NXP Semiconductors MF3DH4300DA8/00J
- Part No.:
- MF3DH4300DA8/00J
- Manufacturer:
- NXP Semiconductors
- Category:
- RFID, RF Access, Monitoring ICs
- Package:
- MOA8, Smart Card Module
- Datasheet:
-
MF3DH4300DA8/00J.pdf
- Description:
- MF3DH4300DA8
- Quantity:
- Payment:

- Shipping:

Inventory:2,479
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Product details
Overview
MF3DH4300DA8/00 from NXP Semiconductors is a contactless multi-application smart card IC compliant with ISO/IEC 14443A, featuring Common Criteria EAL5+ hardware and software security certification, 4 kB non-volatile memory, 70 pF input capacitance, and support for AES-128 and 3DES cryptographic engines. It serves as the secure core of transit cards, e-ID documents, and micro-payment systems requiring high-assurance authentication and transaction integrity.
For engineers reviewing the MF3DH4300DA8/00 datasheet, MF3DH4300DA8/00 pinout, MF3DH4300DA8/00 application, or MF3DH4300DA8/00 equivalent, key selection criteria include its 70 pF high-input-capacitance variant optimized for compact antenna designs, EV3-specific features like Transaction MAC and Proximity Check, backward compatibility with DESFire EV2/EV1, and SOT500-4 MOA8 module packaging for embedded smart card inlays.
Technical Context
The MF3DH4300DA8/00 implements a dedicated ISO/IEC 14443A RF interface with configurable frame size (up to 256 bytes), supports native AFh chaining and ISO/IEC 14443-4 protocol, and integrates hardware-accelerated AES-128 and 3DES cryptographic engines with key versioning. Its on-chip security architecture includes mutual three-pass authentication, hardware exception sensors (voltage, temperature, light, glitch), and self-securing file system enforcement.
It delivers transaction-oriented data integrity via automatic anti-tear mechanisms and the new Transaction Timer feature to prevent Man-in-the-Middle attacks during delayed transaction termination. The device enables delegated application management (MIsmartApp) with factory-loaded DAM keys for NXP AppXplorer cloud integration and supports Virtual Card Architecture for privacy-preserving multi-VC card selection.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| RF Interface | ISO/IEC 14443A compliant; enables interoperability with global NFC readers and legacy MIFARE infrastructure. |
| Memory Size | 4 kB NV memory; supports ≥10 applications with up to 32 files each, sufficient for multi-service smart city cards. |
| Input Capacitance | 70 pF; optimized for small-form-factor antennas and thin-card inlays without external tuning components. |
| Cryptographic Engine | Hardware AES-128 and 3DES; provides confidentiality and integrity protection for RF-channel data with key versioning. |
| Security Certification | Common Criteria EAL5+ (HW & SW); meets banking and e-passport assurance requirements. |
| Data Retention | 25 years; ensures long-term reliability for transit season passes and citizen ID credentials. |
| Write Endurance | 1,000,000 cycles; supports daily top-ups and transaction logging over multi-year deployments. |
Pinout & Package
MF3DH4300DA8/00 is supplied in MOA8 plastic leadless module carrier package (SOT500-4), designed for embedding into smart card laminates or contactless modules. It has no external pins - RF coupling occurs via integrated antenna pads connected to external coil traces.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Antenna Pad A | RF Input/Output | Connects to one end of external planar antenna coil; forms resonant LC tank at 13.56 MHz. |
| Antenna Pad B | RF Input/Output | Connects to opposite end of external antenna coil; completes resonant circuit with Pad A. |
Key Features
| Feature | Design Value |
|---|---|
| Transaction MAC file type | Generates cryptographically signed MAC per transaction for backend verification of authenticity and integrity. |
| Proximity Check | Detects relay attacks by measuring RF field strength decay time; prevents unauthorized remote access. |
| Originality Check | Validates genuine NXP silicon during initialization; blocks counterfeit ICs in production and field deployment. |
| Virtual Card Architecture | Enables privacy-preserving selection among multiple virtual cards on one physical card using masked AID exchange. |
| MIsmartApp Delegated Management | Allows third-party service providers to create and manage applications using preloaded DAM keys and cloud-based AppXplorer. |
Applications
| Secure Public Transport Ticketing | Smart City Mobility Card |
|---|---|
Use Scenario: Contactless tap-in/tap-out for buses, trams, and metro systems with real-time balance updates and fare capping. IC Role / Device Role / Timing Role: Secure credential storage and cryptographic transaction engine handling encrypted value file updates and session authentication. Use Value: Enables offline transaction processing with guaranteed data consistency via anti-tear and Transaction MAC, reducing dependency on network connectivity. | Use Scenario: Single card enabling public transport, bike sharing, parking payments, and municipal loyalty programs across city services. IC Role / Device Role / Timing Role: Multi-application platform hosting independent, access-controlled applications with shared keys and cross-application transaction capability. Use Value: Eliminates need for multiple cards through isolated yet interoperable application containers, each with distinct security policies and lifecycle management. |
| Secure Access Management | Micro-Payment & Loyalty |
Use Scenario: Physical access control for corporate campuses, universities, or government facilities with role-based entry permissions. IC Role / Device Role / Timing Role: Identity token providing mutual authentication and encrypted challenge-response handshakes with readers. Use Value: Prevents cloning and replay attacks via Random ID, Originality Check, and Proximity Check-critical for high-security zones. | Use Scenario: Closed-loop e-wallet for vending machines, cafeterias, retail kiosks, and event venues with instant top-up and transaction history. IC Role / Device Role / Timing Role: Tamper-resistant value file manager supporting atomic credit/debit operations and audit-trail generation. Use Value: Ensures financial-grade integrity with Transaction Timer and CMAC-signed records, meeting PCI and EMVCo-aligned requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar contactless multi-application IC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MF3DH4300DA4/00 | Same 4 kB memory and 70 pF capacitance, but in MOA4 (SOT500-2) package with different pad layout and thermal profile. | Requires PCB redesign due to different footprint and solder mask opening; suited for thinner inlay stacks. | Select when integrating into ultra-thin smart cards or flexible substrates where MOA4's smaller outline is critical. |
| MF3DH4301DUD/00 | Same 4 kB/70 pF specification but delivered on 12-inch wafer (FFC format), not module form; requires custom antenna integration. | Intended for OEMs embedding directly into proprietary inlays or tags-not drop-in replacement for MOA8 modules. | Choose only for high-volume, vertically integrated manufacturing with full antenna design capability and wafer-level assembly. |
Compared with MF3DH4300DA4/00 and MF3DH4301DUD/00, the MF3DH4300DA8/00 offers plug-and-play compatibility with standard SOT500-4 module footprints, preserves antenna tuning stability via fixed 70 pF input capacitance, and delivers certified EAL5+ security without requiring wafer-level customization or requalification of antenna performance.
Availability
MF3DH4300DA8/00 is available at Aetrix Electronics and suitable for secure public transport ticketing, smart city mobility cards, and micro-payment systems requiring stable component supply, long-term lifecycle assurance, and certified security compliance.
Supply support for MF3DH4300DA8/00 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and identification markets.
The MF3DH4300DA8/00 belongs to the MIFARE DESFire EV3 product line, engineered specifically for high-assurance, multi-application contactless smart cards used in transit, identity, and payment ecosystems.
FAQ
What security certifications does MF3DH4300DA8/00 hold?
MF3DH4300DA8/00 is certified to Common Criteria EAL5+ for both hardware and software, matching the assurance level required for banking cards and electronic passports. This certification covers its cryptographic engines (AES-128, 3DES), mutual authentication protocols, anti-tampering sensors, and secure file system implementation - all validated under CC evaluation scope defined in the official NXP certification report.
How does the 70 pF input capacitance of MF3DH4300DA8/00 affect antenna design?
The 70 pF input capacitance of MF3DH4300DA8/00 reduces the required external tuning capacitance in compact antenna layouts, enabling smaller coil sizes and thinner card profiles. Unlike 17 pF variants, it allows direct integration into space-constrained inlays without additional capacitors - simplifying RF matching and improving yield in high-frequency NFC reader environments.
Is MF3DH4300DA8/00 backward compatible with older MIFARE DESFire systems?
Yes, MF3DH4300DA8/00 operates in default delivery configuration as a MIFARE DESFire EV2 device, ensuring seamless integration with existing EV2 infrastructure. All EV1 and D40 commands remain functional, and migration to EV3-specific features like Transaction MAC or Proximity Check requires explicit activation via standardized commands - preserving legacy reader compatibility.
What file types does MF3DH4300DA8/00 support, and how are they used?
MF3DH4300DA8/00 supports six file types: Standard Data, Backup Data, Value, Linear Record, Cyclic Record, and Transaction MAC. Value files enable secure e-purse functionality with atomic increment/decrement; Transaction MAC files generate per-transaction signatures for backend audit; and cyclic record files store rolling logs for access control or usage analytics - all managed independently per application.
Does MF3DH4300DA8/00 support NFC Forum Type 4 Tag operation?
Yes, MF3DH4300DA8/00 is NFC Forum Type 4 Tag certified (Certificate ID 58652). It supports NDEF message mirroring via Secure Dynamic Messaging (SDM), allowing text-based NFC interactions such as URL launching or Bluetooth pairing while maintaining cryptographic separation from application data stored in DESFire files.
MF3DH4300DA8/00J Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- MOA8, Smart Card Module
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- RFID Reader/Transponder
- Frequency:
- 13.56MHz
- Standards:
- Mifare, NFC
- Interface:
- -
- Voltage - Supply:
- -
- Operating Temperature:
- -25°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PLLMC
MF3DH4300DA8/00J FAQ
1.How can I place an order for MF3DH4300DA8/00J through Aetrix?
Please submit a Request for Quotation (RFQ) for MF3DH4300DA8/00J on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MF3DH4300DA8/00J reliable?
The price and inventory of MF3DH4300DA8/00J are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MF3DH4300DA8/00J is usually 5 days.
3.What payment methods are accepted for MF3DH4300DA8/00J?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MF3DH4300DA8/00J transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MF3DH4300DA8/00J?
MF3DH4300DA8/00J orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MF3DH4300DA8/00J order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MF3DH4300DA8/00J?
For technical support, including MF3DH4300DA8/00J datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MF3DH4300DA8/00J requirements.
6.How does Aetrix verify that MF3DH4300DA8/00J is sourced from the original manufacturer or authorized distributors?
All MF3DH4300DA8/00J products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MF3DH4300DA8/00J meets industry standards.
7.What is the process for return or replacement of MF3DH4300DA8/00J?
All MF3DH4300DA8/00J units undergo pre-shipment inspection (PSI). If there is an issue with MF3DH4300DA8/00J, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MF3DH4300DA8/00J part is unused and in its original packaging.
Return procedure for MF3DH4300DA8/00J:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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