NXP Semiconductors MF3DH8300DA4/00J

Overview

MF3DH8300DA4/00 from NXP Semiconductors is a contactless multi-application IC compliant with ISO/IEC 14443A, featuring 8 kB non-volatile memory, 70 pF input capacitance, Common Criteria EAL5+ security certification, and support for AES-128 and 3DES cryptographic engines. It serves as the secure transaction core in smart city mobility cards, enabling concurrent public transport, e-payment, and access control on a single credential.

For engineers reviewing the MF3DH8300DA4/00 datasheet, MF3DH8300DA4/00 pinout, MF3DH8300DA4/00 application, or MF3DH8300DA4/00 equivalent, key selection considerations include its 70 pF high-input-capacitance variant optimized for small-form-factor antenna designs, EV3-specific Transaction MAC and Proximity Check features, and backward compatibility with MIFARE DESFire EV2/EV1 infrastructure.

Technical Context

The MF3DH8300DA4/00 implements a dedicated ISO/IEC 14443-4 RF interface with configurable FSCI up to 256 bytes, supporting data rates of 106–848 kbit/s and low Hmin operation for extended read range. Its on-chip analog front-end includes voltage, temperature, light, and glitch sensors for tamper resistance.

It executes mutual three-pass authentication using hardware-accelerated AES-128 or 3DES, enforces file-level access rights via up to 14 application keys and multiple key sets per application, and delivers transaction integrity through automatic anti-tear mechanisms and a dedicated Transaction Timer to prevent Man-in-the-Middle attacks.

Key Specifications

Pinout & Package

MF3DH8300DA4/00 is supplied in MOA4 plastic leadless module carrier package (SOT500-2), designed for flip-chip bonding onto antenna substrates. The device has no external pins; it interfaces exclusively via its integrated RF coil coupling structure and requires no wire bonding or soldered terminals.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar contactless multi-application IC applications.

Compared with MF3DH8300DA4/00, MF3D8300DA4/00 trades antenna flexibility for broader legacy compatibility, while MF3DH4300DA4/00 sacrifices application headroom for cost efficiency - making MF3DH8300DA4/00 the optimal choice for next-generation compact, multi-service credentials requiring maximum security and extensibility.

Availability

MF3DH8300DA4/00 is available at Aetrix Electronics and suitable for secure public transport ticketing, smart city credentialing, and micro-payment systems requiring stable component supply, long-term lifecycle assurance, and certified security compliance.

Supply support for MF3DH8300DA4/00 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and identification markets, with leadership in contactless IC technology since the introduction of MIFARE.

MF3DH8300DA4/00 belongs to the MIFARE DESFire EV3 product line, engineered specifically for high-assurance, multi-application contactless systems in smart cities, transit, and secure access - building on EAL5+ certification and open-standard interoperability.

FAQ

What security certifications does MF3DH8300DA4/00 hold?

MF3DH8300DA4/00 holds Common Criteria EAL5+ certification for both hardware and software, validated against the highest assurance level required for banking cards and electronic passports. This covers its cryptographic engines, memory protection, tamper sensors, and secure boot process - all confirmed in the official NXP product short data sheet Rev. 3.1.

How does the 70 pF input capacitance of MF3DH8300DA4/00 impact antenna design?

The 70 pF input capacitance of MF3DH8300DA4/00 eliminates the need for external tuning capacitors in compact antenna layouts, enabling direct integration into thin cards, wearables, or metal-embedded credentials. This specification is explicitly defined in Table 2 of the MF3D(H)x3 datasheet and distinguishes MF3DH8300DA4/00 from 17 pF variants like MF3D8300DA4/00.

Is MF3DH8300DA4/00 compatible with existing MIFARE DESFire EV2 infrastructure?

Yes, MF3DH8300DA4/00 operates in default MIFARE DESFire EV2 backward-compatible mode and supports all EV2 commands, file structures, and secure messaging protocols. New EV3 features such as Transaction Timer and Proximity Check require explicit activation via dedicated commands - ensuring zero disruption to deployed readers and middleware.

What file types does MF3DH8300DA4/00 support and how are they applied?

MF3DH8300DA4/00 supports six file types: Standard Data, Backup Data, Value, Linear Record, Cyclic Record, and Transaction MAC. Each file's size and backup behavior is defined at creation time; the Transaction MAC file provides cryptographically signed proof of transaction integrity for backend reconciliation - a capability confirmed in Section 7.6 and Figure 3 of the datasheet.

Does MF3DH8300DA4/00 support NFC Forum Type 4 Tag functionality?

Yes, MF3DH8300DA4/00 is NFC Forum Type 4 Tag certified (Certificate ID 58652) and supports Secure Dynamic Messaging (SDM), which mirrors text into the NDEF message compatible with NTAG DNA. This enables interoperability with standard NFC smartphones for service provisioning and dynamic content updates - as stated in Section 2.1.6 of the product short data sheet.