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NXP Semiconductors MF3DH2301DUD/00Z
- Part No.:
- MF3DH2301DUD/00Z
- Manufacturer:
- NXP Semiconductors
- Category:
- RFID, RF Access, Monitoring ICs
- Package:
- Die
- Datasheet:
-
MF3DH2301DUD/00Z.pdf
- Description:
- MF3DH2301DUD
- Quantity:
- Payment:
- Shipping:
Inventory:3,948
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Product details
Overview
MF3DH2301DUD/00Z from NXP Semiconductors is a contactless multi-application smart card IC compliant with ISO/IEC 14443A, featuring Common Criteria EAL5+ hardware and software security certification, 2 kB non-volatile memory, 70 pF input capacitance for small-form-factor antenna designs, and support for AES-128 and 3DES cryptographic engines. It enables secure public transport ticketing, micro-payment, and multi-service smart city cards.
For engineers reviewing the MF3DH2301DUD/00Z datasheet, MF3DH2301DUD/00Z pinout, MF3DH2301DUD/00Z application, or MF3DH2301DUD/00Z equivalent, key selection considerations include its 70 pF high-input-capacitance variant optimized for compact antennas, backward compatibility with MIFARE DESFire EV2/EV1/D40, Transaction MAC file support, and MIsmartApp-enabled delegated application management.
Technical Context
The MF3DH2301DUD/00Z implements a dedicated ISO/IEC 14443-4 contactless interface with configurable frame size (FSCI) up to 256 bytes and supports data rates of 106–848 kbit/s. Its on-chip security architecture includes mutual three-pass authentication, hardware-accelerated AES-128 and 3DES, CMAC-based data authenticity, and Proximity Check to mitigate relay attacks.
Memory organization uses a flexible, application-level file system supporting unlimited applications (limited only by 2 kB NV capacity), up to 32 files per application across six file types-including Transaction MAC-and automatic anti-tear protection with integrated Transaction Timer to prevent Man-in-the-Middle transaction delays.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| RF Interface | ISO/IEC 14443 Type A compliant; enables interoperability with global NFC readers and legacy MIFARE infrastructure. |
| Non-volatile Memory | 2 kB; sufficient for multiple secure applications (e.g., transit + loyalty + access) with full file-system flexibility. |
| Input Capacitance | 70 pF; allows compact antenna design in thin cards or wearables without external tuning components. |
| Cryptographic Engine | AES-128 and 3DES hardware acceleration; delivers authenticated, encrypted RF communication with 8-byte CMAC integrity. |
| Security Certification | Common Criteria EAL5+ (HW & SW); meets banking-grade assurance requirements for e-passports and payment cards. |
| File Types | Six supported: Standard Data, Backup Data, Value, Linear Record, Cyclic Record, and Transaction MAC; enables atomic multi-file transactions. |
| Transaction Integrity | Automatic anti-tear + Transaction Timer; guarantees data consistency during power loss and prevents malicious transaction extension. |
Pinout & Package
MF3DH2301DUD/00Z is supplied in FFC (Film Frame Carrier) wafer form-12-inch diameter, 120 μm thickness-with no discrete pins or terminals. As a bare die contactless IC, it interfaces exclusively via inductive coupling through an embedded antenna coil; no electrical pinout applies.
Key Features
| Feature | Design Value |
|---|---|
| MIsmartApp Delegated Management | Enables third-party application creation and lifecycle control without PICC owner intervention-critical for scalable smart city service rollouts. |
| Transaction MAC File | Generates cryptographically signed transaction proofs per application, enabling backend verification of tamper-proof activity logs. |
| Virtual Card Architecture | Supports privacy-preserving card selection across multiple logical applications on one physical card-prevents tracking across services. |
| Proximity Check & Originality Check | Detects relay attacks and validates genuine NXP silicon-essential for fraud-resistant access and payment deployments. |
| Backward Compatibility Mode | Operates as MIFARE DESFire EV2/EV1/D40 out-of-box; allows infrastructure upgrades without reader replacement. |
Applications
| Secure Public Transport Ticketing | Multi-Service Smart City Card |
|---|---|
Use Scenario: Contactless fare validation at bus/tram gates with offline balance updates and session-based ride counting. IC Role / Device Role / Timing Role: Secure credential storage and cryptographic transaction engine handling AES-encrypted value file updates and Transaction MAC generation. Use Value: Enables offline-first operation with guaranteed data integrity across 2 kB memory-supports >100 rides per card without cloud dependency. |
Use Scenario: Single card used for metro, bike sharing, municipal ID, and local merchant loyalty-all managed independently by different service providers. IC Role / Device Role / Timing Role: Multi-application platform with isolated AID-based file systems and MIsmartApp delegation for third-party app provisioning. Use Value: Eliminates need for multiple physical cards while maintaining strict access separation-each service operates in its own encrypted namespace. |
| Secure Access Control | Micro-Payment & Loyalty |
Use Scenario: Physical access to office buildings or restricted facilities using dynamic credentials with time-bound validity and proximity-checked authentication. IC Role / Device Role / Timing Role: Cryptographic authenticator enforcing mutual three-pass challenge-response with Proximity Check to block relay attacks. Use Value: Prevents unauthorized cloning and relay exploits-EAL5+ certified hardware ensures root-of-trust for credential issuance. |
Use Scenario: Tap-to-pay at vending machines or retail kiosks with offline balance deduction, receipt generation, and loyalty point accrual. IC Role / Device Role / Timing Role: Value file manager with atomic credit/debit operations and Transaction MAC logging for audit trail compliance. Use Value: Supports fully offline micro-transactions with cryptographic proof-no network required at point of sale. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar contactless multi-application IC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MF3D2301DUD/00 | Same 2 kB memory and FFC package but 17 pF input capacitance; requires larger antenna area for equivalent coupling efficiency. | Better suited for standard-size smart cards where antenna size is unconstrained; less optimal for ultra-thin or wearable formats. | Select MF3D2301DUD/00 when antenna geometry permits lower capacitance and cost sensitivity outweighs miniaturization needs. |
| MF3DH4301DUD/00 | Identical 70 pF high-capacitance design but with 4 kB NV memory; same die size and package footprint. | Supports more complex multi-application deployments-e.g., adding biometric templates or extended audit logs-without changing card layout. | Choose MF3DH4301DUD/00 when future application expansion is anticipated and memory headroom is required beyond 2 kB. |
Compared with MF3DH2301DUD/00Z, MF3D2301DUD/00 trades antenna miniaturization for cost, while MF3DH4301DUD/00 extends memory capacity within identical mechanical constraints-enabling scalable deployment paths without redesigning card antennas or packaging.
Availability
MF3DH2301DUD/00Z is available at Aetrix Electronics and suitable for secure public transport ticketing, smart city mobility cards, and micro-payment systems requiring stable component supply, long-term lifecycle support, and certified cryptographic assurance.
Supply support for MF3DH2301DUD/00Z includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with over 30 years of smart card IC innovation.
The MF3DH2301DUD/00Z belongs to the MIFARE DESFire EV3 product line-designed specifically for high-assurance, multi-application contactless systems in transportation, identity, and secure commerce.
FAQ
What is the primary security certification level of MF3DH2301DUD/00Z?
MF3DH2301DUD/00Z holds Common Criteria EAL5+ certification for both hardware and software, matching the assurance level required for banking cards and electronic passports. This certification validates its resistance to side-channel, fault injection, and logical attacks-making MF3DH2301DUD/00Z suitable for high-risk financial and national ID applications.
How does the 70 pF input capacitance of MF3DH2301DUD/00Z impact antenna design?
The 70 pF input capacitance of MF3DH2301DUD/00Z reduces required antenna inductance, enabling smaller, thinner, or curved antenna geometries-ideal for wearables, paper tickets, or space-constrained smart cards. Unlike the 17 pF variants, MF3DH2301DUD/00Z avoids external tuning capacitors, simplifying PCB or inlay design and improving yield in high-volume production.
Is MF3DH2301DUD/00Z compatible with existing MIFARE DESFire EV2 infrastructure?
Yes, MF3DH2301DUD/00Z operates in backward-compatible mode with MIFARE DESFire EV2, EV1, and D40 out of the box. No reader firmware changes are needed for basic functionality. New features like Transaction MAC or Virtual Card Architecture require explicit command activation-but legacy transactions remain fully interoperable with MF3DH2301DUD/00Z.
What file types does MF3DH2301DUD/00Z support, and why does that matter for application design?
MF3DH2301DUD/00Z supports six file types: Standard Data, Backup Data, Value, Linear Record, Cyclic Record, and Transaction MAC. This diversity allows developers to mix persistent storage (Standard Data), balance tracking (Value), audit logs (Linear Record), rolling history (Cyclic Record), and cryptographically signed transaction evidence (Transaction MAC)-all within a single 2 kB memory space.
Does MF3DH2301DUD/00Z include hardware support for anti-relay protection?
Yes, MF3DH2301DUD/00Z integrates Proximity Check-a hardware-enforced timing-based mechanism that detects and rejects relay attacks by measuring RF round-trip delay. Combined with Originality Check to verify genuine NXP silicon, this dual-layer defense ensures MF3DH2301DUD/00Z meets EN 15118 and ISO/IEC 14443-4 security requirements for trusted contactless transactions.
MF3DH2301DUD/00Z Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- Die
- Packaging:
- Tray
- Product Status:
- Active
- Type:
- RFID Reader
- Frequency:
- 13.56MHz
- Standards:
- ISO 14443A
- Interface:
- -
- Voltage - Supply:
- -
- Operating Temperature:
- -25°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- Wafer
MF3DH2301DUD/00Z FAQ
1.How can I place an order for MF3DH2301DUD/00Z through Aetrix?
Please submit a Request for Quotation (RFQ) for MF3DH2301DUD/00Z on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MF3DH2301DUD/00Z reliable?
The price and inventory of MF3DH2301DUD/00Z are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MF3DH2301DUD/00Z is usually 5 days.
3.What payment methods are accepted for MF3DH2301DUD/00Z?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MF3DH2301DUD/00Z transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MF3DH2301DUD/00Z?
MF3DH2301DUD/00Z orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MF3DH2301DUD/00Z order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MF3DH2301DUD/00Z?
For technical support, including MF3DH2301DUD/00Z datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MF3DH2301DUD/00Z requirements.
6.How does Aetrix verify that MF3DH2301DUD/00Z is sourced from the original manufacturer or authorized distributors?
All MF3DH2301DUD/00Z products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MF3DH2301DUD/00Z meets industry standards.
7.What is the process for return or replacement of MF3DH2301DUD/00Z?
All MF3DH2301DUD/00Z units undergo pre-shipment inspection (PSI). If there is an issue with MF3DH2301DUD/00Z, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MF3DH2301DUD/00Z part is unused and in its original packaging.
Return procedure for MF3DH2301DUD/00Z:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MF3DH2301DUD/00Z Tags
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NXP Semiconductors
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