My Inquiry
My Account
NXP Semiconductors MF3DH2200DA4/00J
- Part No.:
- MF3DH2200DA4/00J
- Manufacturer:
- NXP Semiconductors
- Category:
- RFID, RF Access, Monitoring ICs
- Package:
- MOA4, Smart Card Module
- Datasheet:
-
MF3DH2200DA4/00J.pdf
- Description:
- IC RFID READER 13.56MHZ PLLMC
- Quantity:
- Payment:
- Shipping:
Inventory:3,561
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MF3DH2200DA4/01 from NXP Semiconductors is a contactless multi-application IC compliant with ISO/IEC 14443A, featuring 2 KB EEPROM, 70 pF input capacitance, Common Criteria EAL5+ security certification, and support for AES-128 and 3DES cryptographic engines. It serves as the secure core in smart city mobility cards, enabling public transport, e-payment, and access control on a single credential.
For engineers reviewing the MF3DH2200DA4/01 datasheet, MF3DH2200DA4/01 pinout, MF3DH2200DA4/01 application, or MF3DH2200DA4/01 equivalent, key selection considerations include its high-input-capacitance (70 pF) MOA4 package for thin-form-factor card embedding, EV2-specific Transaction MAC and MIsmartApp features, backward compatibility with DESFire EV1/D40, and ISO/IEC 7816-4 APDU interoperability with NFC readers.
Technical Context
The MF3DH2200DA4/01 implements a dedicated ISO/IEC 14443-4 RF interface with configurable FSCI supporting up to 128-byte frames (256 bytes for larger memory variants), operates at 13.56 MHz, and delivers data rates up to 848 kbit/s. Its on-chip architecture integrates hardware-accelerated AES-128 and triple-DES crypto engines, TRNG, voltage/rail/light/glitch sensors, and active shielding for side-channel attack resistance.
It supports mutual three-pass authentication per ISO/IEC 7816-4, transaction-oriented anti-tear backup across all file types, and flexible file system management with up to 32 files per application-including Standard Data, Value, Linear/Cyclic Record, Backup Data, and Transaction MAC file types-each sized at creation time.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Size | 2 KB EEPROM; sufficient for multiple small-to-medium applications (e.g., transit + loyalty + ID) without memory contention. |
| Input Capacitance | 70 pF (typical); enables reliable RF coupling in compact, low-profile card designs with small antenna geometries. |
| Security Certification | Common Criteria EAL5+ (HW & SW); validated assurance level matching banking cards and e-passports. |
| Crypto Engines | Hardware AES-128 and 3DES (56/112/168-bit keys); enables fast, standards-compliant secure messaging and session encryption. |
| Data Retention | 25 years; ensures long-term validity of stored credentials and transaction history in deployed cards. |
| Write Endurance | 500,000 cycles (typical); supports frequent balance updates, access logging, and microtransaction writes over multi-year lifecycle. |
| RF Interface | ISO/IEC 14443A Type 4; guarantees interoperability with global NFC infrastructure including smartphones and legacy MIFARE readers. |
Pinout & Package
MF3DH2200DA4/01 is supplied in MOA4 plastic leadless module carrier package (SOT500-2), designed for direct embedding into smart cards or inlays. The device has no external pins - it interfaces exclusively via its integrated antenna coil through inductive coupling at 13.56 MHz.
Key Features
| Feature | Design Value |
|---|---|
| Transaction MAC file type | Generates cryptographically signed transaction proofs on-card for backend verification-enabling audit-trail integrity in fare collection or payment systems. |
| MIsmartApp (Delegated App Management) | Allows third-party service providers to independently create, manage, and update applications without PICC-level master key exposure-supporting open ecosystem models. |
| Proximity Check | Detects relay attacks by measuring RF signal propagation delay-prevents unauthorized remote card cloning in access or transit use cases. |
| Virtual Card Architecture | Enables privacy-preserving card selection across multiple logical credentials on one physical card-critical for citizen ID and multi-service smart city deployments. |
| Backward Compatibility Mode | Operates as MF3ICD40 or MF3Dx2 EV1 upon power-up; allows phased infrastructure upgrades without replacing existing reader firmware or middleware. |
Applications
| Public Transport Ticketing | Secure Campus Access |
|---|---|
Use Scenario: Contactless tap-in/tap-out for buses, trams, and metro systems with real-time balance deduction and trip history. IC Role / Device Role / Timing Role: Secure credential storage and cryptographic transaction engine handling AES-encrypted fare calculations and Transaction MAC generation per ride. Use Value: Enables offline validation at gates using on-card cryptographic integrity checks, reducing dependency on network connectivity and backend latency. | Use Scenario: Multi-door building access with role-based permissions, visitor pass issuance, and audit logging across academic or corporate campuses. IC Role / Device Role / Timing Role: Trusted identity anchor storing biometric templates, access rights, and time-based privileges-authenticated via mutual three-pass challenge-response. Use Value: Supports dynamic privilege updates over-the-air without reissuing cards, leveraging MIsmartApp for delegated departmental administration. |
| Micro-Payment & Loyalty | Smart City Mobility Card |
Use Scenario: Tap-to-pay at vending machines, cafés, and retail kiosks with closed-loop e-wallet functionality and merchant-specific loyalty points. IC Role / Device Role / Timing Role: Secure value file management with encrypted balance storage, atomic credit/debit operations, and Transaction MAC-backed reconciliation. Use Value: Guarantees tamper-proof transaction integrity even during power loss via automatic anti-tear mechanism-ensuring no partial balance updates. | Use Scenario: Unified citizen card integrating transit, bike/car sharing, museum entry, municipal services, and local discounts in one credential. IC Role / Device Role / Timing Role: Multi-application platform hosting independent, isolated applications-each with dedicated keys, file structures, and access policies managed under Virtual Card Architecture. Use Value: Preserves user privacy during card selection while enabling seamless cross-service authentication-eliminating need for multiple physical cards. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar contactless multi-application IC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MF3D2200DA4/01 | Same 2 KB EEPROM and MOA4 package but 17 pF input capacitance; lower coupling efficiency in ultra-thin cards. | Suitable for standard-thickness PVC cards where antenna size permits stable 17 pF resonance. | Select when cost-sensitive deployment prioritizes compatibility with legacy antenna tuning and avoids high-C redesign. |
| MF3DH4200DA4/01 | 4 KB EEPROM and identical 70 pF input capacitance; doubles available application space without changing form factor. | Required for deployments needing >2 applications with large record files (e.g., full transit history + health records + digital ID). | Choose when future scalability is critical and current 2 KB may constrain feature expansion or multi-tenant service loading. |
Compared with MF3DH2200DA4/01, MF3D2200DA4/01 trades coupling margin for broader antenna design tolerance, while MF3DH4200DA4/01 extends memory headroom within the same mechanical footprint-making MF3DH2200DA4/01 optimal for cost-constrained, high-volume thin-card mobility programs requiring proven EAL5+ security and 70 pF robustness.
Availability
MF3DH2200DA4/01 is available at Aetrix Electronics and suitable for public transport ticketing, secure campus access, and micro-payment systems requiring stable component supply, long-term lifecycle support, and certified security compliance.
Supply support for MF3DH2200DA4/01 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, IoT, and identification markets, with headquarters in Eindhoven, Netherlands.
The MIFARE DESFire product line delivers certified, standards-compliant contactless ICs for secure multi-application credentialing-designed specifically for smart cities, transit authorities, and financial service providers requiring EAL5+ assurance and NFC interoperability.
FAQ
What is the primary security certification level of the MF3DH2200DA4/01?
The MF3DH2200DA4/01 holds Common Criteria EAL5+ certification for both hardware and software, matching the assurance level required for banking cards and electronic passports. This certification validates its resistance to physical, side-channel, and logical attacks-making MF3DH2200DA4/01 suitable for high-trust applications like national ID and fare collection where cryptographic integrity is non-negotiable.
How does the 70 pF input capacitance of MF3DH2200DA4/01 benefit card design?
The 70 pF input capacitance of MF3DH2200DA4/01 enables reliable RF coupling in compact, low-profile smart cards-especially those with small or constrained antenna geometries. It reduces sensitivity to antenna detuning caused by nearby materials (e.g., metal layers or battery compartments), allowing MF3DH2200DA4/01 to maintain consistent read range and reliability in thin-form-factor wearables or hybrid cards where traditional 17 pF devices would suffer performance degradation.
Does MF3DH2200DA4/01 support ISO/IEC 7816-4 commands?
Yes, MF3DH2200DA4/01 fully supports ISO/IEC 7816-4 APDU structure and file system commands-including SELECT FILE (INS A4), READ BINARY (B0), UPDATE BINARY (D6), READ RECORDS (B2), APPEND RECORD (E2), GET CHALLENGE (84), INTERNAL AUTHENTICATE (88), and EXTERNAL AUTHENTICATE (82). This ensures MF3DH2200DA4/01 interoperability with existing NFC infrastructure and simplifies integration into systems already built around smart card standards.
Can MF3DH2200DA4/01 operate in backward-compatible mode with older MIFARE DESFire systems?
Yes, MF3DH2200DA4/01 powers up in default backward-compatible mode with MIFARE DESFire EV1 and D40 (MF3ICD40), supporting legacy command sets and cryptographic protocols like D40 Native and EV1 Secure Messaging. All new EV2 features-including Transaction MAC and MIsmartApp-require explicit activation via dedicated commands, allowing MF3DH2200DA4/01 to coexist seamlessly in mixed-generation infrastructures without reader firmware changes.
What file types are supported by MF3DH2200DA4/01, and how do they differ in use?
MF3DH2200DA4/01 supports six file types: Standard Data (static configuration), Backup Data (redundant storage), Value (atomic balance operations), Linear Record (append-only logs), Cyclic Record (ring-buffer event history), and Transaction MAC (cryptographic proof of transaction integrity). Each file type enforces specific access rules and anti-tear behavior-enabling MF3DH2200DA4/01 to reliably host diverse services like fare calculation (Value), audit trails (Linear Record), and backend reconciliation (Transaction MAC) on a single chip.
MF3DH2200DA4/00J Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- MOA4, Smart Card Module
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Type:
- RFID Reader
- Frequency:
- 13.56MHz
- Standards:
- ISO 14443
- Interface:
- -
- Voltage - Supply:
- -
- Operating Temperature:
- -25°C ~ 70°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PLLMC
MF3DH2200DA4/00J FAQ
1.How can I place an order for MF3DH2200DA4/00J through Aetrix?
Please submit a Request for Quotation (RFQ) for MF3DH2200DA4/00J on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MF3DH2200DA4/00J reliable?
The price and inventory of MF3DH2200DA4/00J are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MF3DH2200DA4/00J is usually 5 days.
3.What payment methods are accepted for MF3DH2200DA4/00J?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MF3DH2200DA4/00J transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MF3DH2200DA4/00J?
MF3DH2200DA4/00J orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MF3DH2200DA4/00J order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MF3DH2200DA4/00J?
For technical support, including MF3DH2200DA4/00J datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MF3DH2200DA4/00J requirements.
6.How does Aetrix verify that MF3DH2200DA4/00J is sourced from the original manufacturer or authorized distributors?
All MF3DH2200DA4/00J products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MF3DH2200DA4/00J meets industry standards.
7.What is the process for return or replacement of MF3DH2200DA4/00J?
All MF3DH2200DA4/00J units undergo pre-shipment inspection (PSI). If there is an issue with MF3DH2200DA4/00J, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MF3DH2200DA4/00J part is unused and in its original packaging.
Return procedure for MF3DH2200DA4/00J:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MF3DH2200DA4/00J Tags
-
SL2S2602FTBX
NXP Semiconductors
-
ST25DV04K-IER6S3
STMicroelectronics
-
ST25DV04K-IER6C3
STMicroelectronics
-
LXMSJZNCMD-217
Murata Electronics
-
NT3H2111W0FTTJ
NXP Semiconductors
-
NT3H2111W0FHKH
NXP Semiconductors
-
M24LR04E-RMC6T/2
STMicroelectronics
-
ST25DV04KC-JF6D3
STMicroelectronics
-
ST25DV64KC-IE6S3
STMicroelectronics
-
ST25DV64K-IER6T3
STMicroelectronics
-
NT3H2211W0FTTJ
NXP Semiconductors
-
NT3H2211W0FHKH
NXP Semiconductors
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
