NXP Semiconductors MF3DH2201DUF/00V
- Part No.:
- MF3DH2201DUF/00V
- Manufacturer:
- NXP Semiconductors
- Category:
- RFID, RF Access, Monitoring ICs
- Package:
- Die
- Datasheet:
-
MF3DH2201DUF/00V.pdf
- Description:
- IC RFID READER 13.56MHZ DIE
- Quantity:
- Payment:

- Shipping:

Inventory:4,169
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Product details
Overview
MF3DH2201DUF/00V from NXP Semiconductors is a contactless multi-application IC compliant with ISO/IEC 14443A, featuring 2 KB EEPROM, 70 pF input capacitance, Common Criteria EAL5+ security certification, and support for AES-128 and 3DES cryptographic engines. It serves as the secure core of smart city mobility cards, enabling unified public transport, e-payment, and access control on a single credential.
For engineers reviewing the MF3DH2201DUF/00V datasheet, MF3DH2201DUF/00V pinout, MF3DH2201DUF/00V application, or MF3DH2201DUF/00V equivalent, key selection considerations include its high-input-capacitance (70 pF) wafer form factor for thin card designs, EV2-specific Transaction MAC and MIsmartApp delegation features, and backward compatibility with MIFARE DESFire EV1 and D40 systems.
Technical Context
The MF3DH2201DUF/00V implements a dedicated ISO/IEC 14443-4 RF interface with configurable FSCI supporting up to 128-byte frame size (256 bytes for larger memory variants), operates at 13.56 MHz, and integrates hardware-accelerated AES-128 and triple-DES cryptographic engines with key versioning. Its on-chip TRNG, voltage/rail/light/glitch sensors, and active shielding enforce tamper resistance.
It uses a flexible file system with no limit on application count, up to 32 files per application across six file types-including Transaction MAC-and enforces mutual three-pass authentication with optional Random ID for privacy. The chip supports both native DESFire commands and ISO/IEC 7816-4 APDU wrappers for interoperability with standard NFC readers.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Size | 2 KB EEPROM with 25-year data retention and 500,000 write cycles - sufficient for multi-service credential storage without premature wear-out. |
| Input Capacitance | 70 pF (typical) - enables reliable RF coupling in ultra-thin card or wearable form factors where antenna geometry limits inductive coupling. |
| Cryptographic Engine | Hardware AES-128 and 3DES (56/112/168-bit keys) with key versioning - provides FIPS 140-2 Level 3–equivalent cryptographic agility and key lifecycle management. |
| Security Certification | Common Criteria EAL5+ (HW & SW) - validated assurance level matching banking cards and e-passports, not just EAL4+. |
| RF Data Rate | Up to 848 kbit/s - enables fast transaction throughput for high-traffic transit gates and point-of-sale terminals. |
| File System | Unlimited applications, 32 files/app, 6 file types including Transaction MAC - supports complex multi-tenant service architectures with atomic cross-application transactions. |
| UID | 7-byte fixed UID + optional Random ID - ensures device uniqueness while enabling privacy-preserving authentication flows. |
Pinout & Package
MF3DH2201DUF/00V is supplied in FFC (Film Frame Carrier) wafer format: 8-inch diameter, sawn, 75 μm thickness. No discrete pins or terminals - it is a bare die intended for embedding into contactless smart cards or inlays via flip-chip or wire bonding. Electrical interface is exclusively contactless (ISO/IEC 14443A RF coil coupling).
Key Features
| Feature | Design Value |
|---|---|
| Transaction MAC file type | Generates cryptographically signed transaction proofs on-card for backend verification - eliminates need for trusted channel replay protection in micro-payment and loyalty use cases. |
| MIsmartApp delegation | Enables third-party application creation and management without PICC master key exposure - supports open ecosystem models for Smart City service providers. |
| Proximity Check | Detects relay attacks by measuring RF signal propagation delay - prevents unauthorized remote access to credentials in transit or at rest. |
| Originality Check | Verifies genuine NXP silicon via on-die signature - blocks counterfeit ICs in high-security deployments like national ID or government access systems. |
| Virtual Card Architecture | Allows multiple logical cards on one physical device with selective, privacy-preserving card selection - essential for citizen services requiring data segregation across departments. |
Applications
| Public Transport Ticketing | Secure Campus Access |
|---|---|
Use Scenario: Tap-to-enter metro gates and bus validators across multi-operator networks with fare capping and zone-based pricing. IC Role / Device Role / Timing Role: Secure credential storage and real-time transaction signing via Transaction MAC file - acts as trusted execution environment for fare calculation and balance updates. Use Value: Enables offline balance validation and atomic top-up/tap transactions without network dependency, leveraging 2 KB memory and 848 kbit/s RF speed. | Use Scenario: Single-card access to dormitories, labs, libraries, and cafeteria across university campuses with role-based permissions. IC Role / Device Role / Timing Role: Multi-application container hosting separate access profiles, meal plan balances, and digital ID - enforced by per-application AES keys and mutual authentication. Use Value: Eliminates need for multiple physical cards; 70 pF input capacitance ensures reliable read in thin student ID cards with constrained antenna area. |
| Citywide Loyalty Program | Municipal e-Payment |
Use Scenario: Unified loyalty points accrual and redemption across municipal services: parking, bike sharing, museum entry, and local vendor discounts. IC Role / Device Role / Timing Role: Secure value file storage with automatic anti-tear backup - guarantees consistent point balances during concurrent multi-service transactions. Use Value: Supports shared application management so city agencies and merchants jointly manage loyalty rules without exposing master keys. | Use Scenario: Contactless micro-payments for street parking meters, public toilets, and vending machines using closed-loop e-wallet. IC Role / Device Role / Timing Role: Hardware-encrypted value file with CMAC integrity protection - prevents balance tampering and ensures transaction non-repudiation. Use Value: EAL5+ certification satisfies municipal financial compliance requirements; 2 KB memory accommodates full wallet history and merchant whitelists. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar contactless multi-application IC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MF3D2201DUF/01 | Same 2 KB memory and 75 μm wafer, but 17 pF input capacitance - lower coupling efficiency in compact antennas. | Suitable for standard-thickness cards with larger antenna loops; less optimal for wearables or slim transit cards. | Select when antenna design provides strong field coupling and cost sensitivity outweighs thin-form-factor advantage. |
| MF3DH4201DUF/01 | 4 KB EEPROM and identical 70 pF input capacitance - doubles user data capacity while retaining same mechanical footprint. | Required for deployments needing extended service portfolios (e.g., adding health records or digital vaccination certificates). | Choose when future scalability beyond 2 KB is mandated, with no change to card thickness or antenna layout. |
Compared with MF3DH2201DUF/00V, MF3D2201DUF/01 trades thin-card compatibility for lower RF sensitivity, while MF3DH4201DUF/01 extends memory headroom without altering mechanical integration - making the latter ideal for phased feature rollouts in Smart City infrastructure.
Availability
MF3DH2201DUF/00V is available at Aetrix Electronics and suitable for secure public transport ticketing, municipal e-payment systems, and multi-tenant campus access requiring stable component supply across long-life infrastructure programs.
Supply support for MF3DH2201DUF/00V includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and identification markets, with headquarters in Eindhoven, Netherlands.
The MF3DH2201DUF/00V belongs to the MIFARE DESFire EV2 product line - engineered specifically for high-assurance, multi-application contactless credential systems in Smart Cities, transit, and government ID programs.
FAQ
What is the primary security certification level of the MF3DH2201DUF/00V?
The MF3DH2201DUF/00V holds Common Criteria EAL5+ certification for both hardware and software - the highest publicly available assurance level for smart card ICs, matching that required for banking cards and electronic passports. This certification validates its resistance to side-channel, fault injection, and logical attacks, and confirms that all security-critical firmware and hardware logic have undergone rigorous independent evaluation. MF3DH2201DUF/00V achieves this through on-die sensors, active shielding, and hardware-accelerated crypto engines.
Does the MF3DH2201DUF/00V support ISO/IEC 7816-4 commands?
Yes, the MF3DH2201DUF/00V fully supports ISO/IEC 7816-4 APDU structure and file system semantics, including SELECT FILE (INS A4), READ BINARY (B0), UPDATE BINARY (D6), READ RECORDS (B2), APPEND RECORD (E2), GET CHALLENGE (84), INTERNAL AUTHENTICATE (88), and EXTERNAL AUTHENTICATE (82). It also supports ISO/IEC 7816-4 APDU wrappers for native DESFire commands, enabling seamless integration with existing PKI-based middleware and Java Card platforms without protocol translation layers.
How does the 70 pF input capacitance of the MF3DH2201DUF/00V affect system design?
The 70 pF input capacitance of the MF3DH2201DUF/00V is optimized for small-form-factor antennas with limited loop area - such as those in slim transit cards, wearables, or embedded inlays - where standard 17 pF devices suffer from insufficient coupling. This higher capacitance lowers the resonant impedance mismatch, improving power harvesting efficiency at 13.56 MHz and extending reliable read range in mechanically constrained designs. Antenna tuning must account for this value to avoid detuning or reduced field strength.
Can the MF3DH2201DUF/00V operate in backward-compatible mode with legacy MIFARE DESFire EV1 systems?
Yes, the MF3DH2201DUF/00V ships in default delivery configuration as a drop-in replacement for MIFARE DESFire EV1, supporting all EV1 commands, file structures, and cryptographic modes (2TDEA, 3TDEA, AES). New EV2 features - including Transaction MAC, MIsmartApp, and Proximity Check - require explicit activation via dedicated commands and do not interfere with existing EV1 infrastructure. This allows phased migration without reader or middleware changes.
What file types are supported by the MF3DH2201DUF/00V, and how does the Transaction MAC file enhance security?
The MF3DH2201DUF/00V supports six file types: Standard Data, Backup Data, Value, Linear Record, Cyclic Record, and Transaction MAC. The Transaction MAC file generates an 8-byte CMAC over transaction data using a secret application key stored securely on the IC - producing a cryptographically binding proof that the transaction occurred on a genuine MF3DH2201DUF/00V. This prevents replay, modification, or forgery of transaction logs in backend reconciliation, especially critical for fare collection and micro-payment audit trails.
MF3DH2201DUF/00V Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- Die
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Type:
- RFID Reader
- Frequency:
- 13.56MHz
- Standards:
- ISO 14443
- Interface:
- -
- Voltage - Supply:
- -
- Operating Temperature:
- -25°C ~ 75°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- Die
MF3DH2201DUF/00V FAQ
1.How can I place an order for MF3DH2201DUF/00V through Aetrix?
Please submit a Request for Quotation (RFQ) for MF3DH2201DUF/00V on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MF3DH2201DUF/00V reliable?
The price and inventory of MF3DH2201DUF/00V are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MF3DH2201DUF/00V is usually 5 days.
3.What payment methods are accepted for MF3DH2201DUF/00V?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MF3DH2201DUF/00V transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MF3DH2201DUF/00V?
MF3DH2201DUF/00V orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MF3DH2201DUF/00V order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MF3DH2201DUF/00V?
For technical support, including MF3DH2201DUF/00V datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MF3DH2201DUF/00V requirements.
6.How does Aetrix verify that MF3DH2201DUF/00V is sourced from the original manufacturer or authorized distributors?
All MF3DH2201DUF/00V products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MF3DH2201DUF/00V meets industry standards.
7.What is the process for return or replacement of MF3DH2201DUF/00V?
All MF3DH2201DUF/00V units undergo pre-shipment inspection (PSI). If there is an issue with MF3DH2201DUF/00V, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MF3DH2201DUF/00V part is unused and in its original packaging.
Return procedure for MF3DH2201DUF/00V:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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