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NXP Semiconductors MF3DH8200DA4/00J
- Part No.:
- MF3DH8200DA4/00J
- Manufacturer:
- NXP Semiconductors
- Category:
- RFID, RF Access, Monitoring ICs
- Package:
- MOA4, Smart Card Module
- Datasheet:
-
MF3DH8200DA4/00J.pdf
- Description:
- IC RFID READER 13.56MHZ PLLMC
- Quantity:
- Payment:
- Shipping:
Inventory:2,752
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Product details
Overview
MF3DH8200DA4/00J from NXP Semiconductors is a contactless multi-application IC compliant with ISO/IEC 14443A, featuring 8 KB EEPROM, 70 pF input capacitance, Common Criteria EAL5+ security certification, and support for AES-128 and 3DES cryptographic engines. It enables secure public transport ticketing, micro-payment, and smart city mobility cards with transaction-oriented data integrity.
For engineers reviewing the MF3DH8200DA4/00J datasheet, MF3DH8200DA4/00J pinout, MF3DH8200DA4/00J application, or MF3DH8200DA4/00J equivalent, key selection considerations include its high-input-capacitance (70 pF) MOA4 package for compact antenna integration, EV2-specific features like Transaction MAC and MIsmartApp, backward compatibility with DESFire EV1/D40, and EAL5+ hardware/software security validation.
Technical Context
The MF3DH8200DA4/00J implements a dual-mode RF interface supporting ISO/IEC 14443-4 at data rates up to 848 kbit/s and configurable FSCI up to 128 bytes (256 bytes for larger memory variants). Its on-chip cryptographic engine supports AES-128, 3TDEA, and single DES with key versioning, enabling secure messaging modes including D40-native, EV1-compatible, and EV2-native protocols.
It features a flexible file system with unlimited applications, up to 32 files per application across six file types-including Transaction MAC-and mutual three-pass authentication. The device includes hardware exception sensors, automatic anti-tear protection, Proximity Check against relay attacks, and Originality Check for genuine NXP product verification.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory capacity | 8 KB EEPROM with 25-year data retention and 500,000 write endurance cycles |
| RF interface | ISO/IEC 14443 Type A compliant; supports 106–848 kbit/s transfer rates |
| Input capacitance | 70 pF (typical), optimized for small-form-factor antenna designs in MOA4 package |
| Security certification | Common Criteria EAL5+ for both hardware and software components |
| Cryptographic engines | Hardware-accelerated AES-128 and 3DES (56/112/168-bit keys) with key versioning |
| File system | Unlimited applications; up to 32 files per application; six file types including Transaction MAC |
| Authentication | Mutual three-pass authentication; supports Random ID mode for enhanced privacy |
Pinout & Package
MF3DH8200DA4/00J is housed in a MOA4 plastic leadless module carrier package (SOT500-2), designed for embedding into contactless smart cards and tags. This surface-mount package integrates the IC with matching capacitors and antenna coupling elements, eliminating discrete RF tuning components in end-product designs.
Key Features
| Feature | Design Value |
|---|---|
| Transaction MAC | Generates cryptographically signed transaction proofs on-card for backend auditability and fraud detection |
| MIsmartApp | Enables delegated application management-third parties can create and manage apps without PICC master key access |
| Proximity Check | Hardware-based relay attack mitigation by measuring RF field rise time during activation |
| Originality Check | Verifies genuine NXP silicon via challenge-response protocol using embedded secret keys |
| Virtual Card Architecture | Supports privacy-preserving card selection across multiple virtual credentials on one physical device |
Applications
| Secure Public Transport Ticketing | Smart City Mobility Card |
|---|---|
|
Use Scenario: Contactless fare payment across buses, trams, and metro systems with offline balance updates and session-based validation. IC Role / Device Role / Timing Role: Secure credential storage and cryptographic transaction processing at point-of-use; no real-time network dependency required. Use Value: Enables fast tap-and-go (<100 ms) transactions with tamper-proof balance integrity and seamless migration from legacy DESFire EV1 infrastructure. |
Use Scenario: Single credential for integrated urban services including bike/car sharing, museum access, e-payment, and citizen ID. IC Role / Device Role / Timing Role: Multi-application container with isolated security domains per service; supports concurrent file access across applications in one transaction. Use Value: Eliminates need for multiple cards while maintaining strict access control boundaries and independent lifecycle management per application. |
| Micro-Payment & Loyalty | Secure Access Management |
|
Use Scenario: Closed-loop retail payments and branded loyalty programs with offline redemption and encrypted transaction logging. IC Role / Device Role / Timing Role: Value file with backup and Transaction MAC generation ensures atomic balance updates and verifiable transaction history. Use Value: Prevents balance corruption during power loss or signal interruption; enables reconciliation with backend systems via MAC-verified logs. |
Use Scenario: Physical access control for corporate campuses, universities, or government facilities requiring role-based entry permissions. IC Role / Device Role / Timing Role: Application-level authentication with multiple key sets per access right enables dynamic permission revocation and hierarchical access tiers. Use Value: Supports fast key rolling and delegation of credential issuance without exposing master keys-critical for large-scale, distributed admin models. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar contactless multi-application IC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MF3D8200DA4/00J | Same 8 KB EEPROM and MOA4 package but 17 pF input capacitance instead of 70 pF | Better suited for standard antenna geometries; less tolerant of miniaturized or constrained-space layouts | Select when antenna design allows lower capacitance coupling and cost-sensitive deployment is prioritized |
| MF3DH4200DA4/00J | Identical 70 pF input capacitance and MOA4 package, but only 4 KB EEPROM capacity | Reduced application count and file depth; insufficient for complex multi-service deployments requiring >4 KB persistent storage | Choose for simpler, single-purpose credentials where memory headroom and bill-of-materials cost are primary constraints |
Compared with MF3DH8200DA4/00J, MF3D8200DA4/00J trades higher antenna design flexibility for reduced physical-layer robustness in compact form factors, while MF3DH4200DA4/00J retains the same RF coupling advantage but constrains application scalability due to halved memory capacity.
Availability
MF3DH8200DA4/00J is available at Aetrix Electronics and suitable for secure public transport ticketing, smart city mobility cards, and micro-payment systems requiring stable component supply, long-term lifecycle assurance, and certified cryptographic functionality.
Supply support for MF3DH8200DA4/00J includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and identification markets, with over 30 years of RFID and smart card IC innovation.
The MIFARE DESFire EV2 product line-of which MF3DH8200DA4/00J is a member-is engineered for high-assurance, multi-application contactless systems in transportation, access control, and digital identity applications.
FAQ
What security certifications apply to MF3DH8200DA4/00J?
MF3DH8200DA4/00J holds Common Criteria EAL5+ certification for both hardware and software components, validating its resistance to side-channel, fault injection, and logical attacks. This certification level matches those required for banking cards and e-passports. The MF3DH8200DA4/00J also supports optional Random ID mode and Originality Check to prevent cloning and ensure genuine NXP silicon.
How does the 70 pF input capacitance of MF3DH8200DA4/00J affect antenna design?
The 70 pF input capacitance of MF3DH8200DA4/00J is specifically optimized for compact or miniaturized antenna layouts-such as thin smart cards, wearables, or embedded modules-where parasitic capacitance limits achievable read range with standard 17 pF devices. This higher capacitance reduces external tuning component count and improves impedance matching stability across manufacturing tolerances. MF3DH8200DA4/00J maintains full functional equivalence to 17 pF variants except for this RF interface parameter.
Is MF3DH8200DA4/00J backward compatible with existing MIFARE DESFire EV1 infrastructure?
Yes, MF3DH8200DA4/00J operates in default delivery configuration as a MIFARE DESFire EV1 device, supporting all EV1 commands, file structures, and cryptographic modes (2TDEA, 3TDEA, AES). New EV2 features-including Transaction MAC, MIsmartApp, and Proximity Check-require explicit activation via dedicated commands. No reader firmware changes are needed for basic interoperability, though leveraging EV2 enhancements requires updated host application logic.
What file types does MF3DH8200DA4/00J support, and how do they differ in use?
MF3DH8200DA4/00J supports six file types: Standard Data, Backup Data, Value, Linear Record, Cyclic Record, and Transaction MAC. Standard and Backup Data files provide general-purpose storage with optional rollback; Value files enable atomic increment/decrement operations; Linear and Cyclic Record files support sequential logging with overflow handling; and the Transaction MAC file generates cryptographic signatures for each transaction. All file types except Transaction MAC allow user-defined size at creation time.
Can MF3DH8200DA4/00J be used in mobile NFC environments?
Yes, MF3DH8200DA4/00J is fully interoperable with standard NFC Forum–compliant readers and smartphones supporting ISO/IEC 14443A. Its support for ISO/IEC 7816-4 APDU wrappers enables seamless integration with mobile wallet platforms and host-card-emulation (HCE) backends. The MF3DH8200DA4/00J also supports configurable ATS parameters and Random ID mode-both critical for privacy-preserving mobile interactions.
MF3DH8200DA4/00J Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- MOA4, Smart Card Module
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Type:
- RFID Reader
- Frequency:
- 13.56MHz
- Standards:
- ISO 14443
- Interface:
- -
- Voltage - Supply:
- -
- Operating Temperature:
- -25°C ~ 75°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PLLMC
MF3DH8200DA4/00J FAQ
1.How can I place an order for MF3DH8200DA4/00J through Aetrix?
Please submit a Request for Quotation (RFQ) for MF3DH8200DA4/00J on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MF3DH8200DA4/00J reliable?
The price and inventory of MF3DH8200DA4/00J are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MF3DH8200DA4/00J is usually 5 days.
3.What payment methods are accepted for MF3DH8200DA4/00J?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MF3DH8200DA4/00J transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MF3DH8200DA4/00J?
MF3DH8200DA4/00J orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MF3DH8200DA4/00J order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MF3DH8200DA4/00J?
For technical support, including MF3DH8200DA4/00J datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MF3DH8200DA4/00J requirements.
6.How does Aetrix verify that MF3DH8200DA4/00J is sourced from the original manufacturer or authorized distributors?
All MF3DH8200DA4/00J products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MF3DH8200DA4/00J meets industry standards.
7.What is the process for return or replacement of MF3DH8200DA4/00J?
All MF3DH8200DA4/00J units undergo pre-shipment inspection (PSI). If there is an issue with MF3DH8200DA4/00J, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MF3DH8200DA4/00J part is unused and in its original packaging.
Return procedure for MF3DH8200DA4/00J:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MF3DH8200DA4/00J Tags
-
SL2S2602FTBX
NXP Semiconductors
-
ST25DV04K-IER6S3
STMicroelectronics
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ST25DV04K-IER6C3
STMicroelectronics
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LXMSJZNCMD-217
Murata Electronics
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NT3H2111W0FTTJ
NXP Semiconductors
-
NT3H2111W0FHKH
NXP Semiconductors
-
M24LR04E-RMC6T/2
STMicroelectronics
-
ST25DV04KC-JF6D3
STMicroelectronics
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ST25DV64KC-IE6S3
STMicroelectronics
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ST25DV64K-IER6T3
STMicroelectronics
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NT3H2211W0FTTJ
NXP Semiconductors
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NT3H2211W0FHKH
NXP Semiconductors
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