NXP Semiconductors MF3DH2200DA6/00J

Overview

MF3DH2200DA6/01 from NXP Semiconductors is a contactless multi-application IC compliant with ISO/IEC 14443A, featuring 2 KB EEPROM, 70 pF input capacitance, Common Criteria EAL5+ security certification, and support for AES-128 and 3DES cryptographic engines. It serves as the secure core in smart city mobility cards combining transit, access, and micro-payment functions.

For engineers reviewing the MF3DH2200DA6/01 datasheet, MF3DH2200DA6/01 pinout, MF3DH2200DA6/01 application, or MF3DH2200DA6/01 equivalent, key selection considerations include its 70 pF high-input-capacitance variant optimized for compact antenna designs, EV2-specific Transaction MAC capability, MIsmartApp delegated management, and backward compatibility with MIFARE DESFire EV1 and D40 systems.

Technical Context

The MF3DH2200DA6/01 implements a dual-layer security architecture: mutual three-pass authentication at PICC and application levels, with hardware-accelerated AES-128 and 3DES engines supporting key versioning and diversified key derivation. Its file system enables up to 32 files per application across unlimited applications, with six file types including Transaction MAC and automatic anti-tear protection.

It operates at 13.56 MHz with configurable ATS (supporting up to 128-byte frames for 2/4/8 KB variants), supports data rates up to 848 kbit/s, and integrates Proximity Check and Originality Check sensors to counter relay attacks and verify genuine NXP silicon - all within a MOB6 plastic leadless module carrier package (SOT500-3).

Key Specifications

Pinout & Package

MF3DH2200DA6/01 is housed in a MOB6 plastic leadless module carrier package (SOT500-3), designed for embedding into laminated smart cards or contactless modules. The device has no external pins - it interfaces solely via an integrated coil antenna using inductive coupling at 13.56 MHz.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar contactless multi-application IC applications.

Compared with MF3D2200DA6/01, the MF3DH2200DA6/01's 70 pF capacitance enables robust operation in ultra-thin cards and wearables; compared with MF3DH4200DA6/01, its 2 KB memory reduces cost and power consumption where application complexity is bounded - making it optimal for mid-tier smart city credential programs.

Availability

MF3DH2200DA6/01 is available at Aetrix Electronics and suitable for public transport ticketing, secure campus access, and micro-payment systems requiring stable component supply, long-term lifecycle support, and certified security compliance.

Supply support for MF3DH2200DA6/01 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and identification markets.

The MIFARE DESFire EV2 product line delivers EAL5+-certified, standards-compliant contactless ICs engineered for high-assurance multi-application environments such as smart cities, transit, and digital identity.

FAQ

What security certifications does MF3DH2200DA6/01 hold?

MF3DH2200DA6/01 is certified to Common Criteria EAL5+ for both hardware and software - the same assurance level required for banking cards and electronic passports. This covers its cryptographic engines (AES-128, 3DES), mutual authentication protocol, secure messaging (EV2), and anti-tampering sensors including Proximity Check and Originality Check. Certification applies to the full MF3D(H)x2 family, including MF3DH2200DA6/01.

How does the 70 pF input capacitance of MF3DH2200DA6/01 affect antenna design?

The 70 pF input capacitance of MF3DH2200DA6/01 lowers the resonant frequency of small or low-inductance antennas, enabling reliable operation in compact formats like slim ID cards, wristbands, or embedded modules where traditional 17 pF variants fail. It requires antenna tuning to match the higher capacitive load - typically achieved by reducing loop inductance or adjusting matching network components. MF3DH2200DA6/01 maintains full ISO/IEC 14443A compliance at all supported data rates.

Is MF3DH2200DA6/01 compatible with existing MIFARE DESFire EV1 infrastructure?

Yes - MF3DH2200DA6/01 operates in backward-compatible mode with MIFARE DESFire EV1 and D40 systems out-of-the-box. It supports all legacy commands, file structures, and secure messaging protocols (D40 Native, EV1). New EV2 features like Transaction MAC and MIsmartApp require explicit activation via configuration commands but do not disrupt existing deployments. MF3DH2200DA6/01 retains the same command set and APDU wrapper support as earlier generations.

What file types does MF3DH2200DA6/01 support, and how many files per application?

MF3DH2200DA6/01 supports six file types: Standard Data, Backup Data, Value, Linear Record, Cyclic Record, and Transaction MAC - all usable within a single application. Each application can contain up to 32 files, and the total number of applications is limited only by available EEPROM (2 KB). File sizes are defined at creation time (except Transaction MAC), and automatic anti-tear protection applies to all backup-capable file types. This structure is implemented identically across the MF3D(H)x2 family, including MF3DH2200DA6/01.

Does MF3DH2200DA6/01 support ISO/IEC 7816-4 commands?

Yes - MF3DH2200DA6/01 fully supports ISO/IEC 7816-4 APDU commands including SELECT FILE (INS A4), READ BINARY (B0), UPDATE BINARY (D6), READ RECORDS (B2), APPEND RECORD (E2), GET CHALLENGE (84), INTERNAL AUTHENTICATE (88), and EXTERNAL AUTHENTICATE (82). It also supports ISO/IEC 7816-4 file structure navigation by File ID or DF name. This APDU compatibility is standardized across all MIFARE DESFire EV2 devices, including MF3DH2200DA6/01.