ms typical) even with large file reads/writes.

Pinout & Package

MF3D8300DA8/00 is supplied in MOA8 plastic leadless module carrier package (SOT500-4), designed for embedding into contactless smart cards, wearables, and secure tokens. It interfaces exclusively via RF coil coupling-no physical pins or solderable terminals are present. The device has no electrical I/O pads; all communication and power are delivered wirelessly through the integrated antenna interface per ISO/IEC 14443A.

Key Features

Feature Design Value
Transaction MAC file type Generates cryptographically signed MAC per transaction - provides verifiable proof of backend system integrity and prevents replay attacks.
Virtual Card Architecture (VCA) Enables privacy-preserving card selection across multiple logical cards on one physical device - essential for citizen ID + transport + payment convergence.
Mutual three-pass authentication Establishes session keys before any data exchange - prevents eavesdropping and ensures both reader and card authenticate each other.
Delegated Application Management (MIsmartApp) Allows third-party service providers to independently manage their applications - supports scalable business models in open ecosystem deployments.
Proximity Check + Originality Check Detects relay attacks and counterfeit ICs in real time - eliminates cloning risks and ensures only genuine NXP devices operate in certified infrastructure.

Applications

Secure Public Transport Ticketing Multi-Service Smart City Card

Use Scenario: Daily commuter tap-in/tap-out across buses, trams, and metro lines with fare capping and zone-based pricing.

IC Role / Device Role / Timing Role: Contactless secure transaction processor handling encrypted balance updates, audit logging, and multi-application switching within <100 ms.

Use Value: Enables offline balance validation and seamless cross-operator interoperability using standardized DESFire EV3 command set and AES-128 keys.

Use Scenario: Single physical card used for parking payment, bike sharing unlock, museum entry, and municipal e-ID verification.

IC Role / Device Role / Timing Role: Multi-application runtime environment with isolated AID-based file systems and shared access rights across services.

Use Value: Eliminates need for separate cards via VCA and MIsmartApp - reduces user friction while maintaining strict security boundaries per service domain.

Secure Access Management Micro-Payment & Loyalty Programs

Use Scenario: Physical access control for office buildings, data centers, and restricted zones using dynamic credential provisioning.

IC Role / Device Role / Timing Role: Secure credential store with time-bound keys, proximity check enforcement, and tamper-resistant key storage.

Use Value: Prevents relay and cloning attacks via Originality Check and Proximity Check - meets ISO/IEC 27001-aligned physical security requirements.

Use Scenario: Tap-to-pay at vending machines, cafés, and retail kiosks with offline transaction authorization and loyalty point accrual.

IC Role / Device Role / Timing Role: Offline-capable value file manager with transaction timer, anti-tear backup, and CMAC-secured balance updates.

Use Value: Supports fully offline micro-transactions with guaranteed atomicity - no network dependency required for sub-$10 payments.

Equivalent & Alternatives

The following parts are listed as comparable options for similar contactless multi-application IC applications.

Alternative Part Technical Difference Application Difference Selection Advice
MF3D8300DA4/00 Same 8 kB memory and 17 pF capacitance, but MOA4 package (SOT500-2) - smaller footprint, lower profile than MOA8. Preferred for thin-form factor cards where vertical height is constrained; less suitable for modules requiring higher mechanical robustness. Select MF3D8300DA4/00 when board space or card thickness is critical; MF3D8300DA8/00 offers better thermal and mechanical stability in embedded modules.
MF3DH8300DA8/00 Same MOA8 package and 8 kB memory, but 70 pF input capacitance - optimized for small antennas and compact wearable designs. Required for miniaturized form factors (e.g., wristbands, key fobs) where standard 17 pF limits antenna efficiency. Choose MF3DH8300DA8/00 only when antenna size reduction mandates higher capacitance; otherwise MF3D8300DA8/00 ensures broader interoperability with legacy readers.

Compared with MF3D8300DA4/00 and MF3DH8300DA8/00, the MF3D8300DA8/00 delivers optimal balance of mechanical robustness, antenna design flexibility, and field-proven interoperability - making it the default choice for industrial-grade smart card and secure token manufacturing.

Availability

MF3D8300DA8/00 is available at Aetrix Electronics and suitable for secure public transport ticketing, multi-service smart city cards, and micro-payment systems requiring stable component supply, long lifecycle support, and CC EAL5+-certified security assurance.

Supply support for MF3D8300DA8/00 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and identification markets.

The MF3D8300DA8/00 belongs to the MIFARE DESFire EV3 product line, engineered specifically for high-assurance, multi-application contactless smart cards deployed in transit, government ID, and financial services ecosystems.

FAQ

What is the memory capacity and organization of the MF3D8300DA8/00?

The MF3D8300DA8/00 integrates 8 kB of non-volatile memory organized as a flexible, application-isolated file system. Each application supports up to 32 files across six types-including Standard Data, Value, Cyclic Record, and Transaction MAC files-with file sizes defined at creation. This structure enables concurrent deployment of transport, payment, and access applications on a single MF3D8300DA8/00 IC without interference.

Does the MF3D8300DA8/00 support backward compatibility with older MIFARE DESFire generations?

Yes, the MF3D8300DA8/00 is functionally backward compatible with MIFARE DESFire EV2, EV1, and D40 (MF3ICD40) in its default configuration. It supports legacy secure messaging modes (D40 Native, EV1, EV2) alongside native EV3 commands, allowing infrastructure upgrades without replacing existing readers or reissuing cards - all while maintaining full EAL5+ security for new deployments.

What security certifications apply to the MF3D8300DA8/00?

The MF3D8300DA8/00 holds Common Criteria EAL5+ certification for both hardware and software, matching the assurance level required for electronic passports and banking cards. It also achieves NFC Forum Type 4 Tag certification (ID 58652) and supports ISO/IEC 7816-4 APDU commands - ensuring interoperability with global smart card infrastructure and regulatory compliance for high-trust applications.

How does the Transaction Timer feature enhance security in the MF3D8300DA8/00?

The Transaction Timer in the MF3D8300DA8/00 prevents man-in-the-middle attacks by enforcing strict time limits on transaction execution. If a malicious reader delays finalizing a transaction after the card leaves its field, the MF3D8300DA8/00 automatically aborts the session - ensuring no partial or manipulated data commits to memory and preserving end-to-end integrity for fare deductions, access grants, or payment authorizations.

Is the MF3D8300DA8/00 suitable for wearable or compact form factor designs?

The MF3D8300DA8/00 uses the MOA8 package (SOT500-4) optimized for module-level integration, not ultra-thin wearables. For wristbands or key fobs, MF3DH8300DA8/00 (70 pF version) is recommended due to its higher input capacitance enabling efficient coupling with miniaturized antennas. The MF3D8300DA8/00 remains ideal for standard ISO/IEC 7816-1/2-compliant smart cards and secure tokens where mechanical durability and reader interoperability are prioritized.

MF3D8300DA8/00J Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
-
Package/Case:
MOA8, Smart Card Module
Packaging:
Tape & Reel (TR)
Product Status:
Active
Type:
RFID Reader
Frequency:
13.56MHz
Standards:
ISO 14443A
Interface:
-
Voltage - Supply:
-
Operating Temperature:
-25°C ~ 85°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
PLLMC

MF3D8300DA8/00J FAQ

1.How can I place an order for MF3D8300DA8/00J through Aetrix?

Please submit a Request for Quotation (RFQ) for MF3D8300DA8/00J on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MF3D8300DA8/00J reliable?

The price and inventory of MF3D8300DA8/00J are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MF3D8300DA8/00J is usually 5 days.

3.What payment methods are accepted for MF3D8300DA8/00J?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MF3D8300DA8/00J transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MF3D8300DA8/00J?

MF3D8300DA8/00J orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MF3D8300DA8/00J order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MF3D8300DA8/00J?

For technical support, including MF3D8300DA8/00J datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MF3D8300DA8/00J requirements.

6.How does Aetrix verify that MF3D8300DA8/00J is sourced from the original manufacturer or authorized distributors?

All MF3D8300DA8/00J products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MF3D8300DA8/00J meets industry standards.

7.What is the process for return or replacement of MF3D8300DA8/00J?

All MF3D8300DA8/00J units undergo pre-shipment inspection (PSI). If there is an issue with MF3D8300DA8/00J, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MF3D8300DA8/00J part is unused and in its original packaging.

Return procedure for MF3D8300DA8/00J:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

MF3D8300DA8/00J Tags

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