NXP Semiconductors MF3DH8200DA6/00J
- Part No.:
- MF3DH8200DA6/00J
- Manufacturer:
- NXP Semiconductors
- Category:
- RFID, RF Access, Monitoring ICs
- Package:
- MOB6, Smart Card Module
- Datasheet:
-
MF3DH8200DA6/00J.pdf
- Description:
- IC RFID READER 13.56MHZ PLLMC
- Quantity:
- Payment:

- Shipping:

Inventory:2,878
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Product details
Overview
MF3DH8200DA6/00J from NXP Semiconductors is a contactless multi-application IC compliant with ISO/IEC 14443A, featuring 8 KB EEPROM, 70 pF input capacitance, Common Criteria EAL5+ security certification, and support for AES-128 and 3DES cryptographic engines. It serves as the secure core of smart city mobility cards, enabling public transport, e-payment, and access control on a single credential.
For engineers reviewing the MF3DH8200DA6/00J datasheet, MF3DH8200DA6/00J pinout, MF3DH8200DA6/00J application, or MF3DH8200DA6/00J equivalent, key selection considerations include its 70 pF high-input-capacitance variant optimized for small-form-factor inlays, EV2-specific Transaction MAC file support, MIsmartApp delegated management, and backward compatibility with MIFARE DESFire EV1 and D40 systems.
Technical Context
The MF3DH8200DA6/00J implements a dedicated 32-bit CPU with hardware-accelerated AES-128 and triple-DES cryptographic engines, integrated TRNG, and active shielding sensors (glitch, voltage, temperature). Its memory management unit supports dynamic application creation with up to 32 files per application across unlimited applications, using six file types including Transaction MAC.
It operates at 13.56 MHz with configurable frame size (FSCI) supporting up to 256-byte transfer buffers for 16/32 KB variants (128 bytes for 2/4/8 KB), and features Proximity Check and Originality Check to counter relay attacks and verify genuine NXP silicon - both enabled at the firmware level without host intervention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Size | 8 KB EEPROM - sufficient for ≥20 full transit applications plus loyalty, access, and micro-payment profiles with backup-enabled files. |
| Input Capacitance | 70 pF (typical) - enables reliable RF coupling in compact inlays and thin smart cards where antenna area is constrained. |
| Security Certification | Common Criteria EAL5+ (HW & SW) - validated assurance level matching banking cards and e-passports for high-trust deployments. |
| Cryptographic Engines | Hardware AES-128 + 3DES (56/112/168-bit keys) - enables fast, low-power mutual authentication and encrypted RF channel with CMAC integrity. |
| Data Transfer Rate | Up to 848 kbit/s - reduces transaction time to <150 ms for full-value top-up or multi-application selection in high-throughput gates. |
| File System | 6 file types (incl. Transaction MAC) + automatic anti-tear - guarantees atomic updates across multiple files during power loss or field removal. |
| UID | 7-byte fixed UID + optional Random ID - supports privacy-preserving card selection while maintaining traceability for lifecycle management. |
Pinout & Package
MF3DH8200DA6/00J is supplied in MOB6 plastic leadless module carrier package (SOT500-3), designed for flip-chip bonding onto antenna substrates. This is a contactless IC with no electrical pins; RF coupling occurs via integrated coil interface terminals (RFI, RFO) internal to the die. No external pin assignment applies - device connects solely through electromagnetic induction to reader antennas.
Key Features
| Feature | Design Value |
|---|---|
| Transaction MAC File | Generates cryptographically signed transaction logs on-card - provides verifiable audit trail for backend reconciliation without exposing keys or raw data. |
| MIsmartApp Delegation | Enables third-party application owners to manage their own AID space and keys - eliminates PICC owner dependency for service rollout and scaling. |
| Virtual Card Architecture | Supports multiple logical cards on one physical device with independent selection - allows citizen ID, student ID, and corporate badge to coexist with privacy isolation. |
| Proximity Check | Detects abnormal RF field rise time to block relay attacks - requires no reader-side changes and operates autonomously during every session. |
| Originality Check | Validates NXP-manufactured silicon via embedded signature - prevents counterfeit ICs from entering secure infrastructure without altering application logic. |
Applications
| Public Transport Ticketing | Smart City Mobility Card |
|---|---|
Use Scenario: Contactless tap-in/tap-out at metro gates and bus validators with balance deduction and trip history logging. IC Role / Device Role / Timing Role: Secure credential storage and cryptographic transaction engine - performs mutual authentication, value file update, and Transaction MAC generation within <120 ms. Use Value: Enables offline fare calculation and atomic balance updates even during network outages, backed by EAL5+ certified tamper resistance. | Use Scenario: Single card used for bike sharing unlock, museum entry, municipal parking payment, and library access. IC Role / Device Role / Timing Role: Multi-application runtime environment - isolates each service's keys, files, and access rights while sharing common UID and RF interface. Use Value: Eliminates need for separate credentials; supports concurrent application selection via Virtual Card Architecture and privacy-preserving Random ID. |
| Secure Access Management | Micro-Payment & Loyalty |
Use Scenario: Physical access to office buildings, data centers, and restricted zones using role-based permissions. IC Role / Device Role / Timing Role: Cryptographic identity token - validates user privileges via application-level AES authentication and enforces file-level access control policies. Use Value: Prevents credential cloning and privilege escalation; supports dynamic key rolling and delegated administration via MIsmartApp. | Use Scenario: Tap-to-pay at vending machines, cafés, and retail kiosks with real-time balance sync and merchant-specific loyalty points. IC Role / Device Role / Timing Role: Offline e-wallet controller - stores encrypted value files, computes CMAC for transaction integrity, and signs receipts with Transaction MAC. Use Value: Enables fully offline transactions with zero reliance on cloud connectivity; backend verification uses on-card MAC signatures for fraud detection. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar contactless multi-application IC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MF3D8200DA6/01 | Same MOB6 package and 8 KB memory, but 17 pF input capacitance - requires larger antenna or higher reader field strength for reliable coupling. | Better suited for standard-size cards or thicker laminates where antenna geometry permits lower capacitance tuning. | Select MF3D8200DA6/01 when antenna design supports 17 pF resonance and form factor allows larger loop area. |
| MF3DH4200DA6/01 | Same 70 pF high-capacitance variant and MOB6 package, but only 4 KB EEPROM - limits total application count and file depth. | Appropriate for single-service deployments (e.g., access-only or transit-only) with minimal file overhead and no multi-VC requirements. | Choose MF3DH4200DA6/01 when memory demand is ≤4 KB and cost sensitivity outweighs future scalability needs. |
Compared with MF3DH8200DA6/00J, MF3D8200DA6/01 trades coupling robustness for broader antenna design tolerance, while MF3DH4200DA6/01 reduces memory headroom and eliminates support for complex multi-VC or Transaction MAC–heavy use cases - making MF3DH8200DA6/00J the optimal choice for scalable, privacy-aware smart city credential platforms.
Availability
MF3DH8200DA6/00J is available at Aetrix Electronics and suitable for secure public transport ticketing, smart city mobility credentialing, and micro-payment system deployments requiring stable component supply, long-term lifecycle assurance, and CC EAL5+-certified security.
Supply support for MF3DH8200DA6/00J includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, IoT, and identification markets, with leadership in contactless ICs and NFC technology.
The MF3DH8200DA6/00J belongs to the MIFARE DESFire EV2 product line - engineered specifically for high-assurance, multi-application contactless systems in smart cities, transit, and secure access, where cryptographic agility, memory flexibility, and anti-counterfeiting are mandatory.
FAQ
What security certifications does the MF3DH8200DA6/00J hold?
The MF3DH8200DA6/00J is certified to Common Criteria EAL5+ for both hardware and software, matching the assurance level required for banking cards and electronic passports. This certification covers its cryptographic engines (AES-128, 3DES), memory protection mechanisms, anti-tampering sensors, and secure messaging protocols - all verified under formal evaluation. The MF3DH8200DA6/00J also supports ISO/IEC 7816-4 APDU commands and mutual three-pass authentication, ensuring interoperability with standards-compliant readers and backend systems.
How does the 70 pF input capacitance of MF3DH8200DA6/00J affect antenna design?
The 70 pF input capacitance of MF3DH8200DA6/00J is optimized for compact inlays and thin smart cards where antenna loop area is limited. It lowers the resonant frequency shift caused by substrate parasitics, allowing stable operation with smaller antennas or thinner laminates. Unlike 17 pF variants, this high-capacitance version maintains reliable coupling at shorter read ranges without requiring antenna retuning - critical for wearable credentials, hybrid paper-plastic tickets, and embedded modules in space-constrained devices. The MF3DH8200DA6/00J achieves this while retaining full protocol compliance and performance.
Can MF3DH8200DA6/00J support multiple independent applications simultaneously?
Yes, the MF3DH8200DA6/00J supports unlimited applications, each with up to 32 files of six types (Standard Data, Backup Data, Value, Linear/Cyclic Record, and Transaction MAC). Applications are isolated by 3-byte AIDs and dedicated key sets, preventing cross-access unless explicitly authorized. Its flexible file system allows dynamic creation during personalization or in-field provisioning, and MIsmartApp enables delegated management so third parties can deploy and update their own applications without PICC owner involvement - all enforced by hardware-enforced memory protection and cryptographic boundaries within the MF3DH8200DA6/00J.
What distinguishes MF3DH8200DA6/00J from earlier MIFARE DESFire generations?
The MF3DH8200DA6/00J introduces EV2-specific capabilities absent in EV1 and D40: Transaction MAC file for auditable transaction signing, Proximity Check to detect relay attacks, Originality Check for NXP silicon validation, MIsmartApp for delegated application management, and Virtual Card Architecture for privacy-preserving multi-VC selection. It also extends buffer size (128/256 bytes), adds multiple key sets per application with fast rolling, and supports AES-based EV2 Secure Messaging - while maintaining full backward compatibility with EV1 and D40 command sets and security modes for seamless infrastructure migration.
Is MF3DH8200DA6/00J compatible with existing MIFARE DESFire EV1 infrastructure?
Yes, MF3DH8200DA6/00J operates in default delivery configuration as a MIFARE DESFire EV1 device, supporting all EV1 commands, file structures, and cryptographic modes (2TDEA, 3TDEA, AES). New EV2 features - such as Transaction MAC, MIsmartApp, and Proximity Check - require explicit activation via specific commands and do not interfere with legacy operation. This ensures drop-in replacement capability for system upgrades without reader or middleware changes, while allowing phased adoption of advanced functionality. The MF3DH8200DA6/00J thus delivers immediate compatibility and future-proof extensibility.
MF3DH8200DA6/00J Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- MOB6, Smart Card Module
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Type:
- RFID Reader
- Frequency:
- 13.56MHz
- Standards:
- ISO 14443
- Interface:
- -
- Voltage - Supply:
- -
- Operating Temperature:
- -25°C ~ 75°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PLLMC
MF3DH8200DA6/00J FAQ
1.How can I place an order for MF3DH8200DA6/00J through Aetrix?
Please submit a Request for Quotation (RFQ) for MF3DH8200DA6/00J on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MF3DH8200DA6/00J reliable?
The price and inventory of MF3DH8200DA6/00J are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MF3DH8200DA6/00J is usually 5 days.
3.What payment methods are accepted for MF3DH8200DA6/00J?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MF3DH8200DA6/00J transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MF3DH8200DA6/00J?
MF3DH8200DA6/00J orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MF3DH8200DA6/00J order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MF3DH8200DA6/00J?
For technical support, including MF3DH8200DA6/00J datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MF3DH8200DA6/00J requirements.
6.How does Aetrix verify that MF3DH8200DA6/00J is sourced from the original manufacturer or authorized distributors?
All MF3DH8200DA6/00J products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MF3DH8200DA6/00J meets industry standards.
7.What is the process for return or replacement of MF3DH8200DA6/00J?
All MF3DH8200DA6/00J units undergo pre-shipment inspection (PSI). If there is an issue with MF3DH8200DA6/00J, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MF3DH8200DA6/00J part is unused and in its original packaging.
Return procedure for MF3DH8200DA6/00J:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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