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NXP Semiconductors MF3D9300DA8/01J
- Part No.:
- MF3D9300DA8/01J
- Manufacturer:
- NXP Semiconductors
- Category:
- RFID, RF Access, Monitoring ICs
- Package:
- MOA8, Smart Card Module
- Datasheet:
-
MF3D9300DA8/01J.pdf
- Description:
- IC RFID TRANSP
- Quantity:
- Payment:
- Shipping:
Inventory:3,735
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Product details
Overview
MF3D9300DA8/01J from NXP Semiconductors is a contactless multi-application smart card IC compliant with ISO/IEC 14443A, featuring 16 kB non-volatile memory, Common Criteria EAL5+ hardware and software certification, 7-byte UID, and support for AES-128 and 3DES cryptographic engines. It serves as the secure core of transit cards, e-ID documents, and micro-payment systems requiring high assurance and field-upgradable application logic.
For engineers reviewing the MF3D9300DA8/01J datasheet, MF3D9300DA8/01J pinout, MF3D9300DA8/01J application, or MF3D9300DA8/01J equivalent, key selection considerations include its 16 kB NV memory capacity, 17 pF input capacitance, SOT500-4 MOA8 package, EV3-specific Transaction MAC and Proximity Check features, and backward compatibility with DESFire EV2/EV1 infrastructure.
Technical Context
The MF3D9300DA8/01J implements a dedicated 32-bit CPU with ROM-based firmware, hardware-accelerated AES-128 and 3-key TDEA cryptographic engines, and integrated TRNG for key derivation. Its memory management unit (MMU) enforces strict isolation between applications-each with up to 32 files across six types-including Transaction MAC files for backend-verified transaction integrity.
It supports ISO/IEC 14443-4 protocol at data rates up to 848 kbit/s, configurable ATS for personalization, and dual-mode secure messaging (EV1/EV2/EV3). The chip integrates analog front-end sensors (voltage, temperature, light, glitch) and active shielding to counter physical attacks, while Virtual Card Architecture enables privacy-preserving multi-VC card selection.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| NV Memory | 16 kB - supports ≥10 full-service applications (e.g., transport + payment + access) with file-level backup and dynamic allocation |
| Security Certification | Common Criteria EAL5+ (HW & SW) - meets banking and e-passport assurance requirements for tamper resistance and secure boot |
| Cryptographic Engines | AES-128 + 3-key TDEA - enables strong mutual authentication and encrypted RF-channel communication per session |
| RF Interface | ISO/IEC 14443A compliant, 13.56 MHz, up to 848 kbit/s - ensures interoperability with global NFC readers and legacy MIFARE infrastructure |
| Input Capacitance | 17 pF - optimized for standard antenna designs in plastic card and thin-form-factor applications |
| File System | 6 file types (incl. Transaction MAC), 32 files/app, no app limit - enables complex multi-service schemes like Smart City mobility cards |
| Anti-Tampering | Hardware exception sensors + Proximity Check + Originality Check - detects relay attacks, cloning, and physical probing attempts |
Pinout & Package
MF3D9300DA8/01J is housed in a plastic leadless module carrier package (MOA8) per SOT500-4 standard. This surface-mountable IC has no external pins; it interfaces exclusively via an embedded coil antenna using inductive coupling. Terminal functionality is defined by internal RF interface circuitry-not discrete I/O pins-and requires no PCB-level signal routing.
Key Features
| Feature | Design Value |
|---|---|
| Transaction MAC file type | Generates cryptographically signed transaction logs per application, enabling backend verification of data integrity without exposing keys |
| Proximity Check | Detects relay attacks by measuring RF field decay time-prevents unauthorized remote access to card functions |
| MIsmartApp delegated management | Allows third-party service providers to create and manage applications on shared cards without PICC owner intervention |
| Virtual Card Architecture (VCA) | Enables multiple logical cards on one physical device with selective, privacy-preserving application discovery and selection |
| Secure Dynamic Messaging (SDM) | Mirrors authenticated NDEF text payloads for NFC-enabled mobile devices-supports SUN-compliant mobile ticketing |
Applications
| Public Transport Ticketing | Smart City Mobility Card |
|---|---|
Use Scenario: Contactless fare collection across buses, trams, and metro lines with offline balance updates and audit trails. IC Role / Device Role / Timing Role: Secure storage and cryptographic execution environment for encrypted value files, transaction counters, and audit logs. Use Value: Enables fast tap-in/tap-out (<100 ms) with guaranteed atomic updates across balance and history files-even during power loss. |
Use Scenario: Single-card access to integrated urban services including bike sharing, parking, museum entry, and citizen ID. IC Role / Device Role / Timing Role: Multi-application runtime platform with isolated AID-based application containers and shared file access across domains. Use Value: Eliminates need for separate cards by supporting concurrent, independently managed services under one certified security domain. |
| Secure Access Management | Micro-Payment & Loyalty |
Use Scenario: Physical access control for corporate campuses or government facilities with role-based credentialing and revocation. IC Role / Device Role / Timing Role: Tamper-resistant identity token with mutual authentication, randomized UID option, and proximity-check enforced session validity. Use Value: Prevents credential cloning and relay attacks-ensuring only authorized, physically present users gain entry. |
Use Scenario: Closed-loop e-wallet for vending machines, cafeterias, and retail loyalty programs with offline transaction capability. IC Role / Device Role / Timing Role: Secure value file handler with built-in anti-tear mechanism and CMAC-protected transaction logging. Use Value: Guarantees consistent balance state across all terminals without real-time network dependency or backend reconciliation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar contactless multi-application IC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MF3D9301DUD/01 | Same 16 kB memory and EV3 feature set, but in FFC wafer form (120 μm thickness) instead of MOA8 module package | Targeted for inlay embedding into PVC cards or laminates-not surface-mount PCB integration | Select when integrating into smart card bodies rather than module-based reader designs or embedded modules |
| MF3DH9300DA8/01 | Identical MOA8/SOT500-4 package and 16 kB memory, but with 70 pF input capacitance for small-antenna or compact-form-factor designs | Optimized for wearables, wristbands, or thin cards where standard 17 pF impedance matching is impractical | Select when antenna size constraints require higher capacitive loading to maintain coupling efficiency at 13.56 MHz |
Compared with MF3D9300DA8/01J, MF3D9301DUD/01 offers identical security and memory but requires wafer-level assembly, while MF3DH9300DA8/01 trades lower RF sensitivity for mechanical miniaturization-making MF3D9300DA8/01J optimal for standard-size cards with robust read range.
Availability
MF3D9300DA8/01J is available at Aetrix Electronics and suitable for public transport ticketing, secure access management, and micro-payment systems requiring stable component supply, long-term lifecycle support, and certified security compliance.
Supply support for MF3D9300DA8/01J includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and identification markets, with over two decades of leadership in contactless IC innovation.
The MF3D9300DA8/01J belongs to the MIFARE DESFire EV3 product line-designed specifically for high-assurance, multi-service contactless applications in smart cities, transit, and digital identity ecosystems.
FAQ
What security certifications does MF3D9300DA8/01J hold?
MF3D9300DA8/01J holds Common Criteria EAL5+ certification for both hardware and software, validated against the full MIFARE DESFire EV3 specification. This certification covers cryptographic implementation, secure boot, memory protection, and physical attack resistance-including voltage, temperature, and glitch sensors. It meets the assurance level required for banking cards and electronic passports, and is documented in the official NXP Product Short Data Sheet Rev. 3.1.
How much non-volatile memory does MF3D9300DA8/01J provide, and how is it structured?
MF3D9300DA8/01J provides 16 kB of non-volatile memory organized as a flexible, application-isolated file system. Each application can contain up to 32 files across six types-including Standard Data, Value, Linear/Cyclic Record, Backup Data, and Transaction MAC files. File sizes are user-defined at creation (except Transaction MAC), and memory reuse is supported via Format Application commands-enabling dynamic service provisioning on deployed cards.
Is MF3D9300DA8/01J compatible with existing MIFARE DESFire infrastructure?
Yes, MF3D9300DA8/01J is functionally backward compatible with MIFARE DESFire EV2, EV1, and D40 (MF3ICD40) in its default delivery configuration. It supports all legacy secure messaging modes (D40 Native, EV1, EV2) and ISO/IEC 7816-4 APDU commands. New EV3 features-including Transaction MAC, Proximity Check, and MIsmartApp-require explicit activation via dedicated commands and do not interfere with legacy operation.
What distinguishes MF3D9300DA8/01J from MF3DH9300DA8/01?
MF3D9300DA8/01J and MF3DH9300DA8/01 share identical 16 kB memory, MOA8/SOT500-4 packaging, and EV3 feature set-but differ in input capacitance: MF3D9300DA8/01J uses 17 pF for standard antenna tuning, while MF3DH9300DA8/01 uses 70 pF to support compact or low-inductance antennas in wearables and thin cards. Both are drop-in replacements in layout, but RF matching must be re-validated for the target antenna geometry.
Does MF3D9300DA8/01J support NFC Forum Type 4 Tag functionality?
Yes, MF3D9300DA8/01J is NFC Forum Type 4 Tag certified (Certificate ID 58652). It supports NDEF message mirroring via Secure Dynamic Messaging (SDM), enabling seamless interaction with NFC-enabled smartphones. SDM payloads are cryptographically signed and appear as plain-text NDEF records-facilitating mobile ticketing, loyalty redemption, and cloud-based service enrollment without requiring proprietary apps.
MF3D9300DA8/01J Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- MOA8, Smart Card Module
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- RFID Reader
- Frequency:
- 13.56MHz
- Standards:
- ISO 14443A, ISO 7816-4, Mifare, NFC
- Interface:
- -
- Voltage - Supply:
- -
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PLLMC
MF3D9300DA8/01J FAQ
1.How can I place an order for MF3D9300DA8/01J through Aetrix?
Please submit a Request for Quotation (RFQ) for MF3D9300DA8/01J on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MF3D9300DA8/01J reliable?
The price and inventory of MF3D9300DA8/01J are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MF3D9300DA8/01J is usually 5 days.
3.What payment methods are accepted for MF3D9300DA8/01J?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MF3D9300DA8/01J transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MF3D9300DA8/01J?
MF3D9300DA8/01J orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MF3D9300DA8/01J order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MF3D9300DA8/01J?
For technical support, including MF3D9300DA8/01J datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MF3D9300DA8/01J requirements.
6.How does Aetrix verify that MF3D9300DA8/01J is sourced from the original manufacturer or authorized distributors?
All MF3D9300DA8/01J products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MF3D9300DA8/01J meets industry standards.
7.What is the process for return or replacement of MF3D9300DA8/01J?
All MF3D9300DA8/01J units undergo pre-shipment inspection (PSI). If there is an issue with MF3D9300DA8/01J, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MF3D9300DA8/01J part is unused and in its original packaging.
Return procedure for MF3D9300DA8/01J:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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