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NXP Semiconductors MF3DH2201DUD/00V
- Part No.:
- MF3DH2201DUD/00V
- Manufacturer:
- NXP Semiconductors
- Category:
- RFID, RF Access, Monitoring ICs
- Package:
- Die
- Datasheet:
-
MF3DH2201DUD/00V.pdf
- Description:
- IC RFID READER 13.56MHZ DIE
- Quantity:
- Payment:
- Shipping:
Inventory:1,769
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Product details
Overview
MF3DH2201DUD/00V from NXP Semiconductors is a contactless multi-application IC compliant with ISO/IEC 14443A, featuring 2 KB EEPROM, 70 pF input capacitance, Common Criteria EAL5+ security certification, and support for AES-128 and 3DES cryptographic engines. It enables secure public transport ticketing, micro-payment, and access management in smart city cards.
For engineers reviewing the MF3DH2201DUD/00V datasheet, MF3DH2201DUD/00V pinout, MF3DH2201DUD/00V application, or MF3DH2201DUD/00V equivalent, key selection considerations include its 70 pF high-input-capacitance variant optimized for small-form-factor designs, EV2-specific Transaction MAC and MIsmartApp features, backward compatibility with DESFire EV1/D40, and ISO/IEC 7816-4 APDU interoperability with NFC readers.
Technical Context
The MF3DH2201DUD/00V implements a dedicated contactless RF interface compliant with ISO/IEC 14443-2/3A and -4, supporting data rates up to 848 kbit/s and configurable frame size (FSCI) up to 128 bytes. Its on-chip cryptographic engine executes hardware-accelerated AES-128, 3TDEA, and single DES operations with key versioning and mutual three-pass authentication.
It features a flexible file system supporting unlimited applications, up to 32 files per application across six file types-including Transaction MAC-and includes Proximity Check and Originality Check sensors to counter relay attacks and verify genuine NXP silicon. The device uses an integrated voltage regulator, TRNG, and active shielding with rail/light/glitch sensors for tamper resistance.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory capacity | 2 KB EEPROM with 25-year data retention and 500,000 write cycles - sufficient for multi-service transit, loyalty, and access credentials without memory exhaustion in field-deployed cards. |
| Input capacitance | 70 pF (typical) - enables reliable RF coupling in compact antenna designs such as thin smart cards, wearables, or embedded modules where low-profile form factor is critical. |
| Cryptographic support | AES-128 and 3TDEA hardware engines with key versioning - provides FIPS-aligned confidentiality and integrity for secure messaging, transaction signing, and diversified key derivation. |
| Security certification | Common Criteria EAL5+ (HW & SW) - validated assurance level matching banking cards and e-passports, enabling deployment in regulated environments requiring high-assurance credentialing. |
| RF interface | ISO/IEC 14443A compliant, 13.56 MHz, up to 848 kbit/s - ensures interoperability with global NFC infrastructure including mobile phones, turnstiles, and point-of-sale terminals. |
| File system | Unlimited applications, 32 files/application, 6 file types including Transaction MAC - supports complex multi-tenant service models (e.g., transport + parking + loyalty) with atomic transaction integrity and cross-application file access. |
Pinout & Package
MF3DH2201DUD/00V is supplied in FFC (Film Frame Carrier) wafer format - 8-inch diameter, sawn die, 120 μm thickness - intended for embedding into contactless smart card laminates or inlays. No discrete pins or terminals are present; electrical interface is exclusively via on-die antenna pads (RF IN/OUT) and ground reference, designed for flip-chip or wire-bond integration into antenna substrates.
Key Features
| Feature | Design Value |
|---|---|
| Transaction MAC file type | Generates cryptographically signed transaction proofs on-card using secret keys - enables backend verification of transaction authenticity without exposing keys or requiring online validation during tap. |
| MIsmartApp (Delegated Application Management) | Allows third-party application owners to create, manage, and update applications under PICC-level delegation - supports scalable service ecosystems (e.g., city operators granting transit agencies independent app control). |
| Proximity Check | Detects relay attacks by measuring RF signal propagation delay - prevents unauthorized remote access to card functions, meeting EN 15118 and EMVCo proximity assurance requirements. |
| Originality Check | Hardware-verified signature confirms genuine NXP silicon - mitigates counterfeit risk in high-value deployments like national ID or tolling systems where supply chain integrity is mandated. |
| Virtual Card Architecture | Enables privacy-preserving card selection across multiple logical cards on one physical device - allows users to present only required credentials (e.g., student ID vs. staff access) without exposing full card content. |
Applications
| Public Transport Ticketing | Secure Access Control |
|---|---|
|
Use Scenario: Tap-to-enter metro gates and bus validators across multi-operator networks with fare capping and zone-based pricing. IC Role / Device Role / Timing Role: Contactless secure credential IC storing encrypted balance, trip history, and operator-specific keys; handles mutual authentication and encrypted session setup within <150 ms. Use Value: Enables seamless cross-agency travel using a single card while maintaining cryptographic separation between operators' applications and preventing balance cloning. |
Use Scenario: Employee badge granting tiered physical access to office floors, labs, and server rooms with time-based permissions. IC Role / Device Role / Timing Role: Multi-application secure identity token hosting separate access profiles per department; enforces role-based file access rights and logs entry attempts in cyclic record files. Use Value: Eliminates need for multiple badges; supports dynamic permission updates over-the-air and audit-ready tamper-proof logging without external database dependency. |
| Micro-Payment & Loyalty | Smart City Mobility Card |
|
Use Scenario: Tap-to-pay at vending machines, cafés, and parking meters with offline balance deduction and merchant-specific loyalty points accrual. IC Role / Device Role / Timing Role: Secure value file IC executing offline debit/credit operations with automatic anti-tear backup; stores encrypted merchant keys and transaction counters per vendor. Use Value: Supports fully offline transactions in low-connectivity zones while guaranteeing balance consistency and preventing double-spending via hardware-enforced atomic updates. |
Use Scenario: Unified citizen card integrating bike-sharing rental, museum entry, library borrowing, and municipal service payments in one device. IC Role / Device Role / Timing Role: Multi-application platform IC hosting isolated apps with shared keys and cross-app file access enabled - e.g., validating bike rental duration against transport trip history. Use Value: Reduces citizen credential fragmentation; allows coordinated service bundling (e.g., "transport + culture" discount packages) with centralized lifecycle management. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar contactless secure IC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MF3D2201DUD/01 | Same 2 KB EEPROM and FFC package but 17 pF input capacitance - requires larger antenna area for reliable coupling. | Optimized for standard-size smart cards rather than ultra-thin or wearable formats. | Select when antenna geometry permits lower capacitance and legacy reader compatibility is prioritized over miniaturization. |
| MF3DH4201DUD/01 | 4 KB EEPROM, same 70 pF input capacitance - doubles non-volatile storage for extended credential lifespans or additional service apps. | Suitable for deployments requiring >2 applications with large file sets (e.g., national ID with biometric templates + health records + e-signature). | Choose when future service expansion or longer credential validity (>5 years) demands headroom beyond 2 KB baseline. |
Compared with MF3DH2201DUD/00V, MF3D2201DUD/01 trades miniaturization capability for broader antenna design tolerance, while MF3DH4201DUD/01 extends functional longevity and service density at marginally higher cost and identical mechanical integration footprint.
Availability
MF3DH2201DUD/00V is available at Aetrix Electronics and suitable for secure public transport ticketing, micro-payment systems, and smart city mobility cards requiring stable component supply, long-term lifecycle support, and certified cryptographic assurance.
Supply support for MF3DH2201DUD/00V includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and identification markets, with headquarters in Eindhoven, Netherlands.
The MIFARE DESFire EV2 product line - including MF3DH2201DUD/00V - was engineered to deliver EAL5+-certified, multi-application contactless ICs for high-assurance credentialing in transit, access, and payment infrastructures.
FAQ
What is the primary security certification level of MF3DH2201DUD/00V?
MF3DH2201DUD/00V holds Common Criteria EAL5+ certification for both hardware and software, matching the assurance level required for banking cards and electronic passports. This certification validates its resistance to side-channel, fault injection, and logical attacks - a requirement for MF3DH2201DUD/00V deployment in regulated financial and government identity systems.
How does the 70 pF input capacitance of MF3DH2201DUD/00V impact antenna design?
The 70 pF input capacitance of MF3DH2201DUD/00V enables robust RF coupling with smaller, lower-inductance antennas - essential for ultra-thin cards (<0.8 mm), wearables, or embedded inlays where space is constrained. Unlike standard 17 pF variants, MF3DH2201DUD/00V reduces required antenna loop area by ~40%, simplifying mechanical integration without sacrificing read range.
Is MF3DH2201DUD/00V compatible with existing MIFARE DESFire EV1 infrastructure?
Yes, MF3DH2201DUD/00V operates in backward-compatible mode with MIFARE DESFire EV1 and D40 upon power-up. It supports legacy commands, 2TDEA/3TDEA cryptography, and ISO/IEC 7816-4 APDUs without modification. Full EV2 features - including Transaction MAC and MIsmartApp - require explicit activation via new commands, ensuring seamless migration for MF3DH2201DUD/00V integration into legacy systems.
What file types does MF3DH2201DUD/00V support, and how do they differ functionally?
MF3DH2201DUD/00V supports six file types: Standard Data, Backup Data, Value, Linear Record, Cyclic Record, and Transaction MAC. Each serves distinct use cases - e.g., Value files enforce atomic increment/decrement with anti-tear, Cyclic Record files auto-rotate log entries, and Transaction MAC files generate on-card cryptographic proofs. All except Transaction MAC allow user-defined size at creation, enabling precise memory allocation per MF3DH2201DUD/00V application.
Does MF3DH2201DUD/00V include hardware-based anti-tampering features?
Yes, MF3DH2201DUD/00V integrates multiple hardware sensors: voltage, temperature, light, glitch, and rail sensors - all feeding into an active shielding system that suspends operation upon anomaly detection. Combined with TRNG, secure boot, and exception handling, these features ensure MF3DH2201DUD/00V meets CC EAL5+ physical attack resistance requirements and prevent unauthorized memory extraction or firmware manipulation.
MF3DH2201DUD/00V Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- Die
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Type:
- RFID Reader
- Frequency:
- 13.56MHz
- Standards:
- ISO 14443
- Interface:
- -
- Voltage - Supply:
- -
- Operating Temperature:
- -25°C ~ 75°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- Die
MF3DH2201DUD/00V FAQ
1.How can I place an order for MF3DH2201DUD/00V through Aetrix?
Please submit a Request for Quotation (RFQ) for MF3DH2201DUD/00V on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MF3DH2201DUD/00V reliable?
The price and inventory of MF3DH2201DUD/00V are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MF3DH2201DUD/00V is usually 5 days.
3.What payment methods are accepted for MF3DH2201DUD/00V?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MF3DH2201DUD/00V transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MF3DH2201DUD/00V?
MF3DH2201DUD/00V orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MF3DH2201DUD/00V order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MF3DH2201DUD/00V?
For technical support, including MF3DH2201DUD/00V datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MF3DH2201DUD/00V requirements.
6.How does Aetrix verify that MF3DH2201DUD/00V is sourced from the original manufacturer or authorized distributors?
All MF3DH2201DUD/00V products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MF3DH2201DUD/00V meets industry standards.
7.What is the process for return or replacement of MF3DH2201DUD/00V?
All MF3DH2201DUD/00V units undergo pre-shipment inspection (PSI). If there is an issue with MF3DH2201DUD/00V, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MF3DH2201DUD/00V part is unused and in its original packaging.
Return procedure for MF3DH2201DUD/00V:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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