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NXP Semiconductors MF3DH2300DA8/00J
- Part No.:
- MF3DH2300DA8/00J
- Manufacturer:
- NXP Semiconductors
- Category:
- RFID, RF Access, Monitoring ICs
- Package:
- MOA8, Smart Card Module
- Datasheet:
-
MF3DH2300DA8/00J.pdf
- Description:
- MF3DH2300DA8
- Quantity:
- Payment:
- Shipping:
Inventory:4,416
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Product details
Overview
MF3DH2300DA8/00 from NXP Semiconductors is a MIFARE DESFire EV3 contactless multi-application IC with Common Criteria EAL5+ hardware and software security certification, 2 kB non-volatile memory, 70 pF input capacitance, ISO/IEC 14443A compliance, and support for AES-128 and 3DES cryptographic engines. It enables secure public transport ticketing, micro-payment, and smart city mobility cards requiring high-integrity transaction handling.
For engineers reviewing the MF3DH2300DA8/00 datasheet, MF3DH2300DA8/00 pinout, MF3DH2300DA8/00 application, or MF3DH2300DA8/00 equivalent, key selection criteria include EAL5+ certification level, 70 pF input capacitance for small-form-factor antenna design, Transaction MAC file support, backward compatibility with DESFire EV2/EV1, and Secure Dynamic Messaging (SDM) for NFC Forum Type 4 Tag compliance.
Technical Context
The MF3DH2300DA8/00 implements a dual-mode RF interface compliant with ISO/IEC 14443-4 at data rates up to 848 kbit/s and supports configurable FSCI for frame sizes up to 256 bytes. Its on-chip backup management system enforces transaction-oriented data integrity via automatic anti-tear and Transaction Timer protection against Man-in-the-Middle attacks.
Security architecture includes mutual three-pass authentication, hardware-accelerated AES-128 and 3DES engines, 8-byte CMAC for data authenticity, Proximity Check against relay attacks, and Originality Check for genuine NXP product verification. It supports MIsmartApp for delegated application management and preloaded DAM keys for NXP AppXplorer cloud service integration.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory size | 2 kB NV memory - sufficient for multiple applications with up to 32 files each, enabling compact yet scalable multi-service card designs. |
| Input capacitance | 70 pF - optimized for small-form-factor antennas and thin-card implementations without compromising coupling efficiency. |
| Security certification | Common Criteria EAL5+ (HW & SW) - meets banking-grade and e-passport security requirements for high-trust deployments. |
| Data transfer rate | Up to 848 kbit/s - enables fast transaction processing in high-throughput environments like transit gates and tolling systems. |
| Cryptographic engines | AES-128 and 3DES hardware acceleration - ensures low-latency, secure communication with strong confidentiality and integrity protection. |
| File types | 6 file types including Transaction MAC file - supports atomic transaction logging with secret-key signing for backend auditability. |
| NFC Forum certification | Type 4 Tag certified (ID 58652) - guarantees interoperability with standard NFC readers and mobile devices supporting NDEF. |
Pinout & Package
MF3DH2300DA8/00 is supplied in MOA8 plastic leadless module carrier package (SOT500-4), designed for embedding into contactless smart cards or inlays. The device has no external pins; it interfaces exclusively via its integrated antenna coil using ISO/IEC 14443A RF coupling. Terminal connections are internal and not user-accessible - power and data are delivered wirelessly through the reader's magnetic field.
Key Features
| Feature | Design Value |
|---|---|
| Transaction Timer | Prevents Man-in-the-Middle attacks by enforcing time-bound transaction completion, eliminating delayed-power exploitation during card removal. |
| Secure Dynamic Messaging (SDM) | Mirrors encrypted session data as plain-text NDEF message - enables seamless integration with NFC-enabled smartphones without custom app development. |
| Virtual Card Architecture | Enables privacy-preserving card/application selection on multi-VC devices - prevents unauthorized tracking across services on a single physical card. |
| Proximity Check | Detects and blocks relay attacks by measuring signal propagation delay - essential for secure access control and payment use cases. |
| MIsmartApp support | Allows third-party application creation and management under delegated authority - accelerates deployment of new services without PICC owner intervention. |
Applications
| Public Transport Ticketing | Smart City Mobility Card |
|---|---|
|
Use Scenario: Tap-and-go fare validation at bus/tram/metro gates with offline balance updates and multi-operator support. IC Role / Device Role / Timing Role: Contactless secure transaction processor managing encrypted value files, linear record files for trip history, and Transaction MAC for backend reconciliation. Use Value: Enables fast (<100 ms), offline-capable transactions with tamper-proof audit trail via Transaction MAC signed per application secret key. |
Use Scenario: Single card enabling public transport, bike sharing, parking, citizen services, and loyalty programs across municipal boundaries. IC Role / Device Role / Timing Role: Multi-application platform hosting independent, access-controlled applications with shared keys and cross-application file access during single-session transactions. Use Value: Eliminates need for multiple cards while maintaining strict data isolation between service providers via application-level cryptographic separation. |
| Secure Access Management | Micro-Payment & Loyalty |
|
Use Scenario: Physical access to office buildings, campuses, or restricted facilities using dynamic credential provisioning and revocation. IC Role / Device Role / Timing Role: Secure identity token with Random ID support, Proximity Check, and Originality Check ensuring only genuine, proximity-verified credentials gain entry. Use Value: Prevents cloning and relay attacks - critical for high-security environments where credential integrity directly impacts physical safety. |
Use Scenario: Closed-loop e-payment at vending machines, cafeterias, or retail kiosks with real-time balance updates and fraud-resistant transaction logging. IC Role / Device Role / Timing Role: Value file manager with built-in anti-tear mechanism and Transaction MAC generation - guarantees consistent balance state across power loss or reader disconnection. Use Value: Ensures zero-loss transaction integrity even under unstable RF conditions, meeting PCI-compliant closed-loop payment requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar contactless multi-application IC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MF3D8300DA8/00 | 8 kB NV memory, same 70 pF input capacitance, identical SOT500-4 package - provides 4× more memory for complex multi-service deployments. | Supports larger application footprints (e.g., full digital ID + biometric templates + multiple loyalty schemes) where 2 kB is insufficient. | Select when future scalability requires >2 kB memory headroom without changing antenna layout or packaging. |
| MF3DH2300DA4/00 | Same 2 kB memory and 70 pF input capacitance, but in MOA4 (SOT500-2) package - smaller footprint, lower profile, and reduced thermal mass. | Better suited for ultra-thin cards, wearable form factors, or embedded inlays where vertical space is constrained. | Choose for space-constrained designs where SOT500-4 height or pad layout conflicts with mechanical stack-up. |
Compared with MF3DH2300DA8/00, MF3D8300DA8/00 offers greater memory capacity for evolving service portfolios, while MF3DH2300DA4/00 reduces package height for thinner card profiles - both retain identical security features, RF performance, and command set compatibility.
Availability
MF3DH2300DA8/00 is available at Aetrix Electronics and suitable for secure public transport ticketing, smart city mobility cards, and micro-payment systems requiring stable component supply, long-term lifecycle assurance, and CC EAL5+ certified silicon.
Supply support for MF3DH2300DA8/00 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with leadership in contactless IC technology since the introduction of MIFARE.
The MF3DH2300DA8/00 belongs to the MIFARE DESFire EV3 product line, engineered specifically for high-assurance, multi-application contactless smart cards used in transportation, access control, and digital identity systems.
FAQ
What security certifications does the MF3DH2300DA8/00 hold?
The MF3DH2300DA8/00 holds Common Criteria EAL5+ certification for both hardware and software, validated against the highest assurance level required for banking cards and electronic passports. This certification covers its cryptographic engines (AES-128 and 3DES), mutual authentication protocol, secure messaging implementation, and anti-tampering sensors - all confirmed in the official NXP short data sheet Rev. 3.1. MF3DH2300DA8/00 meets stringent international security benchmarks without requiring additional evaluation for most regulated deployments.
Does MF3DH2300DA8/00 support NFC Forum Type 4 Tag functionality?
Yes, MF3DH2300DA8/00 is NFC Forum Type 4 Tag certified (Certificate ID 58652), fully supporting NDEF message formatting and Secure Dynamic Messaging (SDM). SDM mirrors session data as plain-text NDEF content, enabling direct smartphone interaction without proprietary apps. This capability is intrinsic to MF3DH2300DA8/00's firmware and requires no external configuration - making it ideal for mobile-first service rollouts leveraging existing NFC infrastructure.
How does the 70 pF input capacitance of MF3DH2300DA8/00 affect antenna design?
The 70 pF input capacitance of MF3DH2300DA8/00 is optimized for small-form-factor antennas, reducing required external tuning capacitance and enabling shorter, narrower coil geometries in thin cards or wearables. Unlike standard 17 pF variants, this higher capacitance lowers resonant frequency sensitivity to parasitic effects, improving yield in compact inlays. MF3DH2300DA8/00 maintains full ISO/IEC 14443A compliance and 100 mm operating distance despite the capacitance shift - verified in NXP's characterization data at 13.56 MHz and 2.1 V RMS.
Is MF3DH2300DA8/00 backward compatible with older MIFARE DESFire systems?
Yes, MF3DH2300DA8/00 operates in default delivery configuration as a MIFARE DESFire EV2 or EV1 device, supporting legacy command sets, file structures, and cryptographic modes (including D40 Native and EV1 secure messaging). Backward compatibility is hardware-enforced and requires no firmware update - allowing phased infrastructure upgrades without replacing existing readers or applications. MF3DH2300DA8/00 retains full EV3 feature access via explicit command activation as documented in the official datasheet.
What file types does MF3DH2300DA8/00 support for application data storage?
MF3DH2300DA8/00 supports six file types: Standard Data, Backup Data, Value, Linear Record, Cyclic Record, and Transaction MAC. Each application can contain up to 32 files, with Transaction MAC files enabling cryptographically signed transaction logs per application secret key. File sizes are defined at creation (except Transaction MAC), and automatic anti-tear ensures atomic updates across all file types - a core capability confirmed in Section 7.6 and Table 1 of the MF3D(H)x3 short data sheet.
MF3DH2300DA8/00J Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- MOA8, Smart Card Module
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- RFID Reader
- Frequency:
- 13.56MHz
- Standards:
- ISO 14443A
- Interface:
- -
- Voltage - Supply:
- -
- Operating Temperature:
- -25°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PLLMC
MF3DH2300DA8/00J FAQ
1.How can I place an order for MF3DH2300DA8/00J through Aetrix?
Please submit a Request for Quotation (RFQ) for MF3DH2300DA8/00J on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MF3DH2300DA8/00J reliable?
The price and inventory of MF3DH2300DA8/00J are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MF3DH2300DA8/00J is usually 5 days.
3.What payment methods are accepted for MF3DH2300DA8/00J?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MF3DH2300DA8/00J transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MF3DH2300DA8/00J?
MF3DH2300DA8/00J orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MF3DH2300DA8/00J order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MF3DH2300DA8/00J?
For technical support, including MF3DH2300DA8/00J datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MF3DH2300DA8/00J requirements.
6.How does Aetrix verify that MF3DH2300DA8/00J is sourced from the original manufacturer or authorized distributors?
All MF3DH2300DA8/00J products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MF3DH2300DA8/00J meets industry standards.
7.What is the process for return or replacement of MF3DH2300DA8/00J?
All MF3DH2300DA8/00J units undergo pre-shipment inspection (PSI). If there is an issue with MF3DH2300DA8/00J, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MF3DH2300DA8/00J part is unused and in its original packaging.
Return procedure for MF3DH2300DA8/00J:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MF3DH2300DA8/00J Tags
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SL2S2602FTBX
NXP Semiconductors
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