NXP Semiconductors MF3DH8201DUD/00V
- Part No.:
- MF3DH8201DUD/00V
- Manufacturer:
- NXP Semiconductors
- Category:
- RFID, RF Access, Monitoring ICs
- Package:
- Die
- Datasheet:
-
MF3DH8201DUD/00V.pdf
- Description:
- IC RFID READER 13.56MHZ DIE
- Quantity:
- Payment:

- Shipping:

Inventory:2,540
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Product details
Overview
MF3DH8201DUD/00V from NXP Semiconductors is a contactless multi-application IC compliant with ISO/IEC 14443A, featuring 8 KB EEPROM, 70 pF input capacitance for small-form-factor card designs, Common Criteria EAL5+ security certification, and support for AES-128 and 3DES cryptographic engines. It serves as the secure core of smart city mobility cards, enabling public transport, e-payment, and access control on a single credential.
For engineers reviewing the MF3DH8201DUD/00V datasheet, MF3DH8201DUD/00V pinout, MF3DH8201DUD/00V application, or MF3DH8201DUD/00V equivalent, key selection considerations include its high-input-capacitance (70 pF) wafer form factor, EV2-specific Transaction MAC and MIsmartApp features, backward compatibility with MIFARE DESFire EV1/D40, and ISO/IEC 7816-4 APDU interoperability with NFC readers.
Technical Context
The MF3DH8201DUD/00V implements a dedicated ISO/IEC 14443A RF interface with configurable FSCI supporting up to 128-byte frames (256 bytes for larger memory variants), operates at 13.56 MHz, and delivers data rates up to 848 kbit/s. Its on-chip oscillator, rectifier, and voltage regulator enable battery-free operation powered solely by reader field coupling.
Security architecture includes mutual three-pass authentication, hardware-accelerated AES-128 and 3DES crypto engines, 8-byte CMAC for data integrity, and optional Random ID generation. The file system supports unlimited applications, each with up to 32 files across six types-including Transaction MAC-and enforces application-level isolation via per-application key sets and access rights.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory capacity | 8 KB EEPROM - sufficient for multiple independent applications (e.g., transit + loyalty + access) with full file structure flexibility |
| Input capacitance | 70 pF (typical) - optimized for compact antenna designs in thin cards or wearables without tuning compromise |
| Cryptographic engines | AES-128 and 3DES hardware acceleration - enables fast, standards-compliant secure messaging (EV2 mode) and backward compatibility |
| Security certification | Common Criteria EAL5+ (HW & SW) - validated assurance level matching banking cards and e-passports |
| Data retention | 25 years - ensures long-term reliability in deployed credentials without memory degradation |
| Write endurance | 500,000 cycles - supports frequent balance updates in micro-payment or transit reload scenarios |
| RF data rate | Up to 848 kbit/s - reduces transaction time in high-throughput environments like metro gates |
Pinout & Package
MF3DH8201DUD/00V is supplied in FFC (Film Frame Carrier) wafer format - an unpackaged die on tape-and-reel, intended for embedding into smart card laminates or inlays. No discrete pins or terminals are present; electrical connection is made via wire bonding to antenna coil pads during card manufacturing. Input capacitance (70 pF) is intrinsic to the die's RF interface design and defines antenna tuning requirements.
Key Features
| Feature | Design Value |
|---|---|
| Transaction MAC file type | Generates cryptographically signed transaction proofs on-card for backend reconciliation - eliminates need for external MAC calculation |
| MIsmartApp (Delegated Application Management) | Enables third-party application owners to create, manage, and update applications without PICC master key exposure - critical for multi-operator smart city deployments |
| Multiple Key Sets per application | Supports up to 16 key versions with fast rolling mechanism - allows seamless key rotation without service interruption or card replacement |
| Proximity Check | Detects relay attacks by measuring RF signal propagation delay - prevents unauthorized remote access to card data |
| Virtual Card Architecture | Enables privacy-preserving card selection across multiple logical cards on one physical device - essential for citizen ID with segregated service domains |
Applications
| Public Transport Ticketing | Secure Campus Access |
|---|---|
Use Scenario: Contactless fare validation at bus/metro gates with real-time balance deduction and trip history logging. IC Role / Device Role / Timing Role: Secure multi-application credential storing encrypted transit keys, value files, and linear record files for journey logs. Use Value: Single-card support for zone-based pricing, daily caps, and cross-operator transfers - enabled by application isolation and Transaction MAC integrity. |
Use Scenario: Multi-door building access with role-based permissions (staff, student, contractor) and audit trail generation. IC Role / Device Role / Timing Role: Trusted identity carrier with separate applications for physical access, printing services, and cafeteria payments - each secured by distinct key sets. Use Value: Eliminates need for multiple badges; Proximity Check prevents relay-based tailgating; Originality Check ensures only genuine NXP devices enroll. |
| Citywide Loyalty & Micro-Payment | Event & Venue Ticketing |
Use Scenario: Tap-to-pay at municipal parking meters, vending machines, and local merchants using closed-loop e-wallet. IC Role / Device Role / Timing Role: Secure value file storage with automatic anti-tear backup - guarantees atomic balance updates even during power loss. Use Value: 500,000 write cycles and 25-year data retention ensure durability across years of daily micro-transactions. |
Use Scenario: Entry validation at stadiums, museums, and festivals with dynamic ticket status (used/voided/resold). IC Role / Device Role / Timing Role: Tamper-resistant credential storing encrypted event AID, seat assignment, and entry timestamp in cyclic record file. Use Value: Transaction MAC provides irrefutable proof of entry time and location - critical for fraud prevention and capacity management. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar contactless multi-application IC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MF3D8201DUD/01 | Same 8 KB memory and FFC package, but 17 pF input capacitance - requires larger antenna area or different tuning. | Better suited for standard-thickness PVC cards where antenna size permits lower capacitance. | Select MF3D8201DUD/01 when antenna geometry supports 17 pF; choose MF3DH8201DUD/00V for ultra-thin or wearable form factors demanding 70 pF. |
| MF3DH4201DUD/01 | Identical 70 pF input capacitance and FFC package, but 4 KB EEPROM - halved memory capacity limits number of concurrent applications. | Appropriate for single-purpose credentials (e.g., access-only) where cost sensitivity outweighs multi-application flexibility. | Choose MF3DH4201DUD/01 only if application count and file depth requirements fit within 4 KB; MF3DH8201DUD/00V provides headroom for future feature expansion. |
Compared with MF3D8201DUD/01, MF3DH8201DUD/00V enables smaller antennas without sacrificing performance; compared with MF3DH4201DUD/01, it doubles available application space while retaining identical mechanical integration and security features - making it the optimal choice for next-generation smart city credentials requiring scalability and miniaturization.
Availability
MF3DH8201DUD/00V is available at Aetrix Electronics and suitable for secure public transport ticketing, smart city mobility cards, and multi-service access systems requiring stable component supply, long lifecycle support, and certified security compliance.
Supply support for MF3DH8201DUD/00V includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, IoT, and identification markets, with leadership in contactless technology since the introduction of MIFARE.
The MF3DH8201DUD/00V belongs to the MIFARE DESFire EV2 product line - engineered specifically for high-assurance, multi-application contactless systems in smart cities, transportation, and secure access where EAL5+ certification and flexible application management are mandatory.
FAQ
What is the primary function of the MF3DH8201DUD/00V in a smart card system?
The MF3DH8201DUD/00V serves as a secure, multi-application contactless IC embedded in smart cards or inlays. It stores and manages isolated applications - such as transit tickets, payment wallets, and access credentials - using hardware-accelerated AES-128/3DES cryptography, Transaction MAC, and application-level key management. Its 8 KB EEPROM and 70 pF input capacitance make MF3DH8201DUD/00V ideal for compact, high-security credentials deployed in public infrastructure.
How does the 70 pF input capacitance of the MF3DH8201DUD/00V affect antenna design?
The 70 pF input capacitance of the MF3DH8201DUD/00V is specifically optimized for small-form-factor antennas used in thin cards, wearables, or hybrid media. It reduces required antenna loop area and simplifies impedance matching compared to standard 17 pF variants, enabling reliable operation at 13.56 MHz with shorter read ranges - a trade-off accepted for space-constrained deployments. Antenna tuning must account for this fixed capacitance to maintain resonance and coupling efficiency.
Is the MF3DH8201DUD/00V compatible with existing MIFARE DESFire EV1 infrastructure?
Yes, the MF3DH8201DUD/00V operates in backward-compatible mode with MIFARE DESFire EV1 and D40 systems out-of-the-box. It supports legacy commands, 2TDEA/3TDEA crypto, and D40/EV1 secure messaging protocols. Full EV2 features - including Transaction MAC, MIsmartApp, and Proximity Check - require explicit activation via new commands and updated reader firmware, ensuring seamless migration without infrastructure overhaul.
What security certifications apply to the MF3DH8201DUD/00V?
The MF3DH8201DUD/00V holds Common Criteria EAL5+ certification for both hardware and software - the highest publicly available assurance level for smart card ICs, equivalent to that required for banking cards and electronic passports. This certification validates resistance to side-channel attacks, fault injection, and logical vulnerabilities. Additional built-in protections include hardware exception sensors, self-securing file system, and Originality Check to verify genuine NXP silicon.
Can the MF3DH8201DUD/00V support ISO/IEC 7816-4 APDU commands?
Yes, the MF3DH8201DUD/00V fully supports ISO/IEC 7816-4 APDU command structure and file system semantics, including SELECT FILE (INS A4), READ BINARY (B0), UPDATE BINARY (D6), READ RECORDS (B2), APPEND RECORD (E2), GET CHALLENGE (84), INTERNAL AUTHENTICATE (88), and EXTERNAL AUTHENTICATE (82). This enables interoperability with standard NFC readers and middleware designed for Java Card or other ISO-compliant platforms - extending MF3DH8201DUD/00V deployment beyond proprietary MIFARE ecosystems.
MF3DH8201DUD/00V Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- Die
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Type:
- RFID Reader
- Frequency:
- 13.56MHz
- Standards:
- ISO 14443
- Interface:
- -
- Voltage - Supply:
- -
- Operating Temperature:
- -25°C ~ 75°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- Die
MF3DH8201DUD/00V FAQ
1.How can I place an order for MF3DH8201DUD/00V through Aetrix?
Please submit a Request for Quotation (RFQ) for MF3DH8201DUD/00V on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MF3DH8201DUD/00V reliable?
The price and inventory of MF3DH8201DUD/00V are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MF3DH8201DUD/00V is usually 5 days.
3.What payment methods are accepted for MF3DH8201DUD/00V?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MF3DH8201DUD/00V transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MF3DH8201DUD/00V?
MF3DH8201DUD/00V orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MF3DH8201DUD/00V order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MF3DH8201DUD/00V?
For technical support, including MF3DH8201DUD/00V datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MF3DH8201DUD/00V requirements.
6.How does Aetrix verify that MF3DH8201DUD/00V is sourced from the original manufacturer or authorized distributors?
All MF3DH8201DUD/00V products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MF3DH8201DUD/00V meets industry standards.
7.What is the process for return or replacement of MF3DH8201DUD/00V?
All MF3DH8201DUD/00V units undergo pre-shipment inspection (PSI). If there is an issue with MF3DH8201DUD/00V, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MF3DH8201DUD/00V part is unused and in its original packaging.
Return procedure for MF3DH8201DUD/00V:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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