NXP Semiconductors MF3DH4301DUD/00Z
- Part No.:
- MF3DH4301DUD/00Z
- Manufacturer:
- NXP Semiconductors
- Category:
- RFID, RF Access, Monitoring ICs
- Package:
- Die
- Datasheet:
-
MF3DH4301DUD/00Z.pdf
- Description:
- MF3DH4301DUD
- Quantity:
- Payment:

- Shipping:

Inventory:2,261
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MF3DH4301DUD/00Z from NXP Semiconductors is a contactless multi-application smart card IC compliant with ISO/IEC 14443A, featuring 4 kB non-volatile memory, 70 pF input capacitance for compact antenna designs, Common Criteria EAL5+ security certification, and hardware AES-128/3DES cryptographic engines. It serves as the secure core in transit fare media, micro-payment cards, and citizen ID systems requiring high-assurance data integrity and application isolation.
For engineers reviewing the MF3DH4301DUD/00Z datasheet, MF3DH4301DUD/00Z pinout, MF3DH4301DUD/00Z application, or MF3DH4301DUD/00Z equivalent, this page delivers verified technical context, exact memory organization, EAL5+ security implementation details, RF interface timing constraints, and validated alternative options for secure contactless system design.
Technical Context
The MF3DH4301DUD/00Z implements a dedicated ISO/IEC 14443-4 contactless interface with configurable FSCI supporting up to 256-byte frame size and data rates of 106–848 kbit/s. Its on-chip analog front-end includes rectifier, voltage regulator, and multiple hardware sensors (glitch, light, temperature, rail) enabling tamper resistance per Common Criteria EAL5+ requirements.
It executes a transaction-oriented file system with mutual three-pass authentication, supports six file types-including Transaction MAC files-and enables cross-application file access within a single session. Backward compatibility with MIFARE DESFire EV2/EV1/D40 is implemented via default delivery configuration without firmware modification.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| RF Interface | ISO/IEC 14443 Type A compliant; enables interoperability with global NFC readers and legacy MIFARE infrastructure. |
| Non-Volatile Memory | 4 kB; retains data for 25 years and withstands 1 million write cycles-sufficient for multi-year transit pass lifecycle and frequent loyalty updates. |
| Input Capacitance | 70 pF; optimized for small-form-factor antennas in thin cards or wearables where low-capacitance variants (17 pF) would require larger coil area. |
| Security Certification | Common Criteria EAL5+ (HW & SW); meets banking-grade assurance for e-passport and payment applications without additional evaluation. |
| Cryptographic Engines | Hardware AES-128 and 3DES (56/112/168-bit keys); enables fast, side-channel-resistant encryption and CMAC generation for transaction integrity. |
| File System | Unlimited applications; up to 32 files per application across 6 types (Standard Data, Value, Linear/Cyclic Record, Backup, Transaction MAC); supports atomic multi-file transactions. |
| Authentication Protocol | Mutual three-pass authentication with optional Random ID; prevents tracking and cloning while maintaining full ISO/IEC 7816-4 APDU command support. |
Pinout & Package
MF3DH4301DUD/00Z is supplied in FFC (Film Frame Carrier) wafer format-12-inch diameter, 120 μm thickness-intended for embedding into plastic smart cards or laminated proximity tags. No discrete pins or terminals are present; electrical connection is made exclusively via integrated antenna coil coupling under ISO/IEC 14443A magnetic field excitation.
Key Features
| Feature | Design Value |
|---|---|
| Transaction MAC file type | Generates cryptographically signed MAC per transaction using application-specific secret key-enables backend verification of card-originated events without exposing keys. |
| Virtual Card Architecture (VCA) | Allows multiple logical cards on one physical device with privacy-preserving selection-critical for citizen cards hosting transport, ID, and health services separately. |
| Proximity Check & Originality Check | Detects relay attacks and counterfeit ICs at protocol level-eliminates need for external anti-cloning hardware in high-security deployments. |
| MIsmartApp delegated management | Enables third-party application creation and lifecycle control via preloaded DAM keys-supports service providers launching new mobility services without PICC owner involvement. |
| Secure Dynamic Messaging (SDM) | Mirrors encrypted challenge-response data into NDEF text record-enables seamless integration with Android Host Card Emulation (HCE) and NFC-enabled mobile wallets. |
Applications
| Public Transport Ticketing | Smart City Mobility Card |
|---|---|
Use Scenario: Contactless tap-in/tap-out for buses, trams, and metro systems with real-time balance deduction and trip history logging. IC Role / Device Role / Timing Role: Secure transaction processor managing value files, linear record files for journey logs, and Transaction MAC for backend reconciliation. Use Value: Atomic multi-file update ensures balance and log consistency during power loss; EAL5+ prevents fare evasion via cloning or replay attacks. |
Use Scenario: Single card enabling public transport, bike/car sharing, municipal building access, and local e-payment across city-wide infrastructure. IC Role / Device Role / Timing Role: Multi-application container with isolated AID-based applications, each with independent key sets and access rights. Use Value: Virtual Card Architecture enables privacy-aware card selection; MIsmartApp allows city departments to deploy new services without reissuing cards. |
| Secure Access Management | Micro-Payment & Loyalty |
Use Scenario: Physical access control for corporate campuses or government facilities requiring audit trails and time-based permissions. IC Role / Device Role / Timing Role: Authentication endpoint verifying credentials against encrypted value files and enforcing access rules via cyclic record files for entry logs. Use Value: Proximity Check thwarts relay attacks; Transaction Timer prevents man-in-the-middle delay exploits during credential validation. |
Use Scenario: Closed-loop retail payments and point-of-sale loyalty redemption in stadiums, universities, or hospitality venues. IC Role / Device Role / Timing Role: Secure value storage with backup data files and automatic anti-tear mechanism ensuring balance integrity during interrupted transactions. Use Value: Hardware AES-128 encrypts stored value; 4 kB memory accommodates multiple merchant-specific applications and transaction histories. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar contactless multi-application IC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MF3D4301DUD/00 | Same 4 kB memory and FFC package but 17 pF input capacitance-requires larger antenna geometry for equivalent operating distance. | Preferred for standard-size ISO/IEC 7816-1/2 cards where antenna space is unconstrained; not suitable for ultra-thin or wearable form factors. | Select MF3D4301DUD/00 only when antenna design permits lower capacitance; MF3DH4301DUD/00Z is mandatory for compact or flexible substrates. |
| MF3DH4300DA4/00 | Identical 4 kB memory and 70 pF capacitance but in MOA4 plastic leadless module carrier (SOT500-2), enabling direct PCB mounting instead of wafer embedding. | Used in embedded reader modules, NFC-enabled kiosks, or industrial access panels where the IC must be soldered rather than laminated. | Choose MF3DH4300DA4/00 when integrating into reader-side hardware; MF3DH4301DUD/00Z remains the correct choice for card-based end-user media. |
Compared with MF3D4301DUD/00 and MF3DH4300DA4/00, MF3DH4301DUD/00Z uniquely combines 70 pF input capacitance with wafer-level FFC packaging-making it the only option certified for high-density, low-profile smart cards requiring both miniaturization and EAL5+ assurance.
Availability
MF3DH4301DUD/00Z is available at Aetrix Electronics and suitable for secure public transport ticketing, smart city mobility cards, and micro-payment systems requiring stable component supply, long-term lifecycle commitment, and traceable sourcing from authorized NXP channels.
Supply support for MF3DH4301DUD/00Z includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and identification markets, with over two decades of leadership in contactless IC innovation.
The MF3DH4301DUD/00Z belongs to the MIFARE DESFire EV3 product line-designed specifically for high-assurance, multi-service contactless applications demanding Common Criteria EAL5+, flexible file architecture, and seamless backward compatibility.
FAQ
What security certifications does MF3DH4301DUD/00Z hold?
MF3DH4301DUD/00Z is certified to Common Criteria EAL5+ for both hardware and software components, matching the assurance level required for banking cards and electronic passports. This certification covers its cryptographic engines (AES-128, 3DES), memory protection mechanisms, and tamper-detection sensors-including glitch, light, and rail voltage monitors-verified under formal evaluation.
How does MF3DH4301DUD/00Z differ from MF3D4301DUD/00?
MF3DH4301DUD/00Z and MF3D4301DUD/00 share identical 4 kB memory, FFC wafer packaging, and MIFARE DESFire EV3 feature set-but differ in input capacitance: MF3DH4301DUD/00Z specifies 70 pF for compact antenna designs, while MF3D4301DUD/00 uses 17 pF. This makes MF3DH4301DUD/00Z essential for thin cards or wearables where antenna area is constrained.
Can MF3DH4301DUD/00Z support multiple independent applications on one card?
Yes, MF3DH4301DUD/00Z supports an unlimited number of applications limited only by its 4 kB NV memory. Each application operates in strict isolation with its own 3-byte AID, dedicated key sets (up to 14 keys), and configurable access rights-enabling use cases like combining transit, ID, and payment services on a single citizen card without cross-application interference.
What file types are supported by MF3DH4301DUD/00Z?
MF3DH4301DUD/00Z supports six file types: Standard Data, Backup Data, Value, Linear Record, Cyclic Record, and Transaction MAC. The Transaction MAC file generates a cryptographically signed MAC per transaction using an application-specific secret key-providing verifiable proof of card-initiated events for backend reconciliation in fare collection or loyalty systems.
Is MF3DH4301DUD/00Z compatible with existing MIFARE DESFire infrastructure?
Yes, MF3DH4301DUD/00Z is functionally backward compatible with MIFARE DESFire EV2, EV1, and D40 (MF3ICD40) in its default delivery configuration. No infrastructure changes are needed to deploy it-existing readers and backends continue to operate seamlessly, while new features like Transaction MAC or Virtual Card Architecture require explicit activation via updated commands.
MF3DH4301DUD/00Z Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- Die
- Packaging:
- Tray
- Product Status:
- Active
- Type:
- RFID Reader
- Frequency:
- 13.56MHz
- Standards:
- ISO 14443A
- Interface:
- -
- Voltage - Supply:
- -
- Operating Temperature:
- -25°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- Wafer
MF3DH4301DUD/00Z FAQ
1.How can I place an order for MF3DH4301DUD/00Z through Aetrix?
Please submit a Request for Quotation (RFQ) for MF3DH4301DUD/00Z on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MF3DH4301DUD/00Z reliable?
The price and inventory of MF3DH4301DUD/00Z are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MF3DH4301DUD/00Z is usually 5 days.
3.What payment methods are accepted for MF3DH4301DUD/00Z?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MF3DH4301DUD/00Z transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MF3DH4301DUD/00Z?
MF3DH4301DUD/00Z orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MF3DH4301DUD/00Z order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MF3DH4301DUD/00Z?
For technical support, including MF3DH4301DUD/00Z datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MF3DH4301DUD/00Z requirements.
6.How does Aetrix verify that MF3DH4301DUD/00Z is sourced from the original manufacturer or authorized distributors?
All MF3DH4301DUD/00Z products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MF3DH4301DUD/00Z meets industry standards.
7.What is the process for return or replacement of MF3DH4301DUD/00Z?
All MF3DH4301DUD/00Z units undergo pre-shipment inspection (PSI). If there is an issue with MF3DH4301DUD/00Z, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MF3DH4301DUD/00Z part is unused and in its original packaging.
Return procedure for MF3DH4301DUD/00Z:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MF3DH4301DUD/00Z Tags

-
SL2S2602FTBX
NXP Semiconductors

-
ST25DV04K-IER6S3
STMicroelectronics

-
ST25DV04K-IER6C3
STMicroelectronics

-
LXMSJZNCMD-217
Murata Electronics

-
NT3H2111W0FTTJ
NXP Semiconductors

-
NT3H2111W0FHKH
NXP Semiconductors

-
M24LR04E-RMC6T/2
STMicroelectronics

-
ST25DV04KC-JF6D3
STMicroelectronics

-
ST25DV64KC-IE6S3
STMicroelectronics
-
ST25DV64K-IER6T3
STMicroelectronics

-
NT3H2211W0FTTJ
NXP Semiconductors

-
NT3H2211W0FHKH
NXP Semiconductors
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
