NXP Semiconductors MF3D8301DUD/00Z
- Part No.:
- MF3D8301DUD/00Z
- Manufacturer:
- NXP Semiconductors
- Category:
- RFID, RF Access, Monitoring ICs
- Package:
- Die
- Datasheet:
-
MF3D8301DUD/00Z.pdf
- Description:
- MF3D8301DUD
- Quantity:
- Payment:

- Shipping:

Inventory:3,237
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Product details
Overview
MF3D8301DUD/00Z from NXP Semiconductors is a contactless multi-application smart card IC compliant with ISO/IEC 14443A, featuring 8 kB non-volatile memory, Common Criteria EAL5+ hardware and software certification, 7-byte UID or optional Random ID, and support for AES-128, 3DES, and DES cryptographic engines. It enables secure public transport ticketing, micro-payment, and access management systems requiring high assurance and flexible file-based application isolation.
For engineers reviewing the MF3D8301DUD/00Z datasheet, MF3D8301DUD/00Z pinout, MF3D8301DUD/00Z application, or MF3D8301DUD/00Z equivalent, key selection considerations include its 8 kB NV memory capacity, 17 pF input capacitance, transaction-oriented anti-tear mechanism, Virtual Card Architecture for privacy-preserving card selection, and backward compatibility with MIFARE DESFire EV2/EV1/D40 infrastructure.
Technical Context
The MF3D8301DUD/00Z implements a dedicated contactless interface compliant with ISO/IEC 14443-2/3A and ISO/IEC 14443-4, supporting data rates up to 848 kbit/s and configurable frame size (FSCI) up to 256 bytes. Its analog front-end includes rectifier, voltage regulator, and multiple hardware sensors (glitch, light, temperature, rail) for tamper resistance.
Internally, it integrates a secure CPU with ROM, RAM, and NVM, alongside dedicated AES-128 and 3-key DES cryptographic accelerators, TRNG, CRC-16/32, and ISO14443 CIU logic. The file system supports up to 32 files per application across six types-including Transaction MAC-and enforces mutual three-pass authentication with application-level key isolation and shared file access across two applications in one transaction.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory capacity | 8 kB non-volatile memory - supports large-scale multi-application deployments such as integrated smart city cards with transport, payment, and access credentials. |
| Input capacitance | 17 pF - optimized for standard antenna designs and ensures reliable RF coupling without requiring high-capacitance tuning components. |
| Data retention | 25 years at 25 °C - guarantees long-term credential validity for student IDs, employee badges, and transit season passes. |
| Write endurance | 1,000,000 cycles typical - enables frequent balance updates in e-purse applications and daily transaction logging in tolling systems. |
| Cryptographic certification | Common Criteria EAL5+ (HW & SW) - meets banking-grade security requirements for electronic passports and financial transactions. |
| RF data rate | Up to 848 kbit/s - reduces transaction time below 100 ms for high-throughput fare gates and event entry points. |
| File types | 6 types including Transaction MAC - allows atomic, signed transaction logging for backend reconciliation and audit compliance. |
Pinout & Package
MF3D8301DUD/00Z is supplied in FFC (Film Frame Carrier) packaging - a 12-inch wafer format with sawn die, 120 μm thickness, intended for embedding into smart cards or inlays. As a contactless IC with no physical pins, it interfaces exclusively via an external antenna coil; no terminal mapping applies.
Key Features
| Feature | Design Value |
|---|---|
| Transaction MAC file type | Generates application-level cryptographic signatures on transacted data, enabling verifiable backend reconciliation without exposing keys. |
| Virtual Card Architecture (VCA) | Enables privacy-preserving card selection by allowing multiple logical cards on one physical device while preventing cross-application identification. |
| Proximity Check | Detects relay attacks by measuring RF field decay time, blocking unauthorized remote access attempts in access control and payment scenarios. |
| MIsmartApp delegated management | Allows third-party application owners to provision and manage their own applications using factory-loaded DAM keys for AppXplorer cloud integration. |
| Backward compatibility mode | Operates as MIFARE DESFire EV2 or EV1 out-of-box - eliminates infrastructure upgrades when migrating legacy transit or ID systems. |
Applications
| Secure Public Transport Ticketing | Multi-Application Smart City Card |
|---|---|
Use Scenario: Contactless fare validation at bus, metro, and tram gates with real-time balance deduction and trip history logging. IC Role / Device Role / Timing Role: Secure transaction processor managing encrypted value files, transaction MAC generation, and anti-tear rollback during power loss. Use Value: Enables offline balance updates and tamper-proof audit trails, reducing dependency on network connectivity at point-of-use. |
Use Scenario: Single credential for public transport, bike sharing, municipal building access, and local loyalty programs across city services. IC Role / Device Role / Timing Role: Multi-application host with isolated AID-based file structures, shared application management, and VCA-enabled privacy during service selection. Use Value: Eliminates credential fragmentation while maintaining strict access segregation between service providers via independent key sets and file permissions. |
| Secure Access Management | Micro-Payment and Loyalty |
Use Scenario: Physical access control for corporate campuses or government facilities using role-based credentials with time-bound permissions. IC Role / Device Role / Timing Role: Cryptographically authenticated identity token enforcing application-level key policies, Originality Check, and Proximity Check against relay attacks. Use Value: Prevents cloning and unauthorized remote access, meeting ISO/IEC 27001-aligned physical security requirements. |
Use Scenario: Closed-loop e-payment at vending machines, cafeterias, and retail kiosks with offline transaction processing and backend reconciliation. IC Role / Device Role / Timing Role: Secure value file manager with transaction timer, automatic anti-tear, and CMAC-signed transaction logs. Use Value: Ensures monetary integrity during power interruption and enables deterministic reconciliation of batched transactions with zero data loss. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar contactless multi-application IC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MF3D8300DA4/00 | Same 8 kB memory and 17 pF capacitance, but packaged in MOA4 (SOT500-2) module carrier instead of FFC wafer form. | Targeted for module-based integration (e.g., embedded readers or wearable devices), not direct card inlay. | Select MF3D8300DA4/00 when integrating into PCB-mounted modules requiring standardized leadless packaging. |
| MF3DH8301DUD/00 | Identical 8 kB memory and FFC packaging, but with 70 pF input capacitance for compact antenna designs in small-form-factor cards or wearables. | Suitable for constrained-space applications like wristbands or thin ID cards where low-Hmin operation is critical. | Select MF3DH8301DUD/00 only when antenna geometry requires higher input capacitance to maintain coupling efficiency. |
Compared with MF3D8301DUD/00Z, MF3D8300DA4/00 shifts integration from inlay manufacturing to module assembly, while MF3DH8301DUD/00 trades standard antenna compatibility for miniaturized form factor support - neither offers functional or security enhancements over the base EV3 platform.
Availability
MF3D8301DUD/00Z is available at Aetrix Electronics and suitable for secure public transport ticketing, smart city credentialing, and micro-payment systems requiring stable component supply, long-term lifecycle support, and certified cryptographic assurance.
Supply support for MF3D8301DUD/00Z includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and identification markets, with leadership in NFC, RFID, and trusted execution environments.
The MF3D8301DUD/00Z belongs to the MIFARE DESFire EV3 product line, designed specifically for high-assurance, multi-application contactless smart cards used in transportation, access control, and digital identity ecosystems.
FAQ
What is the memory configuration of MF3D8301DUD/00Z?
The MF3D8301DUD/00Z contains 8 kB of non-volatile memory organized as a flexible file system supporting unlimited applications (limited only by memory), up to 32 files per application, and six file types including Standard Data, Value, Linear/Cyclic Record, Backup Data, and Transaction MAC. File sizes are defined at creation, and data retention is rated at 25 years.
Does MF3D8301DUD/00Z support AES-128 encryption?
Yes, MF3D8301DUD/00Z supports AES-128 encryption via its hardware cryptographic engine, alongside 3-key DES (3K3DES) and single DES. It uses AES-128 for mutual authentication, secure messaging, and encrypted data transfer, with key versioning and multiple key sets per application for robust key lifecycle management.
Is MF3D8301DUD/00Z backward compatible with older MIFARE DESFire generations?
Yes, MF3D8301DUD/00Z operates in default delivery mode as MIFARE DESFire EV2 or EV1, ensuring full functional backward compatibility with existing MIFARE DESFire EV2, EV1, and D40 (MF3ICD40) infrastructure. New EV3 features require explicit activation via dedicated commands and do not affect legacy interoperability.
What security certifications does MF3D8301DUD/00Z hold?
MF3D8301DUD/00Z is certified to Common Criteria EAL5+ for both hardware and software, matching the assurance level required for banking cards and electronic passports. It also holds NFC Forum Type 4 Tag certification (ID 58652) and implements Proximity Check, Originality Check, and hardware exception sensors for physical tamper resistance.
How does the Transaction MAC feature work in MF3D8301DUD/00Z?
The Transaction MAC file type in MF3D8301DUD/00Z generates a cryptographically signed digest of transacted data using a secret application key, providing verifiable proof of transaction integrity to backend systems. This enables offline-first operation with deterministic reconciliation and prevents replay or modification of transaction records.
MF3D8301DUD/00Z Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- Die
- Packaging:
- Tray
- Product Status:
- Active
- Type:
- RFID Reader/Transponder
- Frequency:
- 13.56MHz
- Standards:
- Mifare, NFC
- Interface:
- -
- Voltage - Supply:
- -
- Operating Temperature:
- -25°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- Wafer
MF3D8301DUD/00Z FAQ
1.How can I place an order for MF3D8301DUD/00Z through Aetrix?
Please submit a Request for Quotation (RFQ) for MF3D8301DUD/00Z on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MF3D8301DUD/00Z reliable?
The price and inventory of MF3D8301DUD/00Z are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MF3D8301DUD/00Z is usually 5 days.
3.What payment methods are accepted for MF3D8301DUD/00Z?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MF3D8301DUD/00Z transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MF3D8301DUD/00Z?
MF3D8301DUD/00Z orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MF3D8301DUD/00Z order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MF3D8301DUD/00Z?
For technical support, including MF3D8301DUD/00Z datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MF3D8301DUD/00Z requirements.
6.How does Aetrix verify that MF3D8301DUD/00Z is sourced from the original manufacturer or authorized distributors?
All MF3D8301DUD/00Z products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MF3D8301DUD/00Z meets industry standards.
7.What is the process for return or replacement of MF3D8301DUD/00Z?
All MF3D8301DUD/00Z units undergo pre-shipment inspection (PSI). If there is an issue with MF3D8301DUD/00Z, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MF3D8301DUD/00Z part is unused and in its original packaging.
Return procedure for MF3D8301DUD/00Z:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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