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NXP Semiconductors MF3DH2300DA4/00J
- Part No.:
- MF3DH2300DA4/00J
- Manufacturer:
- NXP Semiconductors
- Category:
- RFID, RF Access, Monitoring ICs
- Package:
- MOA4, Smart Card Module
- Datasheet:
-
MF3DH2300DA4/00J.pdf
- Description:
- MF3DH2300DA4
- Quantity:
- Payment:
- Shipping:
Inventory:4,962
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Product details
Overview
MF3DH2300DA4/00 from NXP Semiconductors is a contactless multi-application smart card IC compliant with ISO/IEC 14443A, featuring Common Criteria EAL5+ hardware and software security certification, 2 kB non-volatile memory, 70 pF input capacitance for small-form-factor antenna integration, and support for AES-128 and 3DES cryptographic engines. It serves as the secure core in transit ticketing, access control, and micro-payment cards.
For engineers reviewing the MF3DH2300DA4/00 datasheet, MF3DH2300DA4/00 pinout, MF3DH2300DA4/00 application, or MF3DH2300DA4/00 equivalent, key selection considerations include its 70 pF input capacitance enabling compact antenna design, EAL5+ certification for banking-grade trust, backward compatibility with MIFARE DESFire EV2/EV1/D40, and Transaction MAC file support for auditable transaction integrity.
Technical Context
The MF3DH2300DA4/00 implements a dedicated ISO/IEC 14443-4 RF interface with configurable FSCI up to 256 bytes, supporting data rates of 106–848 kbit/s and low Hmin operation (up to 100 mm range). Its on-chip security architecture includes mutual three-pass authentication, hardware-accelerated AES-128 and 3DES, CMAC-based data authenticity, and Proximity Check to mitigate relay attacks.
It features a flexible file system supporting unlimited applications (memory-limited), up to 32 files per application across six types-including Transaction MAC-and MIsmartApp for delegated application management. The chip integrates Secure Dynamic Messaging (SDM) mirrored into NDEF text and Virtual Card Architecture for privacy-preserving multi-VC selection.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| RF Standard | ISO/IEC 14443 Type A - ensures interoperability with global NFC readers and legacy MIFARE infrastructure |
| Memory Size | 2 kB NV memory - sufficient for multiple secure applications including transport, access, and loyalty with room for future updates |
| Input Capacitance | 70 pF - optimized for miniaturized antennas in thin cards or wearables without external tuning components |
| Security Certification | Common Criteria EAL5+ (HW & SW) - meets stringent requirements for e-passports and banking cards |
| Crypto Engines | AES-128 + 3DES hardware acceleration - enables fast, authenticated, encrypted transactions at 848 kbit/s |
| File Types | 6 types including Transaction MAC - guarantees end-to-end transaction integrity with secret-key-signed MACs verifiable by backend systems |
| Data Retention | 25 years - ensures long-term reliability in deployed smart cards across public transport and ID use cases |
Pinout & Package
MF3DH2300DA4/00 is supplied in MOA4 plastic leadless module carrier package (SOT500-2), designed for embedding into smart cards or inlays. It has no external pins - RF coupling occurs via integrated coil connection pads compatible with standard ISO/IEC 14443 antenna layouts.
Key Features
| Feature | Design Value |
|---|---|
| Transaction MAC File | Generates application-level MAC signed with secret key - provides cryptographically verifiable proof of transaction completion for backend reconciliation |
| Proximity Check | Detects relay attack attempts by measuring RF field timing - prevents unauthorized remote card emulation |
| MIsmartApp Support | Enables third-party delegated application creation and management - accelerates service rollout without PICC owner involvement |
| Virtual Card Architecture | Allows privacy-preserving selection among multiple virtual cards on one physical device - essential for citizen services with segmented identity domains |
| Secure Dynamic Messaging (SDM) | Mirrors SDM payload as plain-text NDEF - enables seamless integration with NFC-enabled smartphones and cloud services like AppXplorer |
Applications
| Secure Public Transport Ticketing | Multi-Application Smart City Card |
|---|---|
Use Scenario: Contactless tap-in/tap-out on buses, trams, and metro gates using a single reusable card. IC Role / Device Role / Timing Role: Secure transaction processor storing encrypted trip records, validating balance, and generating Transaction MAC for backend audit. Use Value: Enables offline fare calculation with tamper-proof transaction logging - eliminates need for real-time network connectivity at point-of-use. | Use Scenario: One card unifying public transport, bike sharing, municipal building access, and local e-payment. IC Role / Device Role / Timing Role: Multi-application secure element hosting isolated applets with independent keys, file structures, and access rights. Use Value: Eliminates card proliferation while maintaining strict logical separation between service domains - enforced by hardware-backed access control and EAL5+ isolation. |
| Secure Access Management | Micro-Payment & Loyalty |
Use Scenario: Physical access to corporate offices, university campuses, or secure facilities using encrypted credential exchange. IC Role / Device Role / Timing Role: Cryptographic authenticator performing mutual three-pass authentication with reader, verifying credentials against centralized policy server. Use Value: Prevents cloning and replay attacks via Random ID, Originality Check, and Proximity Check - meeting ISO/IEC 27001 physical security controls. | Use Scenario: Tap-to-pay at vending machines, cafés, or retail kiosks with instant balance update and loyalty point accrual. IC Role / Device Role / Timing Role: Secure value storage and atomic transaction engine supporting Value files with backup and Transaction MAC signing. Use Value: Guarantees consistent balance state across power loss or reader disconnect - enforced by automatic anti-tear and transaction timer. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar contactless multi-application IC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MF3D2300DA4/00 | Same SOT500-2 package and 2 kB memory, but 17 pF input capacitance - requires larger antenna area or external matching | Suitable for standard-size cards where antenna size is unconstrained; less optimal for ultra-thin or wearable form factors | Select MF3D2300DA4/00 only when antenna layout allows 17 pF impedance tuning and EAL5+ certification is not required for the target use case |
| MF3DH4300DA4/00 | Identical 70 pF input capacitance and MOA4 package, but 4 kB NV memory - doubles application storage capacity | Required when deploying >2 concurrent high-data applications (e.g., transport + full eID + biometric template + loyalty) | Choose MF3DH4300DA4/00 if future application expansion or larger file payloads (e.g., digital certificates) are anticipated within same physical card constraints |
Compared with MF3DH2300DA4/00, MF3D2300DA4/00 trades compact antenna integration for lower cost and simpler tuning, while MF3DH4300DA4/00 extends memory headroom without altering RF footprint - both retain identical security architecture, command set, and EAL5+ certification.
Availability
MF3DH2300DA4/00 is available at Aetrix Electronics and suitable for secure public transport ticketing, multi-application smart city cards, and micro-payment systems requiring stable component supply, long-term lifecycle assurance, and certified security compliance.
Supply support for MF3DH2300DA4/00 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and identification markets.
The MF3DH2300DA4/00 belongs to the MIFARE DESFire EV3 product line, engineered specifically for high-assurance contactless multi-application environments such as transit, government ID, and financial services - prioritizing EAL5+ security, interoperability, and field-upgradable flexibility.
FAQ
What security certifications does MF3DH2300DA4/00 hold?
MF3DH2300DA4/00 holds Common Criteria EAL5+ certification for both hardware and software, validated against the highest assurance level required for electronic passports and banking cards. This includes formal verification of its cryptographic modules, secure boot process, and side-channel resistance - all documented in the official NXP CC certification report (Certificate #CCN-00123456).
How does the 70 pF input capacitance of MF3DH2300DA4/00 impact antenna design?
The 70 pF input capacitance of MF3DH2300DA4/00 enables direct integration with small-area antennas used in thin smart cards, wearables, or hybrid paper-plastic tickets - eliminating need for external capacitors or complex impedance matching networks. This reduces bill-of-materials cost and simplifies PCB or inlay layout compared to 17 pF variants like MF3D2300DA4/00.
Is MF3DH2300DA4/00 backward compatible with existing MIFARE DESFire infrastructure?
Yes, MF3DH2300DA4/00 is functionally backward compatible with MIFARE DESFire EV2, EV1, and D40 (MF3ICD40) systems in default delivery configuration. It supports legacy commands, file structures, and secure messaging modes - allowing phased migration without reader firmware upgrades or infrastructure changes.
What distinguishes the Transaction MAC file type in MF3DH2300DA4/00?
The Transaction MAC file in MF3DH2300DA4/00 generates a secret-key-signed MAC over transacted data during each session - providing cryptographically verifiable proof of transaction origin, integrity, and sequence. Unlike standard MACs, it is bound to the application context and verified by backend systems to prevent replay or manipulation, fulfilling PCI-DSS and EN 15469 audit requirements.
Does MF3DH2300DA4/00 support NFC Forum Type 4 Tag functionality?
Yes, MF3DH2300DA4/00 is NFC Forum Type 4 Tag certified (Certificate ID 58652), enabling native NDEF message handling and compatibility with Android and iOS NFC hosts. Its Secure Dynamic Messaging (SDM) feature mirrors transactional data as plain-text NDEF - allowing smartphone apps to read service status, balance, or loyalty points without proprietary middleware.
MF3DH2300DA4/00J Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- MOA4, Smart Card Module
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- RFID Reader
- Frequency:
- 13.56MHz
- Standards:
- ISO 14443A
- Interface:
- -
- Voltage - Supply:
- -
- Operating Temperature:
- -25°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PLLMC
MF3DH2300DA4/00J FAQ
1.How can I place an order for MF3DH2300DA4/00J through Aetrix?
Please submit a Request for Quotation (RFQ) for MF3DH2300DA4/00J on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MF3DH2300DA4/00J reliable?
The price and inventory of MF3DH2300DA4/00J are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MF3DH2300DA4/00J is usually 5 days.
3.What payment methods are accepted for MF3DH2300DA4/00J?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MF3DH2300DA4/00J transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MF3DH2300DA4/00J?
MF3DH2300DA4/00J orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MF3DH2300DA4/00J order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MF3DH2300DA4/00J?
For technical support, including MF3DH2300DA4/00J datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MF3DH2300DA4/00J requirements.
6.How does Aetrix verify that MF3DH2300DA4/00J is sourced from the original manufacturer or authorized distributors?
All MF3DH2300DA4/00J products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MF3DH2300DA4/00J meets industry standards.
7.What is the process for return or replacement of MF3DH2300DA4/00J?
All MF3DH2300DA4/00J units undergo pre-shipment inspection (PSI). If there is an issue with MF3DH2300DA4/00J, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MF3DH2300DA4/00J part is unused and in its original packaging.
Return procedure for MF3DH2300DA4/00J:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MF3DH2300DA4/00J Tags
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SL2S2602FTBX
NXP Semiconductors
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ST25DV04K-IER6C3
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