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NXP Semiconductors MF3DA200DA4/02J
- Part No.:
- MF3DA200DA4/02J
- Manufacturer:
- NXP Semiconductors
- Category:
- RFID, RF Access, Monitoring ICs
- Package:
- MOA4, Smart Card Module
- Datasheet:
-
MF3DA200DA4/02J.pdf
- Description:
- MF3DA200DA4
- Quantity:
- Payment:
- Shipping:
Inventory:3,304
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Product details
Overview
MF3DA200DA4/02J from NXP Semiconductors is a contactless multi-application IC compliant with ISO/IEC 14443A, featuring 32 KB EEPROM, Common Criteria EAL5+ security certification, AES-128 and 3DES hardware cryptographic engines, and support for Transaction MAC and MIsmartApp delegated application management. It serves as the secure core of smart city mobility cards, enabling public transport, e-payment, and access control on a single credential.
For engineers reviewing the MF3DA200DA4/02J datasheet, MF3DA200DA4/02J pinout, MF3DA200DA4/02J application, or MF3DA200DA4/02J equivalent, key selection considerations include its 32 KB NV memory capacity, 17 pF input capacitance, SOT500-2 MOB4 package, EAL5+ certification, and backward compatibility with MIFARE DESFire EV1 and D40 systems.
Technical Context
The MF3DA200DA4/02J implements a dual-layer security architecture: mutual three-pass authentication at PICC and application levels, with configurable key sets (up to 16 per application) and EV2 Secure Messaging using AES-128. Its file system supports up to 32 files per application across six types-including Transaction MAC-and enforces transaction-oriented anti-tear integrity.
It operates at 13.56 MHz with RF data rates up to 848 kbit/s, uses an on-chip oscillator and rectifier for contactless power harvesting, and integrates hardware accelerators for DES, 3DES, and AES encryption, CMAC generation, and CRC-32 calculation-enabling secure, high-throughput transactions without host-side crypto processing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Capacity | 32 KB EEPROM - supports large-scale multi-application deployments including transit, loyalty, and ID services on one card. |
| Security Certification | Common Criteria EAL5+ (HW & SW) - meets banking-grade assurance requirements for sensitive credential applications. |
| Cryptographic Engines | Hardware AES-128 and 3DES - enables fast, deterministic encryption/decryption and CMAC generation without software overhead. |
| RF Interface | ISO/IEC 14443A compliant, up to 848 kbit/s - ensures interoperability with global NFC readers and legacy MIFARE infrastructure. |
| Input Capacitance | 17 pF - optimized for standard antenna designs; lower than 70 pF variants, reducing tuning complexity in card laminates. |
| File System | Up to 32 files per application, 6 file types including Transaction MAC - enables atomic multi-file updates and verifiable backend reconciliation. |
| Data Retention | 25 years - guarantees long-term reliability for credentials deployed in public infrastructure with infrequent replacement cycles. |
Pinout & Package
MF3DA200DA4/02J is supplied in the MOB4 plastic leadless module carrier package (SOT500-2), designed for embedding into smart cards and secure modules. The device has no external pins - it interfaces exclusively via its integrated coil-compatible RF interface (ISO/IEC 14443A). All I/O is contactless; no physical terminal mapping applies.
Key Features
| Feature | Design Value |
|---|---|
| Transaction MAC | Generates cryptographically signed transaction proofs on-card, enabling tamper-evident backend reconciliation without exposing keys. |
| MIsmartApp Delegation | Allows third-party application owners to manage their own apps under shared PICC ownership - essential for multi-operator smart city ecosystems. |
| Virtual Card Architecture | Enables privacy-preserving card selection by masking AID exposure during discovery - critical for citizen-facing multi-service credentials. |
| Proximity Check | Detects relay attacks in real time using RF round-trip timing, blocking unauthorized remote access attempts before authentication begins. |
| Originality Check | Verifies genuine NXP silicon at runtime, preventing counterfeit ICs from compromising system security and lifecycle management. |
Applications
| Public Transport Ticketing | Smart City Mobility Card |
|---|---|
|
Use Scenario: Contactless fare payment across buses, trams, and metro systems with offline validation and balance updates. IC Role / Device Role / Timing Role: Secure storage and cryptographic execution platform for encrypted value files, transaction logs, and session keys. Use Value: Enables seamless cross-operator travel with guaranteed transaction atomicity and 25-year data retention for audit compliance. |
Use Scenario: Single credential unifying transit, bike/car sharing, municipal ID, and local e-payment in urban environments. IC Role / Device Role / Timing Role: Multi-application runtime environment with isolated app containers, delegated management, and privacy-aware card selection. Use Value: Reduces citizen credential fragmentation while enforcing strict inter-app access control and EAL5+-assured data separation. |
| Secure Access Management | Micro-Payment & Loyalty |
|
Use Scenario: Physical access control for corporate campuses, government facilities, and secure residential buildings. IC Role / Device Role / Timing Role: Authentication endpoint supporting mutual challenge-response, diversified keys, and proximity-checked sessions. Use Value: Prevents relay and cloning attacks via Proximity Check and Originality Check, meeting ISO/IEC 27001-aligned physical security policies. |
Use Scenario: Closed-loop retail payments and tiered loyalty programs with offline balance updates and merchant-specific keys. IC Role / Device Role / Timing Role: Secure value file manager with automatic anti-tear, multiple key sets per merchant, and Transaction MAC for dispute resolution. Use Value: Eliminates need for online authorization in low-connectivity venues while providing cryptographically verifiable transaction records. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar contactless multi-application IC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MF3D9200DA4/02 | 16 KB EEPROM, same 17 pF input capacitance and SOT500-2 package | Lower memory capacity limits number of concurrent applications and file depth | Select when application footprint fits within 16 KB and cost optimization is prioritized over future scalability. |
| MF3DH2200DA4/01 | 2 KB EEPROM, 70 pF input capacitance, SOT500-2 package | Targeted for ultra-thin or small-form-factor cards requiring higher input capacitance for antenna coupling | Choose only for space-constrained designs where 2 KB memory suffices and antenna tuning favors 70 pF loading. |
Compared with MF3DA200DA4/02J, MF3D9200DA4/02 offers identical interface and security but halves memory capacity, while MF3DH2200DA4/01 trades memory and capacitance for compact form factor suitability - neither matches the 32 KB + 17 pF combination required for full-featured smart city credential deployment.
Availability
MF3DA200DA4/02J is available at Aetrix Electronics and suitable for secure public transport ticketing, smart city mobility cards, and micro-payment systems requiring stable component supply, long-term lifecycle assurance, and certified cryptographic functionality.
Supply support for MF3DA200DA4/02J includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, IoT, and identification markets, with deep expertise in contactless IC design and Common Criteria evaluation.
The MF3DA200DA4/02J belongs to the MIFARE DESFire EV2 product line, engineered specifically for high-assurance, multi-application contactless credentials in smart cities, transit, and secure access - emphasizing EAL5+ certification, flexible file architecture, and future-proof NFC interoperability.
FAQ
What security certifications does the MF3DA200DA4/02J hold?
The MF3DA200DA4/02J is certified to Common Criteria EAL5+ for both hardware and software, matching the assurance level required for banking cards and e-passports. This certification covers its cryptographic engines (AES-128, 3DES), mutual authentication protocol, secure messaging implementation, and file system integrity mechanisms - all validated under CC certification report AVA_VAN.2 and ASE_TSP.1.
How does the MF3DA200DA4/02J support multi-application deployment?
The MF3DA200DA4/02J supports unlimited applications via its flexible file system, with each application holding up to 32 files across six types - including Standard Data, Value, Linear/Cyclic Record, Backup, and Transaction MAC files. Applications are isolated by dedicated key sets and access rights, and MIsmartApp enables delegated management so third parties can provision and update their own apps without PICC-level privileges.
What is the significance of the "17 pF" input capacitance in MF3DA200DA4/02J?
The 17 pF input capacitance of the MF3DA200DA4/02J is optimized for standard smart card antenna geometries and simplifies RF matching in ISO/IEC 7816-1/2-compliant card laminates. Unlike the 70 pF variant (MF3DHx2), this value reduces sensitivity to antenna size variations and avoids the need for additional tuning components - making it ideal for mainstream transit and ID card manufacturing.
Can MF3DA200DA4/02J operate with existing MIFARE DESFire EV1 infrastructure?
Yes, MF3DA200DA4/02J operates in backward-compatible mode with MIFARE DESFire EV1 and D40 systems out-of-the-box. It supports legacy commands, 2TDEA/3TDEA cryptography, and D40/EV1 secure messaging protocols. New EV2 features - such as Transaction MAC and MIsmartApp - require explicit activation via configuration commands and do not interfere with existing deployments.
What distinguishes Transaction MAC in MF3DA200DA4/02J from standard MAC functions?
The Transaction MAC feature in MF3DA200DA4/02J generates a cryptographically signed digest of *all* data exchanged during a transaction - including command parameters, response data, and internal state - using a secret application key stored securely on the IC. Unlike generic MACs, this value is bound to the transaction context and verified by backend systems to prove authenticity, integrity, and non-repudiation of the entire interaction, not just message payloads.
MF3DA200DA4/02J Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- MOA4, Smart Card Module
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- RFID Transponder
- Frequency:
- 13.56MHz
- Standards:
- Mifare, ISO 14443, ISO 7816-4
- Interface:
- -
- Voltage - Supply:
- -
- Operating Temperature:
- -25°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PLLMC
MF3DA200DA4/02J FAQ
1.How can I place an order for MF3DA200DA4/02J through Aetrix?
Please submit a Request for Quotation (RFQ) for MF3DA200DA4/02J on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MF3DA200DA4/02J reliable?
The price and inventory of MF3DA200DA4/02J are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MF3DA200DA4/02J is usually 5 days.
3.What payment methods are accepted for MF3DA200DA4/02J?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MF3DA200DA4/02J transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MF3DA200DA4/02J?
MF3DA200DA4/02J orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MF3DA200DA4/02J order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MF3DA200DA4/02J?
For technical support, including MF3DA200DA4/02J datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MF3DA200DA4/02J requirements.
6.How does Aetrix verify that MF3DA200DA4/02J is sourced from the original manufacturer or authorized distributors?
All MF3DA200DA4/02J products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MF3DA200DA4/02J meets industry standards.
7.What is the process for return or replacement of MF3DA200DA4/02J?
All MF3DA200DA4/02J units undergo pre-shipment inspection (PSI). If there is an issue with MF3DA200DA4/02J, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MF3DA200DA4/02J part is unused and in its original packaging.
Return procedure for MF3DA200DA4/02J:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MF3DA200DA4/02J Tags
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SL2S2602FTBX
NXP Semiconductors
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ST25DV04K-IER6S3
STMicroelectronics
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ST25DV04K-IER6C3
STMicroelectronics
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LXMSJZNCMD-217
Murata Electronics
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NT3H2111W0FTTJ
NXP Semiconductors
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NT3H2111W0FHKH
NXP Semiconductors
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M24LR04E-RMC6T/2
STMicroelectronics
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ST25DV04KC-JF6D3
STMicroelectronics
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ST25DV64KC-IE6S3
STMicroelectronics
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ST25DV64K-IER6T3
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NXP Semiconductors
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