My Inquiry
My Account
NXP Semiconductors MF3DA200DA6/02J
- Part No.:
- MF3DA200DA6/02J
- Manufacturer:
- NXP Semiconductors
- Category:
- RFID, RF Access, Monitoring ICs
- Package:
- MOB6, Smart Card Module
- Datasheet:
-
MF3DA200DA6/02J.pdf
- Description:
- MF3DA200DA6
- Quantity:
- Payment:
- Shipping:
Inventory:2,669
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MF3DA200DA6/02J from NXP Semiconductors is a contactless multi-application IC compliant with ISO/IEC 14443A, featuring 32 KB EEPROM, 17 pF input capacitance, Common Criteria EAL5+ security certification, and support for AES-128 and 3DES cryptographic engines. It enables secure public transport ticketing, micro-payment, and smart city mobility cards with Transaction MAC and MIsmartApp delegated management.
For engineers reviewing the MF3DA200DA6/02J datasheet, MF3DA200DA6/02J pinout, MF3DA200DA6/02J application, or MF3DA200DA6/02J equivalent, key selection considerations include its 32 KB NV memory capacity, EAL5+ hardware/software security certification, ISO/IEC 7816-4 APDU compatibility, Transaction MAC file type, and SOT500-3 MOB6 module carrier package.
Technical Context
The MF3DA200DA6/02J implements a dedicated contactless interface compliant with ISO/IEC 14443-2/3A and ISO/IEC 14443-4, supporting data rates up to 848 kbit/s and configurable frame size (up to 256 bytes for 16/32 KB variants). Its on-chip CPU executes a secure operating system with mutual three-pass authentication and hardware-accelerated cryptographic engines for DES, 3DES, and AES-128.
Memory organization uses a flexible file system with unlimited applications, each supporting up to 32 files across six types-including Standard Data, Value, Linear/Cyclic Record, Backup Data, and Transaction MAC files. File sizes are user-defined at creation, and automatic anti-tear ensures transaction-oriented data integrity across all backup-capable file types.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory capacity | 32 KB EEPROM with 25-year data retention and 500,000 write endurance cycles |
| RF interface | ISO/IEC 14443A compliant; supports 106–848 kbit/s data transfer rates |
| Security certification | Common Criteria EAL5+ for both hardware and software components |
| Cryptographic engines | Hardware-accelerated 3DES (56/112/168-bit) and AES-128 with key versioning |
| Input capacitance | 17 pF - optimized for standard antenna designs in card and tag form factors |
| File system | Unlimited applications; up to 32 files per application; 6 file types including Transaction MAC |
| Secure messaging | Three protocol levels: D40-native, EV1-compatible, and EV2-native AES-based |
Pinout & Package
MF3DA200DA6/02J is supplied in the MOB6 plastic leadless module carrier package (SOT500-3), designed for embedding into contactless smart cards, tags, and wearable devices. This surface-mount module integrates the IC die, matching capacitor, and antenna coupling structure in a compact, ready-to-mount format.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| ANT1 / ANT2 | RF antenna interface | Differential RF input/output terminals for connection to external loop antenna; no internal matching required |
| VSS | Ground reference | Primary ground terminal for analog and digital circuitry; must be low-impedance connection |
| VDD | Power supply | Not powered externally - energy harvested solely from RF field; VDD is internal regulated rail |
Key Features
| Feature | Design Value |
|---|---|
| Transaction MAC file type | Generates cryptographically signed transaction proofs on-card for backend verification without exposing keys |
| MIsmartApp delegation | Enables third-party application creation and management under PICC owner-controlled access rights |
| Proximity Check | Hardware-based relay attack protection via RF round-trip time measurement |
| Originality Check | Verifies genuine NXP silicon using embedded secret signature, preventing counterfeit integration |
| Virtual Card Architecture | Supports multiple logical cards on one physical device with privacy-preserving selection |
Applications
| Public Transport Ticketing | Smart City Mobility Card |
|---|---|
Use Scenario: Contactless fare payment across buses, trams, and metro systems with offline validation capability. IC Role / Device Role / Timing Role: Secure storage and cryptographic processing of encrypted trip records, balance, and session keys. Use Value: Enables fast tap-in/tap-out (<100 ms) with tamper-resistant balance updates and seamless handover between transit operators. | Use Scenario: Single credential for integrated urban services including bike sharing, parking, museum access, and e-ID. IC Role / Device Role / Timing Role: Multi-application container managing isolated, permissioned file systems for each service domain. Use Value: Eliminates need for separate cards while maintaining strict inter-application data isolation and independent key management. |
| Secure Access Management | Micro-Payment & Loyalty |
Use Scenario: Physical access control for corporate campuses or residential buildings using encrypted credentials. IC Role / Device Role / Timing Role: Stores biometric templates or dynamic challenge-response tokens with hardware-backed key derivation. Use Value: Prevents cloning via Originality Check and Proximity Check, and enforces revocation via application-level key updates. | Use Scenario: Closed-loop electronic purse and merchant loyalty points on disposable or reusable cards. IC Role / Device Role / Timing Role: Hosts value files with built-in backup and atomic increment/decrement operations. Use Value: Guarantees transaction consistency during power loss via automatic anti-tear mechanism across all value and record files. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar contactless multi-application IC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MF3D9200DA6/02 | 16 KB EEPROM; identical MOB6/SOT500-3 package and 17 pF input capacitance | Suitable where application footprint fits within 16 KB and lower memory cost is prioritized | Select when total application + file overhead remains below 14.5 KB usable space |
| MF3DH2200DA6/01 | 2 KB EEPROM; 70 pF input capacitance; same MOB6 package but different capacitance grade | Targeted for ultra-small form factor antennas requiring higher capacitive loading | Choose only if antenna design mandates 70 pF tuning - not interchangeable due to capacitance mismatch |
Compared with MF3DA200DA6/02J, MF3D9200DA6/02 offers reduced memory at lower cost for simpler multi-service deployments, while MF3DH2200DA6/01 serves niche small-antenna designs but lacks both memory scale and cryptographic feature parity.
Availability
MF3DA200DA6/02J is available at Aetrix Electronics and suitable for secure public transport ticketing, smart city mobility credentialing, and micro-payment system development requiring stable component supply, long-term lifecycle assurance, and certified security compliance.
Supply support for MF3DA200DA6/02J includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and identification markets, with leadership in contactless IC technology since the introduction of MIFARE.
The MF3DA200DA6/02J belongs to the MIFARE DESFire EV2 product line, engineered specifically for high-assurance, multi-application contactless systems demanding EAL5+ certification, flexible file architecture, and future-proof cryptographic agility.
FAQ
What security certifications does the MF3DA200DA6/02J hold?
The MF3DA200DA6/02J is certified to Common Criteria EAL5+ for both hardware and software components - the same assurance level used in banking cards and e-passports. This covers the full stack: cryptographic engine implementation, secure boot, memory protection, and side-channel resistance. The MF3DA200DA6/02J also supports optional Random ID generation and Originality Check to prevent counterfeiting and enhance privacy.
How much user memory is available on the MF3DA200DA6/02J?
The MF3DA200DA6/02J provides 32 KB of EEPROM non-volatile memory, with typical data retention of 25 years and write endurance of 500,000 cycles. Usable space depends on application structure - each application supports up to 32 files, and file sizes are defined at creation. Overhead for file headers, keys, and system structures reduces net payload capacity, but real-world deployments routinely utilize >28 KB for multi-application configurations.
Does the MF3DA200DA6/02J support ISO/IEC 7816-4 commands?
Yes, the MF3DA200DA6/02J fully supports ISO/IEC 7816-4 APDU structure and command set, including SELECT FILE (INS A4), READ BINARY (B0), UPDATE BINARY (D6), READ RECORDS (B2), APPEND RECORD (E2), GET CHALLENGE (84), INTERNAL AUTHENTICATE (88), and EXTERNAL AUTHENTICATE (82). It also supports ISO/IEC 7816-4 file selection by DF name or File ID, enabling interoperability with existing smart card infrastructure.
What is the difference between MF3DA200DA6/02J and MF3D9200DA6/02?
The MF3DA200DA6/02J contains 32 KB of EEPROM and is optimized for complex, multi-service deployments requiring large application footprints, while MF3D9200DA6/02 offers 16 KB in the same MOB6/SOT500-3 package. Both share identical RF performance, security features, and pinout. The MF3DA200DA6/02J enables more concurrent applications, larger transaction logs, and deeper nested file structures without memory constraints.
Can the MF3DA200DA6/02J operate in backward-compatible mode with older MIFARE DESFire systems?
Yes, the MF3DA200DA6/02J operates in default delivery configuration as a MIFARE DESFire EV1 device, ensuring full interoperability with legacy readers and infrastructure. All EV2-specific features - including Transaction MAC, MIsmartApp, and Proximity Check - require explicit activation via dedicated commands. This allows phased migration without replacing existing reader hardware or middleware.
MF3DA200DA6/02J Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- MOB6, Smart Card Module
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- RFID Transponder
- Frequency:
- 13.56MHz
- Standards:
- Mifare, ISO 14443, ISO 7816-4
- Interface:
- -
- Voltage - Supply:
- -
- Operating Temperature:
- -25°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PLLMC
MF3DA200DA6/02J FAQ
1.How can I place an order for MF3DA200DA6/02J through Aetrix?
Please submit a Request for Quotation (RFQ) for MF3DA200DA6/02J on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MF3DA200DA6/02J reliable?
The price and inventory of MF3DA200DA6/02J are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MF3DA200DA6/02J is usually 5 days.
3.What payment methods are accepted for MF3DA200DA6/02J?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MF3DA200DA6/02J transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MF3DA200DA6/02J?
MF3DA200DA6/02J orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MF3DA200DA6/02J order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MF3DA200DA6/02J?
For technical support, including MF3DA200DA6/02J datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MF3DA200DA6/02J requirements.
6.How does Aetrix verify that MF3DA200DA6/02J is sourced from the original manufacturer or authorized distributors?
All MF3DA200DA6/02J products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MF3DA200DA6/02J meets industry standards.
7.What is the process for return or replacement of MF3DA200DA6/02J?
All MF3DA200DA6/02J units undergo pre-shipment inspection (PSI). If there is an issue with MF3DA200DA6/02J, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MF3DA200DA6/02J part is unused and in its original packaging.
Return procedure for MF3DA200DA6/02J:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MF3DA200DA6/02J Tags
-
SL2S2602FTBX
NXP Semiconductors
-
ST25DV04K-IER6S3
STMicroelectronics
-
ST25DV04K-IER6C3
STMicroelectronics
-
LXMSJZNCMD-217
Murata Electronics
-
NT3H2111W0FTTJ
NXP Semiconductors
-
NT3H2111W0FHKH
NXP Semiconductors
-
M24LR04E-RMC6T/2
STMicroelectronics
-
ST25DV04KC-JF6D3
STMicroelectronics
-
ST25DV64KC-IE6S3
STMicroelectronics
-
ST25DV64K-IER6T3
STMicroelectronics
-
NT3H2211W0FTTJ
NXP Semiconductors
-
NT3H2211W0FHKH
NXP Semiconductors
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
